DRAM Bender: An Extensible and Versatile FPGA-based Infrastructure to Easily Test State-of-the-art DRAM Chips

To understand and improve DRAM performance, reliability, security and energy efficiency, prior works study characteristics of commodity DRAM chips. Unfortunately, state-of-the-art open source infrastructures capable of conducting such studies are obsolete, poorly supported, or difficult to use, or their inflexibility limit the types of studies they can conduct. We propose DRAM Bender, a new FPGA-based infrastructure that enables experimental studies on state-of-the-art DRAM chips. DRAM Bender offers three key features at the same time. First, DRAM Bender enables directly interfacing with a DRAM chip through its low-level interface. This allows users to issue DRAM commands in arbitrary order and with finer-grained time intervals compared to other open source infrastructures. Second, DRAM Bender exposes easy-to-use C++ and Python programming interfaces, allowing users to quickly and easily develop different types of DRAM experiments. Third, DRAM Bender is easily extensible. The modular design of DRAM Bender allows extending it to (i) support existing and emerging DRAM interfaces, and (ii) run on new commercial or custom FPGA boards with little effort. To demonstrate that DRAM Bender is a versatile infrastructure, we conduct three case studies, two of which lead to new observations about the DRAM RowHammer vulnerability. In particular, we show that data patterns supported by DRAM Bender uncovers a larger set of bit-flips on a victim row compared to the data patterns commonly used by prior work. We demonstrate the extensibility of DRAM Bender by implementing it on five different FPGAs with DDR4 and DDR3 support. DRAM Bender is freely and openly available at https://github.com/CMU-SAFARI/DRAM-Bender.Comment: To appear in TCAD 202

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Improving Phase Change Memory (PCM) and Spin-Torque-Transfer Magnetic-RAM (STT-MRAM) as Next-Generation Memories: A Circuit Perspective

In the memory hierarchy of computer systems, the traditional semiconductor memories Static RAM (SRAM) and Dynamic RAM (DRAM) have already served for several decades as cache and main memory. With technology scaling, they face increasingly intractable challenges like power, density, reliability and scalability. As a result, they become less appealing in the multi/many-core era with ever increasing size and memory-intensity of working sets. Recently, there is an increasing interest in using emerging non-volatile memory technologies in replacement of SRAM and DRAM, due to their advantages like non-volatility, high device density, near-zero cell leakage and resilience to soft errors. Among several new memory technologies, Phase Change Memory (PCM) and Spin-Torque-Transfer Magnetic-RAM (STT-MRAM) are most promising candidates in building main memory and cache, respectively. However, both of them possess unique limitations that preventing them from being effectively adopted. In this dissertation, I present my circuit design work on tackling the limitations of PCM and STT-MRAM. At bit level, both PCM and STT-MRAM suffer from excessive write energy, and PCM has very limited write endurance. For PCM, I implement Differential Write to remove large number of unnecessary bit-writes that do not alter the stored data. It is then extended to STT-MRAM as Early Write Termination, with specific optimizations to eliminate the overhead of pre-write read. At array level, PCM enjoys high density but could not provide competitive throughput due to its long write latency and limited number of read/write circuits. I propose a Pseudo-Multi-Port Bank design to exploit intra-bank parallelism by recycling and reusing shared peripheral circuits between accesses in a time-multiplexed manner. On the other hand, although STT-MRAM features satisfactory throughput, its conventional array architecture is constrained on density and scalability by the pitch of the per-column bitline pair. I propose a Common-Source-Line Array architecture which uses a shared source-line along the row, essentially leaving only one bitline per column. For these techniques, I provide circuit level analyses as well as architecture/system level and/or process/device level discussions. In addition, relevant background and work are thoroughly surveyed and potential future research topics are discussed, offering insights and prospects of these next-generation memories

Low energy digital circuit design using sub-threshold operation

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2006.Includes bibliographical references (p. 189-202).Scaling of process technologies to deep sub-micron dimensions has made power management a significant concern for circuit designers. For emerging low power applications such as distributed micro-sensor networks or medical applications, low energy operation is the primary concern instead of speed, with the eventual goal of harvesting energy from the environment. Sub-threshold operation offers a promising solution for ultra-low-energy applications because it often achieves the minimum energy per operation. While initial explorations into sub-threshold circuits demonstrate its promise, sub-threshold circuit design remains in its infancy. This thesis makes several contributions that make sub-threshold design more accessible to circuit designers. First, a model for energy consumption in sub-threshold provides an analytical solution for the optimum VDD to minimize energy. Fitting this model to a generic circuit allows easy estimation of the impact of processing and environmental parameters on the minimum energy point. Second, analysis of device sizing for sub-threshold circuits shows the trade-offs between sizing for minimum energy and for minimum voltage operation.(cont.) A programmable FIR filter test chip fabricated in 0.18pum bulk CMOS provides measurements to confirm the model and the sizing analysis. Third, a low-overhead method for integrating sub-threshold operation with high performance applications extends dynamic voltage scaling across orders of magnitude of frequency and provides energy scalability down to the minimum energy point. A 90nm bulk CMOS test chip confirms the range of operation for ultra-dynamic voltage scaling. Finally, sub-threshold operation is extended to memories. Analysis of traditional SRAM bitcells and architectures leads to development of a new bitcell for robust sub-threshold SRAM operation. The sub-threshold SRAM is analyzed experimentally in a 65nm bulk CMOS test chip.by Benton H. Calhoun.Ph.D

Nanopower CMOS transponders for UHF and microwave RFID systems

At first, we present an analysis and a discussion of the design options and tradeoffs for a passive microwave transponder. We derive a set of criteria for the optimization of the voltage multiplier, the power matching network and the backscatter modulator in order to optimize the operating range. In order to match the strictly power requirements, the communication protocol between transponder and reader has been chosen in a convenient way, in order to make the architecture of the passive transponder very simple and then ultra-low-power. From the circuital point of view, the digital section has been implemented in subthreshold CMOS logic with very low supply voltage and clock frequency. We present different solutions to supply power to the transponder, in order to keep the power consumption in the deep sub-µW regime and to drastically reduce the huge sensitivity of the subthreshold logic to temperature and process variations. Moreover, a low-voltage and low-power EEPROM in a standard CMOS process has been implemented. Finally, we have presented the implementation of the entire passive transponder, operating in the UHF or microwave frequency range

근사 컴퓨팅을 이용한 회로 노화 보상과 에너지 효율적인 신경망 구현

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 이혁재.Approximate computing reduces the cost (energy and/or latency) of computations by relaxing the correctness (i.e., precision) of computations up to the level, which is dependent on types of applications. Moreover, it can be realized in various hierarchies of computing system design from circuit level to application level. This dissertation presents the methodologies applying approximate computing across such hierarchies; compensating aging-induced delay in logic circuit by dynamic computation approximation (Chapter 1), designing energy-efficient neural network by combining low-power and low-latency approximate neuron models (Chapter 2), and co-designing in-memory gradient descent module with neural processing unit so as to address a memory bottleneck incurred by memory I/O for high-precision data (Chapter 3). The first chapter of this dissertation presents a novel design methodology to turn the timing violation caused by aging into computation approximation error without the reliability guardband or increasing the supply voltage. It can be realized by accurately monitoring the critical path delay at run-time. The proposal is evaluated at two levels: RTL component level and system level. The experimental results at the RTL component level show a significant improvement in terms of (normalized) mean squared error caused by the timing violation and, at the system level, show that the proposed approach successfully transforms the aging-induced timing violation errors into much less harmful computation approximation errors, therefore it recovers image quality up to perceptually acceptable levels. It reduces the dynamic and static power consumption by 21.45% and 10.78%, respectively, with 0.8% area overhead compared to the conventional approach. The second chapter of this dissertation presents an energy-efficient neural network consisting of alternative neuron models; Stochastic-Computing (SC) and Spiking (SP) neuron models. SC has been adopted in various fields to improve the power efficiency of systems by performing arithmetic computations stochastically, which approximates binary computation in conventional computing systems. Moreover, a recent work showed that deep neural network (DNN) can be implemented in the manner of stochastic computing and it greatly reduces power consumption. However, Stochastic DNN (SC-DNN) suffers from problem of high latency as it processes only a bit per cycle. To address such problem, it is proposed to adopt Spiking DNN (SP-DNN) as an input interface for SC-DNN since SP effectively processes more bits per cycle than SC-DNN. Moreover, this chapter resolves the encoding mismatch problem, between two different neuron models, without hardware cost by compensating the encoding mismatch with synapse weight calibration. A resultant hybrid DNN (SPSC-DNN) consists of SP-DNN as bottom layers and SC-DNN as top layers. Exploiting the reduced latency from SP-DNN and low-power consumption from SC-DNN, the proposed SPSC-DNN achieves improved energy-efficiency with lower error-rate compared to SC-DNN and SP-DNN in same network configuration. The third chapter of this dissertation proposes GradPim architecture, which accelerates the parameter updates by in-memory processing which is codesigned with 8-bit floating-point training in Neural Processing Unit (NPU) for deep neural networks. By keeping the high precision processing algorithms in memory, such as the parameter update incorporating high-precision weights in its computation, the GradPim architecture can achieve high computational efficiency using 8-bit floating point in NPU and also gain power efficiency by eliminating massive high-precision data transfers between NPU and off-chip memory. A simple extension of DDR4 SDRAM utilizing bank-group parallelism makes the operation designs in processing-in-memory (PIM) module efficient in terms of hardware cost and performance. The experimental results show that the proposed architecture can improve the performance of the parameter update phase in the training by up to 40% and greatly reduce the memory bandwidth requirement while posing only a minimal amount of overhead to the protocol and the DRAM area.근사 컴퓨팅은 연산의 정확도의 손실을 어플리케이션 별 적절한 수준까지 허용함으로써 연산에 필요한 비용 (에너지나 지연시간)을 줄인다. 게다가, 근사 컴퓨팅은 컴퓨팅 시스템 설계의 회로 계층부터 어플리케이션 계층까지 다양한 계층에 적용될 수 있다. 본 논문에서는 근사 컴퓨팅 방법론을 다양한 시스템 설계의 계층에 적용하여 전력과 에너지 측면에서 이득을 얻을 수 있는 방법들을 제안하였다. 이는, 연산 근사화 (computation Approximation)를 통해 회로의 노화로 인해 증가된 지연시간을 추가적인 전력소모 없이 보상하는 방법과 (챕터 1), 근사 뉴런모델 (approximate neuron model)을 이용해 에너지 효율이 높은 신경망을 구성하는 방법 (챕터 2), 그리고 메모리 대역폭으로 인한 병목현상 문제를 높은 정확도 데이터를 활용한 연산을 메모리 내에서 수행함으로써 완화시키는 방법을 (챕터3) 제안하였다. 첫 번째 챕터는 회로의 노화로 인한 지연시간위반을 (timing violation) 설계마진이나 (reliability guardband) 공급전력의 증가 없이 연산오차 (computation approximation error)를 통해 보상하는 설계방법론 (design methodology)를 제안하였다. 이를 위해 주요경로의 (critical path) 지연시간을 동작시간에 정확하게 측정할 필요가 있다. 여기서 제안하는 방법론은 RTL component와 system 단계에서 평가되었다. RTL component 단계의 실험결과를 통해 제안한 방식이 표준화된 평균제곱오차를 (normalized mean squared error) 상당히 줄였음을 볼 수 있다. 그리고 system 단계에서는 이미지처리 시스템에서 이미지의 품질이 인지적으로 충분히 회복되는 것을 보임으로써 회로노화로 인해 발생한 지연시간위반 오차가 에러의 크기가 작은 연산오차로 변경되는 것을 확인 할 수 있었다. 결론적으로, 제안된 방법론을 따랐을 때 0.8%의 공간을 (area) 더 사용하는 비용을 지불하고 21.45%의 동적전력소모와 (dynamic power consumption) 10.78%의 정적전력소모의 (static power consumption) 감소를 달성할 수 있었다. 두 번째 챕터는 근사 뉴런모델을 활용하는 고-에너지효율의 신경망을 (neural network) 제안하였다. 본 논문에서 사용한 두 가지의 근사 뉴런모델은 확률컴퓨팅과 (stochastic computing) 스파이킹뉴런 (spiking neuron) 이론들을 기반으로 모델링되었다. 확률컴퓨팅은 산술연산들을 확률적으로 수행함으로써 이진연산을 낮은 전력소모로 수행한다. 최근에 확률컴퓨팅 뉴런모델을 이용하여 심층 신경망 (deep neural network)를 구현할 수 있다는 연구가 진행되었다. 그러나, 확률컴퓨팅을 뉴런모델링에 활용할 경우 심층신경망이 매 클락사이클마다 (clock cycle) 하나의 비트만을 (bit) 처리하므로, 지연시간 측면에서 매우 나쁠 수 밖에 없는 문제가 있다. 따라서 본 논문에서는 이러한 문제를 해결하기 위하여 스파이킹 뉴런모델로 구성된 스파이킹 심층신경망을 확률컴퓨팅을 활용한 심층신경망 구조와 결합하였다. 스파이킹 뉴런모델의 경우 매 클락사이클마다 여러 비트를 처리할 수 있으므로 심층신경망의 입력 인터페이스로 사용될 경우 지연시간을 줄일 수 있다. 하지만, 확률컴퓨팅 뉴런모델과 스파이킹 뉴런모델의 경우 부호화 (encoding) 방식이 다른 문제가 있다. 따라서 본 논문에서는 해당 부호화 불일치 문제를 모델의 파라미터를 학습할 때 고려함으로써, 파라미터들의 값이 부호화 불일치를 고려하여 조절 (calibration) 될 수 있도록 하여 문제를 해결하였다. 이러한 분석의 결과로, 앞 쪽에는 스파이킹 심층신경망을 배치하고 뒷 쪽애는 확률컴퓨팅 심층신경망을 배치하는 혼성신경망을 제안하였다. 혼성신경망은 스파이킹 심층신경망을 통해 매 클락사이클마다 처리되는 비트 양의 증가로 인한 지연시간 감소 효과와 확률컴퓨팅 심층신경망의 저전력 소모 특성을 모두 활용함으로써 각 심층신경망을 따로 사용하는 경우 대비 우수한 에너지 효율성을 비슷하거나 더 나은 정확도 결과를 내면서 달성한다. 세 번째 챕터는 심층신경망을 8비트 부동소숫점 연산으로 학습하는 신경망처리유닛의 (neural processing unit) 파라미터 갱신을 (parameter update) 메모리-내-연산으로 (in-memory processing) 가속하는 GradPIM 아키텍쳐를 제안하였다. GradPIM은 8비트의 낮은 정확도 연산은 신경망처리유닛에 남기고, 높은 정확도를 가지는 데이터를 활용하는 연산은 (파라미터 갱신) 메모리 내부에 둠으로써 신경망처리유닛과 메모리간의 데이터통신의 양을 줄여, 높은 연산효율과 전력효율을 달성하였다. 또한, GradPIM은 bank-group 수준의 병렬화를 이루어 내 높은 내부 대역폭을 활용함으로써 메모리 대역폭을 크게 확장시킬 수 있게 되었다. 또한 이러한 메모리 구조의 변경이 최소화되었기 때문에 추가적인 하드웨어 비용도 최소화되었다. 실험 결과를 통해 GradPIM이 최소한의 DRAM 프로토콜 변화와 DRAM칩 내의 공간사용을 통해 심층신경망 학습과정 중 파라미터 갱신에 필요한 시간을 40%만큼 향상시켰음을 보였다.Chapter I: Dynamic Computation Approximation for Aging Compensation 1 1.1 Introduction 1 1.1.1 Chip Reliability 1 1.1.2 Reliability Guardband 2 1.1.3 Approximate Computing in Logic Circuits 2 1.1.4 Computation approximation for Aging Compensation 3 1.1.5 Motivational Case Study 4 1.2 Previous Work 5 1.2.1 Aging-induced Delay 5 1.2.2 Delay-Configurable Circuits 6 1.3 Proposed System 8 1.3.1 Overview of the Proposed System 8 1.3.2 Proposed Adder 9 1.3.3 Proposed Multiplier 11 1.3.4 Proposed Monitoring Circuit 16 1.3.5 Aging Compensation Scheme 19 1.4 Design Methodology 20 1.5 Evaluation 24 1.5.1 Experimental setup 24 1.5.2 RTL component level Adder/Multiplier 27 1.5.3 RTL component level Monitoring circuit 30 1.5.4 System level 31 1.6 Summary 38 Chapter II: Energy-Efficient Neural Network by Combining Approximate Neuron Models 40 2.1 Introduction 40 2.1.1 Deep Neural Network (DNN) 40 2.1.2 Low-power designs for DNN 41 2.1.3 Stochastic-Computing Deep Neural Network 41 2.1.4 Spiking Deep Neural Network 43 2.2 Hybrid of Stochastic and Spiking DNNs 44 2.2.1 Stochastic-Computing vs Spiking Deep Neural Network 44 2.2.2 Combining Spiking Layers and Stochastic Layers 46 2.2.3 Encoding Mismatch 47 2.3 Evaluation 49 2.3.1 Latency and Test Error 49 2.3.2 Energy Efficiency 51 2.4 Summary 54 Chapter III: GradPIM: In-memory Gradient Descent in Mixed-Precision DNN Training 55 3.1 Introduction 55 3.1.1 Neural Processing Unit 55 3.1.2 Mixed-precision Training 56 3.1.3 Mixed-precision Training with In-memory Gradient Descent 57 3.1.4 DNN Parameter Update Algorithms 59 3.1.5 Modern DRAM Architecture 61 3.1.6 Motivation 63 3.2 Previous Work 65 3.2.1 Processing-In-Memory 65 3.2.2 Co-design Neural Processing Unit and Processing-In-Memory 66 3.2.3 Low-precision Computation in NPU 67 3.3 GradPIM 68 3.3.1 GradPIM Architecture 68 3.3.2 GradPIM Operations 69 3.3.3 Timing Considerations 70 3.3.4 Update Phase Procedure 73 3.3.5 Commanding GradPIM 75 3.4 NPU Co-design with GradPIM 76 3.4.1 NPU Architecture 76 3.4.2 Data Placement 79 3.5 Evaluation 82 3.5.1 Evaluation Methodology 82 3.5.2 Experimental Results 83 3.5.3 Sensitivity Analysis 88 3.5.4 Layer Characterizations 90 3.5.5 Distributed Data Parallelism 90 3.6 Summary 92 3.6.1 Discussion 92 Bibliography 113 요약 114Docto

Integrated Circuits for Programming Flash Memories in Portable Applications

Smart devices such as smart grids, smart home devices, etc. are infrastructure systems that connect the world around us more than before. These devices can communicate with each other and help us manage our environment. This concept is called the Internet of Things (IoT). Not many smart nodes exist that are both low-power and programmable. Floating-gate (FG) transistors could be used to create adaptive sensor nodes by providing programmable bias currents. FG transistors are mostly used in digital applications like Flash memories. However, FG transistors can be used in analog applications, too. Unfortunately, due to the expensive infrastructure required for programming these transistors, they have not been economical to be used in portable applications. In this work, we present low-power approaches to programming FG transistors which make them a good candidate to be employed in future wireless sensor nodes and portable systems. First, we focus on the design of low-power circuits which can be used in programming the FG transistors such as high-voltage charge pumps, low-drop-out regulators, and voltage reference cells. Then, to achieve the goal of reducing the power consumption in programmable sensor nodes and reducing the programming infrastructure, we present a method to program FG transistors using negative voltages. We also present charge-pump structures to generate the necessary negative voltages for programming in this new configuration

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

NASA Space Engineering Research Center Symposium on VLSI Design

The NASA Space Engineering Research Center (SERC) is proud to offer, at its second symposium on VLSI design, presentations by an outstanding set of individuals from national laboratories and the electronics industry. These featured speakers share insights into next generation advances that will serve as a basis for future VLSI design. Questions of reliability in the space environment along with new directions in CAD and design are addressed by the featured speakers