13 research outputs found

    Static random-access memory designs based on different FinFET at lower technology node (7nm)

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    Title from PDF of title page viewed January 15, 2020Thesis advisor: Masud H ChowdhuryVitaIncludes bibliographical references (page 50-57)Thesis (M.S.)--School of Computing and Engineering. University of Missouri--Kansas City, 2019The Static Random-Access Memory (SRAM) has a significant performance impact on current nanoelectronics systems. To improve SRAM efficiency, it is important to utilize emerging technologies to overcome short-channel effects (SCE) of conventional CMOS. FinFET devices are promising emerging devices that can be utilized to improve the performance of SRAM designs at lower technology nodes. In this thesis, I present detail analysis of SRAM cells using different types of FinFET devices at 7nm technology. From the analysis, it can be concluded that the performance of both 6T and 8T SRAM designs are improved. 6T SRAM achieves a 44.97% improvement in the read energy compared to 8T SRAM. However, 6T SRAM write energy degraded by 3.16% compared to 8T SRAM. Read stability and write ability of SRAM cells are determined using Static Noise Margin and N- curve methods. Moreover, Monte Carlo simulations are performed on the SRAM cells to evaluate process variations. Simulations were done in HSPICE using 7nm Asymmetrical Underlap FinFET technology. The quasiplanar FinFET structure gained considerable attention because of the ease of the fabrication process [1] – [4]. Scaling of technology have degraded the performance of CMOS designs because of the short channel effects (SCEs) [5], [6]. Therefore, there has been upsurge in demand for FinFET devices for emerging market segments including artificial intelligence and cloud computing (AI) [8], [9], Internet of Things (IoT) [10] – [13] and biomedical [17] –[18] which have their own exclusive style of design. In recent years, many Underlapped FinFET devices were proposed to have better control of the SCEs in the sub-nanometer technologies [3], [4], [19] – [33]. Underlap on either side of the gate increases effective channel length as seen by the charge carriers. Consequently, the source-to-drain tunneling probability is improved. Moreover, edge direct tunneling leakage components can be reduced by controlling the electric field at the gate-drain junction . There is a limitation on the extent of underlap on drain or source sides because the ION is lower for larger underlap. Additionally, FinFET based designs have major width quantization issue. The width of a FinFET device increases only in quanta of silicon fin height (HFIN) [4]. The width quantization issue becomes critical for ratioed designs like SRAMs, where proper sizing of the transistors is essential for fault-free operation. FinFETs based on Design/Technology Co-Optimization (DTCO_F) approach can overcome these issues [38]. DTCO_F follows special design rules, which provides the specifications for the standard SRAM cells with special spacing rules and low leakages. The performances of 6T SRAM designs implemented by different FinFET devices are compared for different pull-up, pull down and pass gate transistor (PU: PD:PG) ratios to identify the best FinFET device for high speed and low power SRAM applications. Underlapped FinFETs (UF) and Design/Technology Co-Optimized FinFETs (DTCO_F) are used for the design and analysis. It is observed that with the PU: PD:PG ratios of 1:1:1 and 1:5:2 for the UF-SRAMs the read energy has degraded by 3.31% and 48.72% compared to the DTCO_F-SRAMs, respectively. However, the read energy with 2:5:2 ratio has improved by 32.71% in the UF-SRAM compared to the DTCO_F-SRAMs. The write energy with 1:1:1 configuration has improved by 642.27% in the UF-SRAM compared to the DTCO_F-SRAM. On the other hand, the write energy with 1:5:2 and 2:5:2 configurations have degraded by 86.26% and 96% in the UF-SRAMs compared to the DTCO_F-SRAMs. The stability and reliability of different SRAMs are also evaluated for 500mV supply. From the analysis, it can be concluded that Asymmetrical Underlapped FinFET is better for high-speed applications and DTCO FinFET for low power applications.Introduction -- Next generation high performance device: FinFET -- FinFET based SRAM bitcell designs -- Benchmarking of UF-SRAMs and DTCO-F-SRAMS -- Collaborative project -- Internship experience at INTEL and Marvell Semiconductor -- Conclusion and future wor

    Study and development of low power consumption SRAMs on 28 nm FD-SOI CMOS process

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    Since analog circuit designs in CMOS nanometer (< 90 nm) nodes can be substantially affected by manufacturing process variations, circuit performance becomes more challenging to achieve efficient solutions by using analytical models. Extensive simulations are thus commonly required to provide a high yield. On the other hand, due to the fact that the classical bulk MOS structure is reaching scaling limits (< 32 nm), alternative approaches are being developed as successors, such as fully depleted silicon-oninsulator (FD-SOI), Multigate MOSFET, FinFETs, among others, and new design techniques emerge by taking advantage of the improved features of these devices. This thesis focused on the development of analytical expressions for the major performance parameters of the SRAM cache implemented in 28 nm FD-SOI CMOS, mainly to explore the transistor dimensions at low computational cost, thereby producing efficient designs in terms of energy consumption, speed and yield. By taking advantage of both low computational cost and close agreement results of the developed models, in this thesis we were able to propose a non-traditional sizing procedure for the simple 6T-SRAM cell, that unlike the traditional thin-cell design, transistor lengths are used as a design variable in order to reduce the static leakage. The single-P-well (SPW) structure in combination with reverse-body-biasing (RBB) technique were used to achieve a better balance between P-type and N-type transistors. As a result, we developed a 128 kB SRAM cache, whose post-layout simulations show that the circuit consumes an average energy per operation of 0.604 pJ/word-access (64 I/O bits) at supply voltage of 0.45 V and operation frequency of 40 MHz. The total chip area of the 128 kB SRAM cache is 0.060 mm2 .O projeto de circuitos analogicos em processos nanométricos CMOS ( < 90 nm) per substancialmente afetado pelas variacões do processo de fabricacão, sendo cada vez mais desafiador para os projetistas alcançar soluções eficientes no desempenho dos circuitos mediante o uso de modelos analíticos. Simulacões extensas com alto custo com- putacional sao normalmente requeridas para providenciar um correto funcionamento do circuito. Por outro lado, devido ao fato que a estrutura bulk-CMOS esta alcançando seus limites de escala (< 32 nm), outros transistores foram desenvolvidos como sucessores, tais como o fully depleted silicon-on-insulator (FD-SOI), Multigate MOSFET, entre outros, surgindo novas tecnicas de projeto que utilizam as características aprimoradas destes dispositivos. Dessa forma, esta tese de doutorado se foca no desenvolvimento de modelos analíticos dos parametros mais importantes do cache SRAM implementado em processo CMOS FD-SOI de 28 nm, principalmente para explorar as dimensõoes dos transistores com baixo custo computacional, e assim produzir solucões eficientes em termos de consumo de energia, velocidade e rendimento. Aproveitando o baixo custo computacional e a alta concordância dos modelos analíticos, nesta tese fomos capazes de propor um dimensionamento nao tradicional para a célula de memória 6T-SRAM, em que diferentemente é do classico dimensionamento "thin-cell”, os comprimentos dos transistores são utilizados como variável de projeto com o fim de reduzir o consumo estático de corrente. A estrutura single-P-well (SPW), combinada com a técnica reverse-body-biasing (RBB) foram utilizadas para alcançar um melhor balanço entre as correntes específicas dos transistores do tipo P e N

    ULTRA ENERGY-EFFICIENT SUB-/NEAR-THRESHOLD COMPUTING: PLATFORM AND METHODOLOGY

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    Ph.DDOCTOR OF PHILOSOPH

    Energy efficient core designs for upcoming process technologies

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    Energy efficiency has been a first order constraint in the design of micro processors for the last decade. As Moore's law sunsets, new technologies are being actively explored to extend the march in increasing the computational power and efficiency. It is essential for computer architects to understand the opportunities and challenges in utilizing the upcoming process technology trends in order to design the most efficient processors. In this work, we consider three process technology trends and propose core designs that are best suited for each of the technologies. The process technologies are expected to be viable over a span of timelines. We first consider the most popular method currently available to improve the energy efficiency, i.e. by lowering the operating voltage. We make key observations regarding the limiting factors in scaling down the operating voltage for general purpose high performance processors. Later, we propose our novel core design, ScalCore, one that can work in high performance mode at nominal Vdd, and in a very energy-efficient mode at low Vdd. The resulting core design can operate at much lower voltages providing higher parallel performance while consuming lower energy. While lowering Vdd improves the energy efficiency, CMOS devices are fundamentally limited in their low voltage operation. Therefore, we next consider an upcoming device technology -- Tunneling Field-Effect Transistors (TFETs), that is expected to supplement CMOS device technology in the near future. TFETs can attain much higher energy efficiency than CMOS at low voltages. However, their performance saturates at high voltages and, therefore, cannot entirely replace CMOS when high performance is needed. Ideally, we desire a core that is as energy-efficient as TFET and provides as much performance as CMOS. To reach this goal, we characterize the TFET device behavior for core design and judiciously integrate TFET units, CMOS units in a single core. The resulting core, called HetCore, can provide very high energy efficiency while limiting the slowdown when compared to a CMOS core. Finally, we analyze Monolithic 3D (M3D) integration technology that is widely considered to be the only way to integrate more transistors on a chip. We present the first analysis of the architectural implications of using M3D for core design and show how to partition the core across different layers. We also address one of the key challenges in realizing the technology, namely, the top layer performance degradation. We propose a critical path based partitioning for logic stages and asymmetric bit/port partitioning for storage stages. The result is a core that performs nearly as well as a core without any top layer slowdown. When compared to a 2D baseline design, an M3D core not only provides much higher performance, it also reduces the energy consumption at the same time. In summary, this thesis addresses one of the fundamental challenges in computer architecture -- overcoming the fact that CMOS is not scaling anymore. As we increase the computing power on a single chip, our ability to power the entire chip keeps decreasing. This thesis proposes three solutions aimed at solving this problem over different timelines. Across all our solutions, we improve energy efficiency without compromising the performance of the core. As a result, we are able to operate twice as many cores with in the same power budget as regular cores, significantly alleviating the problem of dark silicon

    Low power digital baseband core for wireless Micro-Neural-Interface using CMOS sub/near-threshold circuit

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    This thesis presents the work on designing and implementing a low power digital baseband core with custom-tailored protocol for wirelessly powered Micro-Neural-Interface (MNI) System-on-Chip (SoC) to be implanted within the skull to record cortical neural activities. The core, on the tag end of distributed sensors, is designed to control the operation of individual MNI and communicate and control MNI devices implanted across the brain using received downlink commands from external base station and store/dump targeted neural data uplink in an energy efficient manner. The application specific protocol defines three modes (Time Stamp Mode, Streaming Mode and Snippet Mode) to extract neural signals with on-chip signal conditioning and discrimination. In Time Stamp Mode, Streaming Mode and Snippet Mode, the core executes basic on-chip spike discrimination and compression, real-time monitoring and segment capturing of neural signals so single spike timing as well as inter-spike timing can be retrieved with high temporal and spatial resolution. To implement the core control logic using sub/near-threshold logic, a novel digital design methodology is proposed which considers INWE (Inverse-Narrow-Width-Effect), RSCE (Reverse-Short-Channel-Effect) and variation comprehensively to size the transistor width and length accordingly to achieve close-to-optimum digital circuits. Ultra-low-power cell library containing 67 cells including physical cells and decoupling capacitor cells using the optimum fingers is designed, laid-out, characterized, and abstracted. A robust on-chip sense-amp-less SRAM memory (8X32 size) for storing neural data is implemented using 8T topology and LVT fingers. The design is validated with silicon tapeout and measurement shows the digital baseband core works at 400mV and 1.28 MHz system clock with an average power consumption of 2.2 μW, resulting in highest reported communication power efficiency of 290Kbps/μW to date

    Digital-Based Analog Processing in Nanoscale CMOS ICs for IoT Applications

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    L'abstract è presente nell'allegato / the abstract is in the attachmen

    Caractérisation, mécanismes et applications mémoire des transistors avancés sur SOI

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    Ce travail présente les principaux résultats obtenus avec une large gamme de dispositifs SOI avancés, candidats très prometteurs pour les futurs générations de transistors MOSFETs. Leurs propriétés électriques ont été analysées par des mesures systématiques, agrémentées par des modèles analytiques et/ou des simulations numériques. Nous avons également proposé une utilisation originale de dispositifs FinFETs fabriqués sur ONO enterré en fonctionnalisant le ONO à des fins d'application mémoire non volatile, volatile et unifiées. Après une introduction sur l'état de l'art des dispositifs avancés en technologie SOI, le deuxième chapitre a été consacré à la caractérisation détaillée des propriétés de dispositifs SOI planaires ultra- mince (épaisseur en dessous de 7 nm) et multi-grille. Nous avons montré l excellent contrôle électrostatique par la grille dans les transistors très courts ainsi que des effets intéressants de transport et de couplage. Une approche similaire a été utilisée pour étudier et comparer des dispositifs FinFETs à double grille et triple grille. Nous avons démontré que la configuration FinFET double grille améliore le couplage avec la grille arrière, phénomène important pour des applications à tension de seuil multiple. Nous avons proposé des modèles originaux expliquant l'effet de couplage 3D et le comportement de la mobilité dans des TFTs nanocristallin ZnO. Nos résultats ont souligné les similitudes et les différences entre les transistors SOI et à base de ZnO. Des mesures à basse température et de nouvelles méthodes d'extraction ont permis d'établir que la mobilité dans le ZnO et la qualité de l'interface ZnO/SiO2 sont remarquables. Cet état de fait ouvre des perspectives intéressantes pour l'utilisation de ce type de matériaux aux applications innovantes de l'électronique flexible. Dans le troisième chapitre, nous nous sommes concentrés sur le comportement de la mobilité dans les dispositifs SOI planaires et FinFET en effectuant des mesures de magnétorésistance à basse température. Nous avons mis en évidence expérimentalement un comportement de mobilité inhabituel (multi-branche) obtenu lorsque deux ou plusieurs canaux coexistent et interagissent. Un autre résultat original concerne l existence et l interprétation de la magnétorésistance géométrique dans les FinFETs.L'utilisation de FinFETs fabriqués sur ONO enterré en tant que mémoire non volatile flash a été proposée dans le quatrième chapitre. Deux mécanismes d'injection de charge ont été étudiés systématiquement. En plus de la démonstration de la pertinence de ce type mémoire en termes de performances (rétention, marge de détection), nous avons mis en évidence un comportement inattendu : l amélioration de la marge de détection pour des dispositifs à canaux courts. Notre concept innovant de FinFlash sur ONO enterré présente plusieurs avantages: (i) opération double-bit et (ii) séparation de la grille de stockage et de l'interface de lecture augmentant la fiabilité et autorisant une miniaturisation plus poussée que des Finflash conventionnels avec grille ONO.Dans le dernier chapitre, nous avons exploré le concept de mémoire unifiée, en combinant les opérations non volatiles et 1T-DRAM par le biais des FinFETs sur ONO enterré. Comme escompté pour les mémoires dites unifiées, le courant transitoire en mode 1T-DRAM dépend des charges non volatiles stockées dans le ONO. D'autre part, nous avons montré que les charges piégées dans le nitrure ne sont pas perturbées par les opérations de programmation et lecture de la 1T-DRAM. Les performances de cette mémoire unifiée multi-bits sont prometteuses et pourront être considérablement améliorées par optimisation technologique de ce dispositif.The evolution of electronic systems and portable devices requires innovation in both circuit design and transistor architecture. During last fifty years, the main issue in MOS transistor has been the gate length scaling down. The reduction of power consumption together with the co-integration of different functions is a more recent avenue. In bulk-Si planar technology, device shrinking seems to arrive at the end due to the multiplication of parasitic effects. The relay has been taken by novel SOI-like device architectures. In this perspective, this manuscript presents the main achievements of our work obtained with a variety of advanced fully depleted SOI MOSFETs, which are very promising candidates for next generation MOSFETs. Their electrical properties have been analyzed by systematic measurements and clarified by analytical models and/or simulations. Ultimately, appropriate applications have been proposed based on their beneficial features.In the first chapter, we briefly addressed the short-channel effects and the diverse technologies to improve device performance. The second chapter was dedicated to the detailed characterization and interesting properties of SOI devices. We have demonstrated excellent gate control and high performance in ultra-thin FD SOI MOSFET. The SCEs are efficiently suppressed by decreasing the body thickness below 7 nm. We have investigated the transport and electrostatic properties as well as the coupling mechanisms. The strong impact of body thickness and temperature range has been outlined. A similar approach was used to investigate and compare vertical double-gate and triple-gate FinFETs. DG FinFETs show enhanced coupling to back-gate bias which is applicable and suitable for dynamic threshold voltage tuning. We have proposed original models explaining the 3D coupling effect in FinFETs and the mobility behavior in ZnO TFTs. Our results pointed on the similarities and differences in SOI and ZnO transistors. According to our low-temperature measurements and new promoted extraction methods, the mobility in ZnO and the quality of ZnO/SiO2 interface are respectable, enabling innovating applications in flexible, transparent and power electronics. In the third chapter, we focused on the mobility behavior in planar SOI and FinFET devices by performing low-temperature magnetoresistance measurements. Unusual mobility curve with multi-branch aspect were obtained when two or more channels coexist and interplay. Another original result in the existence of the geometrical magnetoresistance in triple-gate and even double-gate FinFETs.The operation of a flash memory in FinFETs with ONO buried layer was explored in the forth chapter. Two charge injection mechanisms were proposed and systematically investigated. We have discussed the role of device geometry and temperature. Our novel ONO FinFlash concept has several distinct advantages: double-bit operation, separation of storage medium and reading interface, reliability and scalability. In the final chapter, we explored the avenue of unified memory, by combining nonvolatile and 1T-DRAM operations in a single transistor. The key result is that the transient current, relevant for 1T-DRAM operation, depends on the nonvolatile charges stored in the nitride buried layer. On the other hand, the trapped charges are not disturbed by the 1T-DRAM operation. Our experimental data offers the proof-of-concept for such advanced memory. The performance of the unified/multi-bit memory is already decent but will greatly improve in the coming years by processing dedicated devices.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

    Digital-based analog processing in nanoscale CMOS ICs for IoT applications

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    The Internet-of-Things (IoT) concept has been opening up a variety of applications, such as urban and environmental monitoring, smart health, surveillance, and home automation. Most of these IoT applications require more and more power/area efficient Complemen tary Metal–Oxide–Semiconductor (CMOS) systems and faster prototypes (lower time-to market), demanding special modifications in the current IoT design system bottleneck: the analog/RF interfaces. Specially after the 2000s, it is evident that there have been significant improvements in CMOS digital circuits when compared to analog building blocks. Digital circuits have been taking advantage of CMOS technology scaling in terms of speed, power consump tion, and cost, while the techniques running behind the analog signal processing are still lagging. To decrease this historical gap, there has been an increasing trend in finding alternative IC design strategies to implement typical analog functions exploiting Digital in-Concept Design Methodologies (DCDM). This idea of re-thinking analog functions in digital terms has shown that Analog ICs blocks can also avail of the feature-size shrinking and energy efficiency of new technologies. This thesis deals with the development of DCDM, demonstrating its compatibility for Ultra-Low-Voltage (ULV) and Power (ULP) IoT applications. This work proves this state ment through the proposing of new digital-based analog blocks, such as an Operational Transconductance Amplifiers (OTAs) and an ac-coupled Bio-signal Amplifier (BioAmp). As an initial contribution, for the first time, a silicon demonstration of an embryonic Digital-Based OTA (DB-OTA) published in 2013 is exhibited. The fabricated DB-OTA test chip occupies a compact area of 1,426 µm2 , operating at supply voltages (VDD) down to 300 mV, consuming only 590 pW while driving a capacitive load of 80pF. With a Total Harmonic Distortion (THD) lower than 5% for a 100mV input signal swing, its measured small-signal figure of merit (FOMS) and large-signal figure of merit (FOML) are 2,101 V −1 and 1,070, respectively. To the best of this thesis author’s knowledge, this measured power is the lowest reported to date in OTA literature, and its figures of merit are the best in sub-500mV OTAs reported to date. As the second step, mainly due to the robustness limitation of previous DB-OTA, a novel calibration-free digital-based topology is proposed, named here as Digital OTA (DIG OTA). A 180-nm DIGOTA test chip is also developed exhibiting an area below the 1000 µm2 wall, 2.4nW power under 150pF load, and a minimum VDD of 0.25 V. The proposed DIGOTA is more digital-like compared with DB-OTA since no pseudo-resistor is needed. As the last contribution, the previously proposed DIGOTA is then used as a building block to demonstrate the operation principle of power-efficient ULV and ultra-low area (ULA) fully-differential, digital-based Operational Transconductance Amplifier (OTA), suitable for microscale biosensing applications (BioDIGOTA) such as extreme low area Body Dust. Measured results in 180nm CMOS confirm that the proposed BioDIGOTA can work with a supply voltage down to 400 mV, consuming only 95 nW. The BioDIGOTA layout occupies only 0.022 mm2 of total silicon area, lowering the area by 3.22X times compared to the current state of the art while keeping reasonable system performance, such as 7.6 Noise Efficiency Factor (NEF) with 1.25 µVRMS input-referred noise over a 10 Hz bandwidth, 1.8% of THD, 62 dB of the common-mode rejection ratio (CMRR) and 55 dB of power supply rejection ratio (PSRR). After reviewing the current DCDM trend and all proposed silicon demonstrations, the thesis concludes that, despite the current analog design strategies involved during the analog block development
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