Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

Power Droop Reduction In Logic BIST By Scan Chain Reordering

Significant peak power (PP), thus power droop (PD), during test is a serious concern for modern, complex ICs. In fact, the PD originated during the application of test vectors may produce a delay effect on the circuit under test signal transitions. This event may be erroneously recognized as presence of a delay fault, with consequent generation of an erroneous test fail, thus increasing yield loss. Several solutions have been proposed in the literature to reduce the PD during test of combinational ICs, while fewer approaches exist for sequential ICs. In this paper, we propose a novel approach to reduce peak power/power droop during test of sequential circuits with scan-based Logic BIST. In particular, our approach reduces the switching activity of the scan chains between following capture cycles. This is achieved by an original generation and arrangement of test vectors. The proposed approach presents a very low impact on fault coverage and test time

REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Enhancement of the Illinois Scan Architecture for Multiple Scan Inputs and Transition Faults

Coordinated Science Laboratory was formerly known as Control Systems LaboratorySemiconductor Research Corporation / SRC 99-TJ-717Ope

Testing for delay defects utilizing test data compression techniques

textAs technology shrinks new types of defects are being discovered and new fault models are being created for those defects. Transition delay and path delay fault models are two such models that have been created, but they still fall short in that they are unable to obtain a high test coverage of smaller delay defects; these defects can cause functional behavior to fail and also indicate potential reliability issues. The first part of this dissertation addresses these problems by presenting an enhanced timing-based delay fault testing technique that incorporates the use of standard delay ATPG, along with timing information gathered from standard static timing analysis. Utilizing delay fault patterns typically increases the test data volume by 3-5X when compared to stuck-at patterns. Combined with the increase in test data volume associated with the increase in gate count that typically accompanies the miniaturization of technology, this adds up to a very large increase in test data volume that directly affect test time and thus the manufacturing cost. The second part of this dissertation presents a technique for improving test compression and reducing test data volume by using multiple expansion ratios while determining the configuration of the scan chains for each of the expansion ratios using a dependency analysis procedure that accounts for structural dependencies as well as free variable dependencies to improve the probability of detecting faults. Finally, this dissertation addresses the problem of unknown values (X’s) in the output response data corrupting the data and degrading the performance of the output response compactor and thus the overall amount of test compression. Four techniques are presented that focus on handling response data with large percentages of X’s. The first uses X-canceling MISR architecture that is based on deterministically observing scan cells, and the second is a hybrid approach that combines a simple X-masking scheme with the X-canceling MISR for further gains in test compression. The third and fourth techniques revolve around reiterative LFSR X-masking, which take advantage of LFSR-encoded masks that can be reused for multiple scan slices in novel ways.Electrical and Computer Engineerin

Evaluation of advanced techniques for structural FPGA self-test

This thesis presents a comprehensive test generation framework for FPGA logic elements and interconnects. It is based on and extends the current state-of-the-art. The purpose of FPGA testing in this work is to achieve reliable reconfiguration for a FPGA-based runtime reconfigurable system. A pre-configuration test is performed on a portion of the FPGA before it is reconfigured as part of the system to ensure that the FPGA fabric is fault-free. The implementation platform is the Xilinx Virtex-5 FPGA family. Existing literature in FPGA testing is evaluated and reviewed thoroughly. The various approaches are compared against one another qualitatively and the approach most suitable to the target platform is chosen. The array testing method is employed in testing the FPGA logic for its low hardware overhead and optimal test time. All tests are additionally pipelined to reduce test application time and use a high test clock frequency. A hybrid fault model including both structural and functional faults is assumed. An algorithm for the optimization of the number of required FPGA test configurations is developed and implemented in Java using a pseudo-random set-covering heuristic. Optimal solutions are obtained for Virtex-5 logic slices. The algorithm effort is parameterizable with the number of loop iterations each of which take approximately one second for a Virtex-5 sliceL circuit. A flexible test architecture for interconnects is developed. Arbitrary wire types can be tested in the same test configuration with no hardware overhead. Furthermore, a routing algorithm is integrated with the test template generation to select the wires under test and route them appropriately. Nine test configurations are required to achieve full test coverage for the FPGA logic. For interconnect testing, a local router-based on depth-first graph traversal is implemented in Java as the basis for creating systematic interconnect test templates. Pent wire testing is additionally implemented as a proof of concept. The test clock frequency for all tests exceeds 170 MHz and the hardware overhead is always lower than seven CLBs. All implemented tests are parameterizable such that they can be applied to any portion of the FPGA regardless of size or position

Power constrained test scheduling in system-on-chip design

With the development of VLSI technologies, especially with the coming of deep sub-micron semiconductor process technologies, power dissipation becomes a critical factor that cannot be ignored either in normal operation or in test mode of digital systems. Test scheduling has to take into consideration of both test concurrency and power dissipation constraints. For satisfying high fault coverage goals with minimum test application time under certain power dissipation constraints, the testing of all components on the system should be performed in parallel as much as possible. The main objective of this thesis is to address the test-scheduling problem faced by SOC designers at system level. Through the analysis of several existing scheduling approaches, we enlarge the basis that current approaches based on to minimize test application time and propose an efficient and integrated technique for the test scheduling of SOCs under power-constraint. The proposed merging approach is based on a tree growing technique and can be used to overlay the block-test sessions in order to reduce further test application time. A number of experiments, based on academic benchmarks and industrial designs, have been carried out to demonstrate the usefulness and efficiency of the proposed approaches

Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

A GA-Based Method for High-Quality X-Filling to Reduce Launch Switching Activity in At-speed Scan Testing

Power-aware X-filling is a preferable approach to avoiding IR-drop-induced yield loss in at-speed scan testing. However, the quality of previous X-filling methods for reducing launch switching activity may be unsatisfactory, due to low effect (insufficient and global-only reduction) and/or low scalability (long CPU time). This paper addresses this quality problem with a novel, GA (Genetic Algorithm) based X-filling method, called GA-fill. Its goals are (1) to achieve both effectiveness and scalability in a more balanced manner, and (2) to make the reduction effect of launch switching activity more concentrated on critical areas that have higher impact on IR-drop-induced yield loss. Evaluation experiments are being conducted on benchmark and industrial circuits, and initial results have demonstrated the usefulness of GA-fill.2009 15th IEEE Pacific Rim International Symposium on Dependable Computing, 16-18 November 2009, Shanghai, Chin