16 research outputs found

    Electro-thermal coupling analysis methodology for RF circuits

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    In this paper we present an electro-thermal coupling simulation technique for RF circuits. The proposed methodology takes advantage of well established tools for frequency translating circuits in order to significantly reduce the computational resources needed when frequencies of interest are separated by orders of magnitude.Postprint (published version

    Development of Robust Analog and Mixed-Signal Circuits in the Presence of Process- Voltage-Temperature Variations

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    Continued improvements of transceiver systems-on-a-chip play a key role in the advancement of mobile telecommunication products as well as wireless systems in biomedical and remote sensing applications. This dissertation addresses the problems of escalating CMOS process variability and system complexity that diminish the reliability and testability of integrated systems, especially relating to the analog and mixed-signal blocks. The proposed design techniques and circuit-level attributes are aligned with current built-in testing and self-calibration trends for integrated transceivers. In this work, the main focus is on enhancing the performances of analog and mixed-signal blocks with digitally adjustable elements as well as with automatic analog tuning circuits, which are experimentally applied to conventional blocks in the receiver path in order to demonstrate the concepts. The use of digitally controllable elements to compensate for variations is exemplified with two circuits. First, a distortion cancellation method for baseband operational transconductance amplifiers is proposed that enables a third-order intermodulation (IM3) improvement of up to 22dB. Fabricated in a 0.13µm CMOS process with 1.2V supply, a transconductance-capacitor lowpass filter with the linearized amplifiers has a measured IM3 below -70dB (with 0.2V peak-to-peak input signal) and 54.5dB dynamic range over its 195MHz bandwidth. The second circuit is a 3-bit two-step quantizer with adjustable reference levels, which was designed and fabricated in 0.18µm CMOS technology as part of a continuous-time SigmaDelta analog-to-digital converter system. With 5mV resolution at a 400MHz sampling frequency, the quantizer's static power dissipation is 24mW and its die area is 0.4mm^2. An alternative to electrical power detectors is introduced by outlining a strategy for built-in testing of analog circuits with on-chip temperature sensors. Comparisons of an amplifier's measurement results at 1GHz with the measured DC voltage output of an on-chip temperature sensor show that the amplifier's power dissipation can be monitored and its 1-dB compression point can be estimated with less than 1dB error. The sensor has a tunable sensitivity up to 200mV/mW, a power detection range measured up to 16mW, and it occupies a die area of 0.012mm^2 in standard 0.18µm CMOS technology. Finally, an analog calibration technique is discussed to lessen the mismatch between transistors in the differential high-frequency signal path of analog CMOS circuits. The proposed methodology involves auxiliary transistors that sense the existing mismatch as part of a feedback loop for error minimization. It was assessed by performing statistical Monte Carlo simulations of a differential amplifier and a double-balanced mixer designed in CMOS technologies

    Bandpass delta-sigma modulators for radio receivers

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    This thesis concerns discrete-time (DT) bandpass (BP) ΔΣ modulators targeted for intermediate frequency (IF) analog-to-digital (A/D) conversion in radio receivers. The receiver architecture adopted has to be capable of operating with different radio frequencies, channel bandwidths, and modulation techniques. This is necessary in order to achieve an extensive operating area and the possibility of utilizing a local mobile phone standard or a standard suitable for a specific service. The digital IF receiver is a good choice for a multi-mode and multi-band mobile phone receiver, because the signal demodulation and channel filtering are performed in the digital domain. This increases the flexibility of the receiver and relieves the design of the baseband part, but an A/D conversion with high dynamic range and low power dissipation is required. BP ΔΣ modulators are capable of converting a high-frequency narrow band signal and are therefore suitable for signal digitization in an IF receiver. First, the theory of BP ΔΣ modulators is introduced. It has been determined that resonators are the most critical circuit blocks in the implementation of a high performance BP ΔΣ modulator. Different DT resonator topologies are studied and a double-delay (DD) resonator is found to be the best candidate for a high quality resonator. A new DD switched-capacitor (SC) resonator structure has been designed. Furthermore, two evolution versions of the designed SC resonator are presented and their nonidealities are analyzed. The three designed DD SC resonator structures are a main point of the thesis, together with the experimental results. Five different DT BP ΔΣ modulator circuit structures have been implemented and measured. All three of the designed SC resonators are used in the implemented circuits. The experimental work consists of both single-bit and multi-bit structures, as well as both single-loop and cascade architectures. The circuits have been implemented with a 0.35 μm (Bi)CMOS technology and operate with a 3.0 V supply. The measured maximum signal-to-noise-and-distortion ratios (SNDRs) are 78 dB over 270 kHz (GSM), 75 dB over 1.25 MHz (IS-95), 69 dB over 1.762 MHz (DECT), and 48 dB over 3.84 MHz (WCDMA) bandwidths using a 60 MHz IF signal.reviewe

    GigaHertz Symposium 2010

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    Silicon Integrated Arrays: From Microwave to IR

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    Integrated chips have enabled realization and mass production of complex systems in a small form factor. Through process miniaturization many novel applications in silicon photonics and electronic systems have been enabled. In this thesis I have provided several examples of innovations that are only enabled by integration. I have also demonstrated how electronics and photonics circuits can complement each other to achieve a system with superior performance.</p

    Advanced Trends in Wireless Communications

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    Physical limitations on wireless communication channels impose huge challenges to reliable communication. Bandwidth limitations, propagation loss, noise and interference make the wireless channel a narrow pipe that does not readily accommodate rapid flow of data. Thus, researches aim to design systems that are suitable to operate in such channels, in order to have high performance quality of service. Also, the mobility of the communication systems requires further investigations to reduce the complexity and the power consumption of the receiver. This book aims to provide highlights of the current research in the field of wireless communications. The subjects discussed are very valuable to communication researchers rather than researchers in the wireless related areas. The book chapters cover a wide range of wireless communication topics

    Sensitivity degradation in a tri-band GSM BiCMOS direct-conversion receiver caused by transient substrate heating

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    An analysis of transient thermal substrate effects impairing the sensitivity of the DCS path in a tri-band GSM/DCS/PCS BiCMOS radio receiver is presented in this paper. A simple thermal model of the substrate is employed, enabling concurrent electrothermal circuit-substrate simulations within a standard analog circuit simulator. Simulation results obtained with this approach match very closely the measured data, and are used to predict the sensitivity of different circuit layout configurations to thermal gradients in the substrate. Following the guidelines suggested by these analyses, a redesigned version of the receiver displays a sensitivity improvement of 2 dB to 4 dB

    1-D broadside-radiating leaky-wave antenna based on a numerically synthesized impedance surface

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    A newly-developed deterministic numerical technique for the automated design of metasurface antennas is applied here for the first time to the design of a 1-D printed Leaky-Wave Antenna (LWA) for broadside radiation. The surface impedance synthesis process does not require any a priori knowledge on the impedance pattern, and starts from a mask constraint on the desired far-field and practical bounds on the unit cell impedance values. The designed reactance surface for broadside radiation exhibits a non conventional patterning; this highlights the merit of using an automated design process for a design well known to be challenging for analytical methods. The antenna is physically implemented with an array of metal strips with varying gap widths and simulation results show very good agreement with the predicted performance

    Beam scanning by liquid-crystal biasing in a modified SIW structure

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    A fixed-frequency beam-scanning 1D antenna based on Liquid Crystals (LCs) is designed for application in 2D scanning with lateral alignment. The 2D array environment imposes full decoupling of adjacent 1D antennas, which often conflicts with the LC requirement of DC biasing: the proposed design accommodates both. The LC medium is placed inside a Substrate Integrated Waveguide (SIW) modified to work as a Groove Gap Waveguide, with radiating slots etched on the upper broad wall, that radiates as a Leaky-Wave Antenna (LWA). This allows effective application of the DC bias voltage needed for tuning the LCs. At the same time, the RF field remains laterally confined, enabling the possibility to lay several antennas in parallel and achieve 2D beam scanning. The design is validated by simulation employing the actual properties of a commercial LC medium

    Science and technology roadmap for graphene, related two-dimensional crystals, and hybrid systems

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    We present the science and technology roadmap for graphene, related two-dimensional crystals, and hybrid systems, targeting an evolution in technology, that might lead to impacts and benefits reaching into most areas of society. This roadmap was developed within the framework of the European Graphene Flagship and outlines the main targets and research areas as best understood at the start of this ambitious project. We provide an overview of the key aspects of graphene and related materials (GRMs), ranging from fundamental research challenges to a variety of applications in a large number of sectors, highlighting the steps necessary to take GRMs from a state of raw potential to a point where they might revolutionize multiple industries. We also define an extensive list of acronyms in an effort to standardize the nomenclature in this emerging field.Peer ReviewedPostprint (published version
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