Reconfigurable Architectures for Wireless Systems: Design Exploration and Integration Challenges

Mobile devices are severely power and area limited due to battery capacity and system size. In many of these example systems, advanced features require computationally complex signal processing on high-speed data streams for enhanced networking capabilities. Thus, mapping high-level communication and networking algorithms to system architectures is a complex and challenging procedure. An important challenge is to characterize the area, time, and power requirements of these embedded system modules and to use this information effectively to determine the architecture of programmable, reconfigurable, and fixed-function modules. In this paper, we will focus on application examples in wireless networking which highlight these challenges in reconfigurable systems integration.Nokia CorporationTexas Instruments IncorporatedNational Science Foundatio

VLSI Architectures and Rapid Prototyping Testbeds for Wireless Systems

The rapid evolution of wireless access is creating an ever changing variety of standards for indoor and outdoor environments. The real-time processing demands of wireless data rates in excess of 100 Mbps is a challenging problem for architecture design and verification. In this paper, we consider current trends in VLSI architecture and in rapid prototyping testbeds to evaluate these systems. The key phases in multi-standard system design and prototyping include: Algorithm Mapping to Parallel Architectures – based on the real-time data and sampling rate and the resulting area, time and power complexity; Configurable Mappings and Design Exploration – based on heterogeneous architectures consisting of DSP, programmable application-specific instruction (ASIP) processors, and co-processors; and Verification and Testbed Integration – based on prototype implementation on programmable devices and integration with RF units.Nokia Foundation FellowshipNokia CorporationNational InstrumentsNational Science Foundatio

FPGAs in Industrial Control Applications

The aim of this paper is to review the state-of-the-art of Field Programmable Gate Array (FPGA) technologies and their contribution to industrial control applications. Authors start by addressing various research fields which can exploit the advantages of FPGAs. The features of these devices are then presented, followed by their corresponding design tools. To illustrate the benefits of using FPGAs in the case of complex control applications, a sensorless motor controller has been treated. This controller is based on the Extended Kalman Filter. Its development has been made according to a dedicated design methodology, which is also discussed. The use of FPGAs to implement artificial intelligence-based industrial controllers is then briefly reviewed. The final section presents two short case studies of Neural Network control systems designs targeting FPGAs

High-Level Design for Ultra-Fast Software Defined Radio Prototyping on Multi-Processors Heterogeneous Platforms

International audienceThe design of Software Defined Radio (SDR) equipments (terminals, base stations, etc.) is still very challenging. We propose here a design methodology for ultra-fast prototyping on heterogeneous platforms made of GPPs (General Purpose Processors), DSPs (Digital Signal Processors) and FPGAs (Field Programmable Gate Array). Lying on a component-based approach, the methodology mainly aims at automating as much as possible the design from an algorithmic validation to a multi-processing heterogeneous implementation. The proposed methodology is based on the SynDEx CAD design approach, which was originally dedicated to multi-GPPs networks. We show how this was changed so that it is made appropriate with an embedded context of DSP. The implication of FPGAs is then addressed and integrated in the design approach with very little restrictions. Apart from a manual HW/SW partitioning, all other operations may be kept automatic in a heterogeneous processing context. The targeted granularity of the components, which are to be assembled in the design flow, is roughly the same size as that of a FFT, a filter or a Viterbi decoder for instance. The re-use of third party or pre-developed IPs is a basis for this design approach. Thanks to the proposed design methodology it is possible to port "ultra" fast a radio application over several platforms. In addition, the proposed design methodology is not restricted to SDR equipment design, and can be useful for any real-time embedded heterogeneous design in a prototyping context

TANGO: Transparent heterogeneous hardware Architecture deployment for eNergy Gain in Operation

The paper is concerned with the issue of how software systems actually use Heterogeneous Parallel Architectures (HPAs), with the goal of optimizing power consumption on these resources. It argues the need for novel methods and tools to support software developers aiming to optimise power consumption resulting from designing, developing, deploying and running software on HPAs, while maintaining other quality aspects of software to adequate and agreed levels. To do so, a reference architecture to support energy efficiency at application construction, deployment, and operation is discussed, as well as its implementation and evaluation plans.Comment: Part of the Program Transformation for Programmability in Heterogeneous Architectures (PROHA) workshop, Barcelona, Spain, 12th March 2016, 7 pages, LaTeX, 3 PNG figure

Advanced Applications of Rapid Prototyping Technology in Modern Engineering

Rapid prototyping (RP) technology has been widely known and appreciated due to its flexible and customized manufacturing capabilities. The widely studied RP techniques include stereolithography apparatus (SLA), selective laser sintering (SLS), three-dimensional printing (3DP), fused deposition modeling (FDM), 3D plotting, solid ground curing (SGC), multiphase jet solidification (MJS), laminated object manufacturing (LOM). Different techniques are associated with different materials and/or processing principles and thus are devoted to specific applications. RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering. This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems

MISAT: Designing a Series of Powerful Small Satellites Based upon Micro Systems Technology

MISAT is a research and development cluster which will create a small satellite platform based on Micro Systems Technology (MST) aiming at innovative space as well as terrestrial applications. MISAT is part of the Dutch MicroNed program which has established a microsystems infrastructure to fully exploit the MST knowledge chain involving public and industrial partners alike. The cluster covers MST-related developments for the spacecraft bus and payload, as well as the satellite architecture. Particular emphasis is given to distributed systems in space to fully exploit the potential of miniaturization for future mission concepts. Examples of current developments are wireless sensor and actuator networks with plug and play characteristics, autonomous digital Sun sensors, re-configurable radio front ends with minimum power consumption, or micro-machined electrostatic accelerometer and gradiometer system for scientific research in fundamental physics as well as geophysics. As a result of MISAT, a first nano-satellite will be launched in 2007 to demonstrate the next generation of Sun sensors, power subsystems and satellite architecture technology. Rapid access to in-orbit technology demonstration and verification will be provided by a series of small satellites. This will include a formation flying mission, which will increasingly rely on MISAT technology to improve functionality and reduce size, mass and power for advanced technology demonstration and novel scientific applications.

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG