Energy challenges for ICT

The energy consumption from the expanding use of information and communications technology (ICT) is unsustainable with present drivers, and it will impact heavily on the future climate change. However, ICT devices have the potential to contribute signi - cantly to the reduction of CO2 emission and enhance resource e ciency in other sectors, e.g., transportation (through intelligent transportation and advanced driver assistance systems and self-driving vehicles), heating (through smart building control), and manu- facturing (through digital automation based on smart autonomous sensors). To address the energy sustainability of ICT and capture the full potential of ICT in resource e - ciency, a multidisciplinary ICT-energy community needs to be brought together cover- ing devices, microarchitectures, ultra large-scale integration (ULSI), high-performance computing (HPC), energy harvesting, energy storage, system design, embedded sys- tems, e cient electronics, static analysis, and computation. In this chapter, we introduce challenges and opportunities in this emerging eld and a common framework to strive towards energy-sustainable ICT

Design of TSV-sharing topologies for cost-effective 3D networks-on-chip

The Through-Silicon Via (TSV) technology has led to major breakthroughs in 3D stacking by providing higher speed and bandwidth, as well as lower power dissipation for the inter-layer communication. However, the current TSV fabrication suffers from a considerable area footprint and yield loss. Thus, it is necessary to restrict the number of TSVs in order to design cost-effective 3D on-chip networks. This critical issue can be addressed by clustering the network such that all of the routers within each cluster share a single TSV pillar for the vertical packet transmission. In some of the existing topologies, additional cluster routers are augmented into the mesh structure to handle the shared TSVs. However, they impose either performance degradation or power/area overhead to the system. Furthermore, the resulting architecture is no longer a mesh. In this paper, we redefine the clusters by replacing some routers in the mesh with the cluster routers, such that the mesh structure is preserved. The simulation results demonstrate a better equilibrium between performance and cost, using the proposed models

On-Line Dependability Enhancement of Multiprocessor SoCs by Resource Management

This paper describes a new approach towards dependable design of homogeneous multi-processor SoCs in an example satellite-navigation application. First, the NoC dependability is functionally verified via embedded software. Then the Xentium processor tiles are periodically verified via on-line self-testing techniques, by using a new IIP Dependability Manager. Based on the Dependability Manager results, faulty tiles are electronically excluded and replaced by fault-free spare tiles via on-line resource management. This integrated approach enables fast electronic fault detection/diagnosis and repair, and hence a high system availability. The dependability application runs in parallel with the actual application, resulting in a very dependable system. All parts have been verified by simulation

Quarc: a novel network-on-chip architecture

This paper introduces the Quarc NoC, a novel NoC architecture inspired by the Spidergon NoC. The Quarc scheme significantly outperforms the Spidergon NoC through balancing the traffic which is the result of the modifications applied to the topology and the routing elements.The proposed architecture is highly efficient in performing collective communication operations including broadcast and multicast. We present the topology, routing discipline and switch architecture for the Quarc NoC and demonstrate the performance with the results obtained from discrete event simulations

Quarc: a high-efficiency network on-chip architecture

The novel Quarc NoC architecture, inspired by the Spidergon scheme is introduced as a NoC architecture that is highly efficient in performing collective communication operations including broadcast and multicast. The efficiency of the Quarc architecture is achieved through balancing the traffic which is the result of the modifications applied to the topology and the routing elements of the Spidergon NoC. This paper provides an ASIC implementation of both architectures using UMCpsilas 0.13 mum CMOS technology and demonstrates an analysis and comparison of the cost and performance between the Quarc and the Spidergon NoCs

A performance model of communication in the quarc NoC

Networks on-chip (NoC) emerged as a promising communication medium for future MPSoC development. To serve this purpose, the NoCs have to be able to efficiently exchange all types of traffic including the collective communications at a reasonable cost. The Quarc NoC is introduced as a NOC which is highly efficient in performing collective communication operations such as broadcast and multicast. This paper presents an introduction to the Quarc scheme and an analytical model to compute the average message latency in the architecture. To validate the model we compare the model latency prediction against the results obtained from discrete-event simulations

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout