MISSED: an environment for mixed-signal microsystem testing and diagnosis

A tight link between design and test data is proposed for speeding up test-pattern generation and diagnosis during mixed-signal prototype verification. Test requirements are already incorporated at the behavioral level and specified with increased detail at lower hierarchical levels. A strict distinction between generic routines and implementation data makes reuse of software possible. A testability-analysis tool and test and DFT libraries support the designer to guarantee testability. Hierarchical backtrace procedures in combination with an expert system and fault libraries assist the designer during mixed-signal chip debuggin

A Behavioral Model of a Built-in Current Sensor for IDDQ Testing

IDDQ testing is one of the most effective methods for detecting defects in integrated circuits. Higher leakage currents in more advanced semiconductor technologies have reduced the resolution of IDDQ test. One solution is to use built-in current sensors. Several sensor techniques for measuring the current based on the magnetic field or voltage drop across the supply line have been proposed. In this work, we develop a behavioral model for a built-in current sensor measuring voltage drop and use this model to better understand sensor operation, identify the effect of different parameters on sensor resolution, and suggest design modifications to improve future sensor performance

Quiescent current testing of CMOS data converters

Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed

Voltage sensing based built-in current sensor for IDDQ test

Quiescent current leakage test of the VDD supply (IDDQ Test) has been proven an effective way to screen out defective chips in manufacturing of Integrated Circuits (IC). As technology advances, the traditional IDDQ test is facing more and more challenges. In this research, a practical built-in current sensor (BICS) is proposed and the design is verified by three generations of test chips. The BICS detects the signal by sensing the voltage drop on supply lines of the circuit under test (CUT). Then the sensor performs analog-to-digital conversion of the input signal using a stochastic process with scan chain readout. Self-calibration and digital chopping are used to minimize offset and low frequency noise and drift. This non-invasive procedure avoids any performance degradation of the CUT. The measurement results of test chips are presented. The sensor achieves a high IDDQ resolution with small chip area overhead. This will enable IDDQ of future technology generations

A Behavioral Model of a Built-in Current Sensor for IDDQ Testing

IDDQ testing is one of the most effective methods for detecting defects in integrated circuits. Higher leakage currents in more advanced semiconductor technologies have reduced the resolution of IDDQ test. One solution is to use built-in current sensors. Several sensor techniques for measuring the current based on the magnetic field or voltage drop across the supply line have been proposed. In this work, we develop a behavioral model for a built-in current sensor measuring voltage drop and use this model to better understand sensor operation, identify the effect of different parameters on sensor resolution, and suggest design modifications to improve future sensor performance

Test Cost Reduction for Logic Circuits——Reduction of Test Data Volume and Test Application Time——

論理回路の大規模化とともに,テストコストの増大が深刻な問題となっている.特に大規模な論理回路では,テストデータ量やテスト実行時間の削減が,テストコスト削減の重要な課題である.本論文では,高い故障検出率のテストパターンをできるだけ少ないテストベクトル数で実現するためのテストコンパクション技術,付加ハードウェアによるテストデータの展開・伸長を前提に圧縮を行うテストコンプレッション技術,及び,スキャン設計回路におけるテスト実行時間削減技術について概説する

Test and Testability of Asynchronous Circuits

The ever-increasing transistor shrinkage and higher clock frequencies are causing serious clock distribution, power management, and reliability issues. Asynchronous design is predicted to have a significant role in tackling these challenges because of its distributed control mechanism and on-demand, rather than continuous, switching activity. Null Convention Logic (NCL) is a robust and low-power asynchronous paradigm that introduces new challenges to test and testability algorithms because 1) the lack of deterministic timing in NCL complicates the management of test timing, 2) all NCL gates are state-holding and even simple combinational circuits show sequential behaviour, and 3) stuck-at faults on gate internal feedback (GIF) of NCL gates do not always cause an incorrect output and therefore are undetectable by automatic test pattern generation (ATPG) algorithms. Existing test methods for NCL use clocked hardware to control the timing of test. Such test hardware could introduce metastability issues into otherwise highly robust NCL devices. Also, existing test techniques for NCL handle the high-statefulness of NCL circuits by excessive incorporation of test hardware which imposes additional area, propagation delay and power consumption. This work, first, proposes a clockless self-timed ATPG that detects all faults on the gate inputs and a share of the GIF faults with no added design for test (DFT). Then, the efficacy of quiescent current (IDDQ) test for detecting GIF faults undetectable by a DFT-less ATPG is investigated. Finally, asynchronous test hardware, including test points, a scan cell, and an interleaved scan architecture, is proposed for NCL-based circuits. To the extent of our knowledge, this is the first work that develops clockless, self-timed test techniques for NCL while minimising the need for DFT, and also the first work conducted on IDDQ test of NCL. The proposed methods are applied to multiple NCL circuits with up to 2,633 NCL gates (10,000 CMOS Boolean gates), in 180 and 45 nm technologies and show average fault coverage of 88.98% for ATPG alone, 98.52% including IDDQ test, and 99.28% when incorporating test hardware. Given that this fault coverage includes detection of GIF faults, our work has 13% higher fault coverage than previous work. Also, because our proposed clockless test hardware eliminates the need for double-latching, it reduces the average area and delay overhead of previous studies by 32% and 50%, respectively

Power supply partitioning for placement of built-in current sensors for IDDQ testing

IDDQ testing has been a very useful test screen for CMOS circuits. However, with each technology node the background leakage of chips is rapidly increasing. As a result it is becoming more difficult to distinguish between faulty and fault-free chips using IDDQ testing. Power supply partitioning has been proposed to increase test resolution by partitioning the power supply network, such that each partition has a relatively small defect-free IDDQ level. However, at present no practical partitioning strategy is available. The contribution of this thesis is to present a practical power supply partitioning strategy. We formulate various versions of the power supply partitioning problem that are likely to be of interest depending on the constraints of the chip design. Solutions to all the variants of the problem are presented. The basic idea behind all solutions is to abstract the power topology of the chip as a flow network. We then use flow techniques to find the min-cut of the transformed network to get solutions to our various problem formulations. Experimental results for benchmark circuits verify the feasibility of our solution methodology. The problem formulations will give complete flexibility to a test engineer to decide which factors cannot be compromised (e.g. area of BICS, test quality, etc) for a particular design and accordingly choose the appropriate problem formulation. The application of this work will be the first step in the placement of Built-In Current Sensors for IDDQ testing

Test Strategies for Low Power Devices

Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German

Integrated circuit outlier identification by multiple parameter correlation

Semiconductor manufacturers must ensure that chips conform to their specifications before they are shipped to customers. This is achieved by testing various parameters of a chip to determine whether it is defective or not. Separating defective chips from fault-free ones is relatively straightforward for functional or other Boolean tests that produce a go/no-go type of result. However, making this distinction is extremely challenging for parametric tests. Owing to continuous distributions of parameters, any pass/fail threshold results in yield loss and/or test escapes. The continuous advances in process technology, increased process variations and inaccurate fault models all make this even worse. The pass/fail thresholds for such tests are usually set using prior experience or by a combination of visual inspection and engineering judgment. Many chips have parameters that exceed certain thresholds but pass Boolean tests. Owing to the imperfect nature of tests, to determine whether these chips (called "outliers") are indeed defective is nontrivial. To avoid wasted investment in packaging or further testing it is important to screen defective chips early in a test flow. Moreover, if seemingly strange behavior of outlier chips can be explained with the help of certain process parameters or by correlating additional test data, such chips can be retained in the test flow before they are proved to be fatally flawed. In this research, we investigate several methods to identify true outliers (defective chips, or chips that lead to functional failure) from apparent outliers (seemingly defective, but fault-free chips). The outlier identification methods in this research primarily rely on wafer-level spatial correlation, but also use additional test parameters. These methods are evaluated and validated using industrial test data. The potential of these methods to reduce burn-in is discussed