59,205 research outputs found

    Modelling the Self-Assembly of Virus Capsids

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    We use computer simulations to study a model, first proposed by Wales [1], for the reversible and monodisperse self-assembly of simple icosahedral virus capsid structures. The success and efficiency of assembly as a function of thermodynamic and geometric factors can be qualitatively related to the potential energy landscape structure of the assembling system. Even though the model is strongly coarse-grained, it exhibits a number of features also observed in experiments, such as sigmoidal assembly dynamics, hysteresis in capsid formation and numerous kinetic traps. We also investigate the effect of macromolecular crowding on the assembly dynamics. Crowding agents generally reduce capsid yields at optimal conditions for non-crowded assembly, but may increase yields for parameter regimes away from the optimum. Finally, we generalize the model to a larger triangulation number T = 3, and observe more complex assembly dynamics than that seen for the original T = 1 model.Comment: 16 pages, 11 figure

    Nature-Inspired Interconnects for Self-Assembled Large-Scale Network-on-Chip Designs

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    Future nano-scale electronics built up from an Avogadro number of components needs efficient, highly scalable, and robust means of communication in order to be competitive with traditional silicon approaches. In recent years, the Networks-on-Chip (NoC) paradigm emerged as a promising solution to interconnect challenges in silicon-based electronics. Current NoC architectures are either highly regular or fully customized, both of which represent implausible assumptions for emerging bottom-up self-assembled molecular electronics that are generally assumed to have a high degree of irregularity and imperfection. Here, we pragmatically and experimentally investigate important design trade-offs and properties of an irregular, abstract, yet physically plausible 3D small-world interconnect fabric that is inspired by modern network-on-chip paradigms. We vary the framework's key parameters, such as the connectivity, the number of switch nodes, the distribution of long- versus short-range connections, and measure the network's relevant communication characteristics. We further explore the robustness against link failures and the ability and efficiency to solve a simple toy problem, the synchronization task. The results confirm that (1) computation in irregular assemblies is a promising and disruptive computing paradigm for self-assembled nano-scale electronics and (2) that 3D small-world interconnect fabrics with a power-law decaying distribution of shortcut lengths are physically plausible and have major advantages over local 2D and 3D regular topologies
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