6,707 research outputs found

    Flip Chip Die-to-Wafer Bonding Review: Gaps to High Volume Manufacturing

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    Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing (HVM) maturity. In this paper,flip-chip and wire bonding are compared, then flip-chip bonding techniques are compared to examine advantages for scaling and speed. Specific recent 3-year trends in flip-chip die-to-wafer bonding are reviewed to address the key gaps and challenges to HVM adoption. Finally, some thoughts on the care needed by the packaging technology for successful HVM introduction are reviewed

    The Road to 6G: Ten Physical Layer Challenges for Communications Engineers

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    While the deployment of 5G cellular systems will continue well in to the next decade, much interest is already being generated towards technologies that will underlie its successor, 6G. Undeniably, 5G will have transformative impact on the way we live and communicate, yet, it is still far away from supporting the Internet-of-Everything (IoE), where upwards of a million devices per km3\textrm{km}^3 (both terrestrial and aerial) will require ubiquitous, reliable, low-latency connectivity. This article looks at some of the fundamental problems that pertain to key physical layer enablers for 6G. This includes highlighting challenges related to intelligent reflecting surfaces, cell-free massive MIMO and THz communications. Our analysis covers theoretical modeling challenges, hardware implementation issues and scalability among others. The article concludes by delineating the critical role of signal processing in the new era for wireless communications.Comment: IEEE Communications Magazine, Accepte

    Cloud Computing: Current and Future Impact on Organizations

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    This project focuses on the business application of cloud computing, both at present and in the future. This investigation aims to assist business users of cloud computing services to improve the perception of cloud computing, to assess the value of their cloud computing service relationships, and to assist in selecting appropriate cloud computing services. This project bases its information on the existing cloud computing technology to clarify the technical aspects of current cloud services and companies. It presents the key elements of conception of cloud computing, its definitions, main service models, and implementation types. Ultimately, this paper analyzes the cons and pros of cloud computing based on business using cases. Also, this paper includes a demonstration to display the process of the cloud vendor providing service

    Photonic packaging: transforming silicon photonic integrated circuits into photonic devices

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    Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved

    Steering Capital: Optimizing Financial Support for Innovation in Public Education

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    Examines efforts to align capital to education innovation and calls for clarity and agreement on problems, goals, and metrics; an effective R&D system; an evidence-based culture of continuous improvement; and transparent, comparable, and useful data

    Membrane Deflection-based Fabrication and Design Automation for Integrated Acoustofluidics

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    Continuous-flow microfluidic large-scale integration (mLSI) is a developing field first introduced in the early 2000s, that continues to offer promising solutions to many biochemical, biophysical and biomedical problems. In his seminal paper, Thorsen et al. 2002 demonstrated the fabrication of high-density microfluidic systems capable of complex fluidic routing in combinatory arrays of multiplexors, mixers, and storage assemblies integrated with micromechanical valves. mLSI has been a powerful tool for scientific research by allowing for dramatic reduction in the volume of reagent needed for experimentation and offering highly parallelizable and dynamic process flows. These systems have since been the focus of strong interdisciplinary academic research efforts. Despite the success in scientific applications, the mLSI technologies have not found widespread use in commercial environments. One critical issue preventing mLSI to realize its full potential is the need for specialized fabrication techniques that are scalable and more suitable for the unique requirements of biology. The work presented here demonstrates an mLSI integrated acoustofluidic platform that offers versatility while maintaining a robust fabrication process. In particular, conductive liquid metal-based acoustic transducers integrated with micromechanical valves to facilitate dynamic switching of the resonant frequency of the device and generated surface acoustic waves (SAWs) is demonstrated. Shortcomings in the fabrication of fluidic channels for mLSI integrated acoustofluidic applications are examined, and solutions to these problems are presented. A novel and scalable soft-lithographic method is introduced, that allows for the fabrication of large valvable channels with tunable height that exceeds practical limitations dictated by previous photolithographic techniques. A thorough characterization of this method and demonstration of its robustness are included here as a promising data to promote further exploration of the technique as a viable commercial solution for the fabrication of many classes of mLSI bio-devices. The testing of a computeraided design software, Columba, is briefly discussed

    Analysis of WIMAX/BWA Licensing in India: A real option approach

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    Indian Internet and broadband market has experienced very slow growth and limited penetration till now. The introduction of Broadband Wireless Access (BWA) is expected to aid in increasing the penetration of internet and broadband in India. The report sheds light on the guidelines and procedure used in 4G/BWA spectrum auction and presents comparative analysis of the competing technologies, providing the information about suitability of each technology available. Recently held 4G/ BWA spectrum auction saw enthusiastic participation by the industry and even saw some new entrants in Indian broadband market. Government benefited by Rs, 385bn that it earned as revenue from the auction of the spectrum and projected it as successful auction. However, the question remains if the auctions were efficient and whether they led to creation of value or will it prove to be burden to the telecom operators and will depress their balance sheet for years to come. The report uses both traditional valuation methods such as Discounted Cash Flow as well as Real Option approach to answer such questions. Using DCF analysis, the broadband subscribers have been forecasted to grow from present 13.77mn to 544mn by the end of 2025. The wireless subscribers are forecasted to be 70% of the total broadband subscribers after 5 years of roll out as it will be difficult to replace all wireline subscribers with wireless subscribers in India due to the high cost of wireless broadband and new technology. WiMAX is expected to increase its presence with time and reach 90mn subscribers from meager 0.35mn subscribers by 2025. Using industry wide cost of capital as 12.05%, the Net Present Value has been found Rs 221bn aggregate with an IRR of 17.1%. Using Real option approach, the value of license has been calculated as Rs 437bn which is 13.5% more than the spectrum fees paid by the operators. This mismatch, between the auction value and the correct value that should have been discovered by supply-demand dynamics, can be due to limited participants in BWA spectrum auctions and companies such as TATA and Reliance opting out of the auction process midway as well as uncertainty about acceptance of new technology with Indian subscribers.WiMAX, broadband, 3G spectrum, 4G,broadband wireless access, valuation, licensing, real option
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