157 research outputs found

    Multi-scale data fusion for surface metrology

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    The major trends in manufacturing are miniaturization, convergence of the traditional research fields and creation of interdisciplinary research areas. These trends have resulted in the development of multi-scale models and multi-scale surfaces to optimize the performance. Multi-scale surfaces that exhibit specific properties at different scales for a specific purpose require multi-scale measurement and characterization. Researchers and instrument developers have developed instruments that are able to perform measurements at multiple scales but lack the much required multi- scale characterization capability. The primary focus of this research was to explore possible multi-scale data fusion strategies and options for surface metrology domain and to develop enabling software tools in order to obtain effective multi-scale surface characterization, maximizing fidelity while minimizing measurement cost and time. This research effort explored the fusion strategies for surface metrology domain and narrowed the focus on Discrete Wavelet Frame (DWF) based multi-scale decomposition. An optimized multi-scale data fusion strategy ‘FWR method’ was developed and was successfully demonstrated on both high aspect ratio surfaces and non-planar surfaces. It was demonstrated that the datum features can be effectively characterized at a lower resolution using one system (Vision CMM) and the actual features of interest could be characterized at a higher resolution using another system (Coherence Scanning Interferometer) with higher capability while minimizing the measurement time

    Annual Report, 2017-2018

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    Advanced Applications of Rapid Prototyping Technology in Modern Engineering

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    Rapid prototyping (RP) technology has been widely known and appreciated due to its flexible and customized manufacturing capabilities. The widely studied RP techniques include stereolithography apparatus (SLA), selective laser sintering (SLS), three-dimensional printing (3DP), fused deposition modeling (FDM), 3D plotting, solid ground curing (SGC), multiphase jet solidification (MJS), laminated object manufacturing (LOM). Different techniques are associated with different materials and/or processing principles and thus are devoted to specific applications. RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering. This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems

    Organic thin film transistors: integration challenges

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    This thesis considers some of the requirements and challenges in the eld of organic thin lm transistors (OTFTs), from the standpoint of large scale integration using low temperature plastic compatible processes. A combination of processes and materials for use in the fabrication of OTFTs is developed, yielding device performance comparable with the state of the art for bottom-contact, bottom-gate, organic small molecule thin lm transistors. High quality silicon nitride (SiNx) gate dielectric material is developed using plasma enhanced chemical vapour deposition (PECVD) at a low temperature (150 C) compatible with plastic substrates. A variety of high quality lms are developed, allowing an investigation into the impact of changes in SiNx composition on OTFT performance. Surface modi cation strategies on SiNx substrates are considered, leading to almost an order of magnitude enhancement in OTFT performance, suggesting a suitable device architecture for large scale integration, and exploitation of novel organic material properties. We then examine organic semiconductor nanowire devices, which have begun to emerge as a new and exciting class of device in recent years. This work explores the possibilities of combining traditional thin lm transistor fabrication techniques with novel organic nanowires and examines the resultant transistor device behaviour. Two-dimensional arrays of nanowire devices are analysed, demonstrating the suitability of devices for large area applications. The combination of a large area and plastic compatible, low temperature dielectric with well known organic semiconductors in thin lm devices suggests that the integration of novel organic nanowires could provide an exciting performance enhancement over traditional OTFT devices

    A NEW METHOD OF WAVELENGTH SCANNING INTERFEROMETRY FOR INSPECTING SURFACES WITH MULTI-SIDE HIGH-SLOPED FACETS

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    With the development of modern advanced manufacturing technologies, the requirements for ultra-precision structured surfaces are increasing rapidly for both high value-added products and scientific research. Examples of the components encompassing the structures include brightness enhancement film (BEF), optical gratings and so forth. Besides, specially designed structured surfaces, namely metamaterials can lead to specified desirable coherence, angular or spatial characteristics that the natural materials do not possess. This promising field attracts a large amount of funding and investments. However, owing to a lack of effective means of inspecting the structured surfaces, the manufacturing process is heavily reliant on the experience of fabrication operators adopting an expensive trial-and-error approach, resulting in high scrap rates up to 50-70% of the manufactured items. Therefore, overcoming this challenge becomes increasingly valuable. The thesis proposes a novel methodology to tackle this challenge by setting up an apparatus encompassing multiple measurement probes to attain the dataset for each facet of the structured surface and then blending the acquired datasets together, based on the relative location of the probes, which is achieved via the system calibration. The method relies on wavelength scanning interferometry (WSI), which can achieve areal measurement with axial resolutions approaching the nanometre without the requirement for the mechanical scanning of either the sample or optics, unlike comparable techniques such as coherence scanning interferometry (CSI). This lack of mechanical scanning opens up the possibility of using a multi-probe optics system to provide simultaneous measurement with multi adjacent fields of view. The thesis presents a proof-of-principle demonstration of a dual-probe wavelength scanning interferometry (DPWSI) system capable of measuring near-right-angle V-groove structures in a single measurement acquisition. The optical system comprises dual probes, with orthogonal measurement planes. For a given probe, a range of V-groove angles is measurable, limited by the acceptance angle of the objective lenses employed. This range can be expanded further by designing equivalent probe heads with varying angular separation. More complicated structured surfaces can be inspected by increasing the number of probes. The fringe analysis algorithms for WSI are discussed in detail, some improvements are proposed, and experimental validation is conducted. The scheme for calibrating the DPSWI system and obtaining the relative location between the probes to achieve the whole topography is implemented and presented in full. The appraisal of the DPWSI system is also carried out using a multi-step diamond-turned specimen and a sawtooth brightness enhancement film (BEF). The results showed that the proposed method could achieve the inspection of the near-right-angle V-groove structures with submicrometre scale vertical resolution and micrometre level lateral resolution
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