Microsystems technology: objectives

This contribution focuses on the objectives of microsystems technology (MST). The reason for this is two fold. First of all, it should explain what MST actually is. This question is often posed and a simple answer is lacking, as a consequence of the diversity of subjects that are perceived as MST. The second reason is that a map of the somewhat chaotic field of MST is needed to identify sub-territories, for which standardization in terms of system modules an interconnections is feasible. To define the objectives a pragmatic approach has been followed. From the literature a selection of topics has been chosen and collected that are perceived as belonging to the field of MST by a large community of workers in the field (more than 250 references). In this way an overview has been created with `applications¿ and `generic issues¿ as the main characteristics

Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride

Insulating films are essential in multiple electronic devices because they can provide essential functionalities, such as capacitance effects and electrical fields. Two-dimensional (2D) layered materials have superb electronic, physical, chemical, thermal, and optical properties, and they can be effectively used to provide additional performances, such as flexibility and transparency. 2D layered insulators are called to be essential in future electronic devices, but their reliability, degradation kinetics, and dielectric breakdown (BD) process are still not understood. In this work, the dielectric breakdown process of multilayer hexagonal boron nitride (h-BN) is analyzed on the nanoscale and on the device level, and the experimental results are studied via theoretical models. It is found that under electrical stress, local charge accumulation and charge trapping/detrapping are the onset mechanisms for dielectric BD formation. By means of conductive atomic force microscopy, the BD event was triggered at several locations on the surface of different dielectrics (SiO2, HfO2, Al2O3, multilayer h-BN, and monolayer h-BN); BD-induced hillocks rapidly appeared on the surface of all of them when the BD was reached, except in monolayer h-BN. The high thermal conductivity of h-BN combined with the one-atom-thick nature are genuine factors contributing to heat dissipation at the BD spot, which avoids self-accelerated and thermally driven catastrophic BD. These results point to monolayer h-BN as a sublime dielectric in terms of reliability, which may have important implications in future digital electronic devices.Fil: Jiang, Lanlan. Soochow University; ChinaFil: Shi, Yuanyuan. Soochow University; China. University of Stanford; Estados UnidosFil: Hui, Fei. Soochow University; China. Massachusetts Institute of Technology; Estados UnidosFil: Tang, Kechao. University of Stanford; Estados UnidosFil: Wu, Qian. Soochow University; ChinaFil: Pan, Chengbin. Soochow University; ChinaFil: Jing, Xu. Soochow University; China. University of Texas at Austin; Estados UnidosFil: Uppal, Hasan. University of Manchester; Reino UnidoFil: Palumbo, Félix Roberto Mario. Comisión Nacional de Energía Atómica; Argentina. Universidad Tecnológica Nacional; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; ArgentinaFil: Lu, Guangyuan. Chinese Academy of Sciences; República de ChinaFil: Wu, Tianru. Chinese Academy of Sciences; República de ChinaFil: Wang, Haomin. Chinese Academy of Sciences; República de ChinaFil: Villena, Marco A.. Soochow University; ChinaFil: Xie, Xiaoming. Chinese Academy of Sciences; República de China. ShanghaiTech University; ChinaFil: McIntyre, Paul C.. University of Stanford; Estados UnidosFil: Lanza, Mario. Soochow University; Chin

Diagnostics of micro- and nanostructure using the scanning probe microscopy, Journal of Telecommunications and Information Technology, 2005, nr 1

In this paper we summarize the results of our research concerning the diagnostics of micro- and nanostructure with scanning probe microscopy (SPM). We describe the experiments performed with one of the scanning probe microscopy techniques enabling also insulating surfaces to be investigated, i.e., atomic force microscopy (AFM). We present the results of topography measurements using both contact and non-contact AFM modes, investigations of the friction forces that appear between the microtip and the surface, and experiments connected with the thermal behaviour of integrated circuits, carried out with the local resolution of 20 nm

The properties and the effect of operating parameters on nickel plating (review)

The energy required in an electroplating process and the material costs are important considerations in product manufacturing. The most important plating criteria, however, are quality and the uniformity of the deposited metals. The nickel plating process is used extensively for decorative, engineering, and electroforming purposes. Because of the appearance and other properties of the electrodeposited material, nickel deposition can be varied, over a wide range, by controlling the composition and the operating parameters of the plating solution. Decorative applications account for about 80% of the nickel consumed in plating; 20% is consumed for engineering and electroforming purposes. Autocatalytic (electroless) nickel plating processes are commercially important but are outside the scope of this review. In this review, the basic facts of nickel electroplating processes, thickness test and methods, are discussed. The properties of nickel and the different effects of the operating parameters on nickel plating, together with the simulation and design tools, are also reviewed. Simulation tools can help to obtain better plating results. Non-destructive techniques to evaluate the coatings on a microstructural and the technical evaluation with TEM, SEM, XRD and other techniques were also reviewed

Glass Patterning: Technologies and Applications

In this work, we review the progress in recent studies on glass patterning including technologies and applications. Four technologies for glass micromachining including wet etching, sandblasting, reactive ion etching, and glass reflow process are analyzed. Advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Various microsystem applications using the above glass patterning technologies like thermal sensors, hermetically packaged capacitive silicon resonators, optical modulator devices, glass microfluidics, micro-heaters, and vacuum-sealed capacitive micromachined ultrasonic transducer arrays are reported

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn. The Au-Sn flip-chip joints were formed at 300 and 400 degrees without using any flux. In the case where the samples were reflowed at 300 degrees, only an (Au,Ni)3Sn2 IMC layer formed at the interface between the Au-Sn solder and Ni UBM. On the other hand, two IMC layers, (Au,Ni)3Sn2 and (Au,Ni)3Sn, were found at the interfaces of the samples reflowed at 400 degrees. As the reflow time increased, the thickness of the (Au,Ni)3Sn2 and (Au,Ni)3Sn IMC layers formed at the interface increased and the eutectic lamellae in the bulk solder coarsened.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Micromachined Scanning Devices for 3D Acoustic Imaging

Acoustic imaging (including ultrasound and photoacoustic imaging) refers to a class of imaging methods that use high-frequency sound (ultrasound) waves to generate contrast images for the interrogated media. It provides 3D spatial distribution of structural, mechanical, and even compositional properties in different materials. To conduct 3D ultrasound imaging, 2D ultrasound transducer arrays followed by multi-channel high-frequency data acquisition (DAQ) systems are frequently used. However, as the quantity and density of the transducer elements and also the DAQ channels increase, the acoustic imaging system becomes complex, bulky, expensive, and also power consuming. This situation is especially true for 3D imaging systems, where a 2D transducer array with hundreds or even thousands of elements could be involved. To address this issue, the objective of this research is to achieve new micromachined scanning devices to enable fast and versatile 2D ultrasound signal acquisition for 3D image reconstruction without involving complex physical transducer arrays and DAQ electronics. The new micromachined scanning devices studied in this research include 1) a water-immersible scanning mirror microsystem, 2) a micromechanical scanning transducer, and 3) a multi-layer linear transducer array. Especially, the water-immersible scanning mirror microsystem is capable of scanning focused ultrasound beam (from a single-element transducer) in two dimensions for 3D high-resolution acoustic microscopy. The micromechanical scanning transducer is capable of sending and receiving ultrasound signal from a single-element transducer to a 2D array of locations for 3D acoustic tomography. The multi-layer linear transducer array allows a unique electronic scanning scheme to simulate the functioning of a much larger 2D transducer array for 3D acoustic tomography. The design, fabrication and testing of the above three devices have been successfully accomplished and their applications in 3D acoustic microscopy and tomography have been demonstrated

Micro-Nano Technologies for Cell Manipulation and Subcellular Monitoring

Rehabilitatio