Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Dynamic power dissipation formulation for application in dynamic programming buffer insertion algorithm

Buffer insertion is a very effective technique to reduce propagation delay in nano-metre VLSI interconnects. There are two techniques for buffer insertion which are: (1) closed-form solution and (2) dynamic programming. Buffer insertion algorithm using dynamic programming is more useful than the closed-form solution as it allows the use of multiple buffer types and it can be used in tree structured interconnects. As design dimension shrinks, more buffers are needed to improve timing performance. However, the buffer itself consumes power and it has been shown that power dissipation of buffers is significant. Although there are many buffer insertion algorithms that were able to optimize propagation delay with power constraint, most of them used the closed-form solution. Hence, in this paper, we present a formulation to compute dynamic power dissipation of buffers for application in dynamic programming buffer insertion algorithm. The proposed formulation allows dynamic power dissipation of buffers to be computed incrementally. The technique is validated by comparing the formulation with the standard closed-form dynamic power equation. The advantage of the proposed formulation is demonstrated through a series of experiments where it is applied in van Ginneken’s algorithm. The results show that the output of the proposed formulation is consistent with the standard closed-form formulation. Furthermore, it also suggests that the proposed formulation is able to compute dynamic power dissipation for buffer insertion algorithm with multiple buffer types

High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Scaling High-Performance Interconnect Architectures to Many-Core Systems.

The ever-increasing demand for performance scaling has made multi-core (2-8 cores) chips prevalent in today’s computing systems and foreshadows the shift toward many-core (10s- 100s of cores) chips in the near future. Although the potential performance gains from many-core systems remain appealing, the widespread adoption of these systems hinges on their ability to scale performance while simultaneously satisfying Quality-of-Service (QoS) and energy-efficiency constraints. This work makes the case that the interconnect for these many-core systems has a significant impact on the aforementioned scalability issues. The impact of interconnects on many-core systems is illustrated by observing that the degree of the interconnect has a signicant effect on system scalability and demonstrating that the architecture of high-radix, many-core systems are feasible, energy-efficient, and high-performance. The feasibility of high-radix crossbars for many-core systems is first shown through a new circuit-level building block called the Swizzle-Switch which can operate at frequencies up to 1.5GHz for 128-bit, radix-64 crossbars. This work then shows how a many-core system called the Swizzle-Switch Network (SSN) can use the Swizzle-Switch as the central building block for a flat crossbar interconnect. The SSN is shown to be advantageous to traditional Network-on-Chip (NoC) for systems up to 64 cores. The SSN performance by 21% relative to a Mesh while also providing a 25% energy savings over the Mesh. The Swizzle-Switch is also leveraged as a building block for high-radix NoC topologies that can support many-core architectures. The Swizzle-Switch-based Flattened Butterfly topology is demonstrated to provide a 15% speedup and 10% energy savings over the Mesh. Finally, the impact that 3D stacking technology has on many-core scalability is evaluated for bus and crossbar interconnects. A 3D-optimized Swizzle-Switch Network is able to leverage frequency gains to achieve a 15-28% speedup over a 2D-Swizzle-Switch Network when using memory- intensive benchmarks. Additionally, a bus-based 64-core architecture is shown to provide an average speedup of 49× over a baseline uniprocessor system when using 3D technology.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/93980/1/ksewell_1.pd

Multilayer Modeling and Design of Energy Managed Microsystems

Aggressive energy reduction is one of the key technological challenges that all segments of the semiconductor industry have encountered in the past few years. In addition, the notion of environmental awareness and designing “green” products is yet another major driver for ultra low energy design of electronic systems. Energy management is one of the unique solutions that can address the simultaneous requirements of high-performance, (ultra) low energy and greenness in many classes of computing systems; including high-performance, embedded and wireless. These considerations motivate the focus of this dissertation on the energy efficiency improvement of Energy Managed Microsystems (EMM or EM2). The aim is to maximize the energy efficiency and/or the operational lifetime of these systems. In this thesis we propose solutions that are applicable to many classes of computing systems including high-performance and mobile computing systems. These solutions contribute to make such technologies “greener”. The proposed solutions are multilayer, since they belong to, and may be applicable to, multiple design abstraction layers. The proposed solutions are orthogonal to each other, and if deployed simultaneously in a vertical system integration approach, when possible, the net benefit may be as large as the multiplication of the individual benefits. At high-level, this thesis initially focuses on the modeling and design of interconnections for EM2. For this purpose, a design flow has been proposed for interconnections in EM2. This flow allows designing interconnects with minimum energy requirements that meet all the considered performance objectives, in all specified system operating states. Later, models for energy performance estimation of EM2 are proposed. By energy performance, we refer to the improvements of energy savings of the computing platforms, obtained when some enhancements are applied to those platforms. These models are based on the components of the application profile. The adopted method is inspired by Amdahl’s law, which is driven by the fact that ‘energy’ is ‘additive’, as ‘time’ is ‘additive’. These models can be used for the design space exploration of EM2. The proposed models are high-level and therefore they are easy to use and show fair accuracy, 9.1% error on average, when compared to the results of the implemented benchmarks. Finally, models to estimate energy consumption of EM2 according to their “activity” are proposed. By “activity” we mean the rate at which EM2 perform a set of predefined application functions. Good estimations of energy requirements are very useful when designing and managing the EM2 activity, in order to extend their battery lifetime. The study of the proposed models on some Wireless Sensor Network (WSN) application benchmark confirms a fair accuracy for the energy estimation models, 3% error on average on the considered benchmarks

Exploiting level sensitive latches in wire pipelining

The present research presents procedures for exploitation of level sensitive latches in wire pipelining. The user gives a Steiner tree, having a signal source and set of destination or sinks, and the location in rectangular plane, capacitive load and required arrival time at each of the destinations. The user also defines a library of non-clocked (buffer) elements and clocked elements (flip-flop and latch), also known as synchronous elements. The first procedure performs concurrent repeater and synchronous element insertion in a bottom-up manner to find the minimum latency that may be achieved between the source and the destinations. The second procedure takes additional input (required latency) for each destination, derived from previous procedure, and finds the repeater and synchronous element assignments for all internal nodes of the Steiner tree, which minimize overall area used. These procedures utilize the latency and area advantages of latch based pipelining over flip-flop based pipelining. The second procedure suggests two methods to tackle the challenges that exist in a latch based design. The deferred delay padding technique is introduced, which removes the short path violations for latches with minimal extra cost