Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

High-performance and Low-power Clock Network Synthesis in the Presence of Variation.

Semiconductor technology scaling requires continuous evolution of all aspects of physical design of integrated circuits. Among the major design steps, clock-network synthesis has been greatly affected by technology scaling, rendering existing methodologies inadequate. Clock routing was previously sufficient for smaller ICs, but design difficulty and structural complexity have greatly increased as interconnect delay and clock frequency increased in the 1990s. Since a clock network directly influences IC performance and often consumes a substantial portion of total power, both academia and industry developed synthesis methodologies to achieve low skew, low power and robustness from PVT variations. Nevertheless, clock network synthesis under tight constraints is currently the least automated step in physical design and requires significant manual intervention, undermining turn-around-time. The need for multi-objective optimization over a large parameter space and the increasing impact of process variation make clock network synthesis particularly challenging. Our work identifies new objectives, constraints and concerns in the clock-network synthesis for systems-on-chips and microprocessors. To address them, we generate novel clock-network structures and propose changes in traditional physical-design flows. We develop new modeling techniques and algorithms for clock power optimization subject to tight skew constraints in the presence of process variations. In particular, we offer SPICE-accurate optimizations of clock networks, coordinated to reduce nominal skew below 5 ps, satisfy slew constraints and trade-off skew, insertion delay and power, while tolerating variations. To broaden the scope of clock-network-synthesis optimizations, we propose new techniques and a methodology to reduce dynamic power consumption by 6.8%-11.6% for large IC designs with macro blocks by integrating clock network synthesis within global placement. We also present a novel non-tree topology that is 2.3x more power-efficient than mesh structures. We fuse several clock trees to create large-scale redundancy in a clock network to bridge the gap between tree-like and mesh-like topologies. Integrated optimization techniques for high-quality clock networks described in this dissertation strong empirical results in experiments with recent industry-released benchmarks in the presence of process variation. Our software implementations were recognized with the first-place awards at the ISPD 2009 and ISPD 2010 Clock-Network Synthesis Contests organized by IBM Research and Intel Research.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/89711/1/ejdjsy_1.pd

Within-Die Delay Variation Measurement And Analysis For Emerging Technologies Using An Embedded Test Structure

Both random and systematic within-die process variations (PV) are growing more severe with shrinking geometries and increasing die size. Escalation in the variations in delay and power with reductions in feature size places higher demands on the accuracy of variation models. Their availability can be used to improve yield, and the corresponding profitability and product quality of the fabricated integrated circuits (ICs). Sources of within-die variations include optical source limitations, and layout-based systematic effects (pitch, line-width variability, and microscopic etch loading). Unfortunately, accurate models of within-die PVs are becoming more difficult to derive because of their increasingly sensitivity to design-context. Embedded test structures (ETS) continue to play an important role in the development of models of PVs and as a mechanism to improve correlations between hardware and models. Variations in path delays are increasing with scaling, and are increasingly affected by neighborhood\u27 interactions. In order to fully characterize within-die variations, delays must be measured in the context of actual core-logic macros. Doing so requires the use of an embedded test structure, as opposed to traditional scribe line test structures such as ring oscillators (RO). Accurate measurements of within-die variations can be used, e.g., to better tune models to actual hardware (model-to-hardware correlations). In this research project, I propose an embedded test structure called REBEL (Regional dELay BEhavior) that is designed to measure path delays in a minimally invasive fashion; and its architecture measures the path delays more accurately. Design for manufacture-ability (DFM) analysis is done on the on 90 nm ASIC chips and 28nm Zynq 7000 series FPGA boards. I present ASIC results on within-die path delay variations in a floating-point unit (FPU) fabricated in IBM\u27s 90 nm technology, with 5 pipeline stages, used as a test vehicle in chip experiments carried out at nine different temperature/voltage (TV) corners. Also experimental data has been analyzed for path delay variations in short vs long paths. FPGA results on within-die variation and die-to-die variations on Advanced Encryption System (AES) using single pipelined stage are also presented. Other analysis that have been performed on the calibrated path delays are Flip Flop propagation delays for both rising and falling edge (tpHL and tpLH), uncertainty analysis, path distribution analysis, short versus long path variations and mid-length path within-die variation. I also analyze the impact on delay when the chips are subjected to industrial-level temperature and voltage variations. From the experimental results, it has been established that the proposed REBEL provides capabilities similar to an off-chip logic analyzer, i.e., it is able to capture the temporal behavior of the signal over time, including any static and dynamic hazards that may occur on the tested path. The ASIC results further show that path delays are correlated to the launch-capture (LC) interval used to time them. Therefore, calibration as proposed in this work must be carried out in order to obtain an accurate analysis of within-die variations. Results on ASIC chips show that short paths can vary up to 35% on average, while long paths vary up to 20% at nominal temperature and voltage. A similar trend occurs for within-die variations of mid-length paths where magnitudes reduced to 20% and 5%, respectively. The magnitude of delay variations in both these analyses increase as temperature and voltage are changed to increase performance. The high level of within-die delay variations are undesirable from a design perspective, but they represent a rich source of entropy for applications that make use of \u27secrets\u27 such as authentication, hardware metering and encryption. Physical unclonable functions (PUFs) are a class of primitives that leverage within-die-variations as a means of generating random bit strings for these types of applications, including hardware security and trust. Zynq FPGAs Die-to-Die and within-die variation study shows that on average there is 5% of within-Die variation and the range of die-to-Die variation can go upto 3ns. The die-to-Die variations can be explored in much further detail to study the variations spatial dependance. Additionally, I also carried out research in the area data mining to cater for big data by focusing the work on decision tree classification (DTC) to speed-up the classification step in hardware implementation. For this purpose, I devised a pipelined architecture for the implementation of axis parallel binary decision tree classification for meeting up with the requirements of execution time and minimal resource usage in terms of area. The motivation for this work is that analyzing larger data-sets have created abundant opportunities for algorithmic and architectural developments, and data-mining innovations, thus creating a great demand for faster execution of these algorithms, leading towards improving execution time and resource utilization. Decision trees (DT) have since been implemented in software programs. Though, the software implementation of DTC is highly accurate, the execution times and the resource utilization still require improvement to meet the computational demands in the ever growing industry. On the other hand, hardware implementation of DT has not been thoroughly investigated or reported in detail. Therefore, I propose a hardware acceleration of pipelined architecture that incorporates the parallel approach in acquiring the data by having parallel engines working on different partitions of data independently. Also, each engine is processing the data in a pipelined fashion to utilize the resources more efficiently and reduce the time for processing all the data records/tuples. Experimental results show that our proposed hardware acceleration of classification algorithms has increased throughput, by reducing the number of clock cycles required to process the data and generate the results, and it requires minimal resources hence it is area efficient. This architecture also enables algorithms to scale with increasingly large and complex data sets. We developed the DTC algorithm in detail and explored techniques for adapting it to a hardware implementation successfully. This system is 3.5 times faster than the existing hardware implementation of classification.\u2

Design methodologies for variation-aware integrated circuits

The scaling of VLSI technology has spurred a rapid growth in the semiconductor industry. With the CMOS device dimension scaling to and beyond 90nm technology, it is possible to achieve higher performance and to pack more complex functionalities on a single chip. However, the scaling trend has introduced drastic variation of process and design parameters, leading to severe variability of chip performance in nanometer regime. Also, the manufacturing community projects CMOS will scale for three to four more generations. Since the uncertainties due to variations are expected to increase in each generation, it will significantly impact the performance of design and consequently the yield. Another challenging issue in the nanometer IC design is the high power consumption due to the greater packing density, higher frequency of operation and excessive leakage power. Moreover, the circuits are usually over-designed to compensate for uncertainties due to variations. The over-designed circuits not only make timing closure difficult but also cause excessive power consumption. For portable electronics, excessive power consumption may reduce battery life; for non-portable systems it may impose great difficulties in cooling and packaging. The objective of my research has been to develop design methodologies to address variations and power dissipation for reliable circuit operation. The proposed work has been divided into three parts: the first part addresses the issues related with power/ground noise induced by clock distribution network and proposes techniques to reduce power/ground noise considering the effects of process variations. The second part proposes an elastic pipeline scheme for random circuits with feedback loops. The proposed scheme provides a low-power solution that has the same variation tolerance as the conventional approaches. The third section deals with discrete buffer and wire sizing for link-based non-tree clock network, which is an energy efficient structure for skew tolerance to variations. For the power/ground noise problem, our approach could reduce the peak current and the delay variations by 50% and 51% respectively. Compared to conventional approach, the elastic timing scheme reduces power dissipation by 20% − 27%. The sizing method achieves clock skew reduction of 45% with a small increase in power dissipation

Variability-Aware VLSI Design Automation For Nanoscale Technologies

As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging due to shrinking feature sizes and increasing design complexity. Aggressive scaling causes significant degradation in reliability, increased susceptibility to fabrication and environmental randomness and increased dynamic and leakage power dissipation. In this work, we investigate these scaling issues in large scale integrated systems. This dissertation proposes to develop variability-aware design methodologies by proposing design analysis, design-time optimization, post-silicon tunability and runtime-adaptivity based optimization techniques for handling variability. We discuss our research in the area of variability-aware analysis, specifically focusing on the problem of statistical timing analysis. The first technique presents the concept of error budgeting that achieves significant runtime speedups during statistical timing analysis. The second work presents a general framework for non-linear non-Gaussian statistical timing analysis considering correlations. Further, we present our work on design-time optimization schemes that are applicable during physical synthesis. Firstly, we present a buffer insertion technique that considers wire-length uncertainty and proposes algorithms to perform probabilistic buffer insertion. Secondly, we present a stochastic optimization framework based on Monte-Carlo technique considering fabrication variability. This optimization framework can be applied to problems that can be modeled as linear programs without without imposing any assumptions on the nature of the variability. Subsequently, we present our work on post-silicon tunability based design optimization. This work presents a design management framework that can be used to balance the effort spent on pre-silicon (through gate sizing) and post-silicon optimization (through tunable clock-tree buffers) while maximizing the yield gains. Lastly, we present our work on variability-aware runtime optimization techniques. We look at the problem of runtime supply voltage scaling for dynamic power optimization, and propose a framework to consider the impact of variability on the reliability of such designs. We propose a probabilistic design synthesis technique where reliability of the design is a primary optimization metric

A design flow for performance planning : new paradigms for iteration free synthesis

In conventional design, higher levels of synthesis produce a netlist, from which layout synthesis builds a mask specification for manufacturing. Timing anal ysis is built into a feedback loop to detect timing violations which are then used to update specifications to synthesis. Such iteration is undesirable, and for very high performance designs, infeasible. The problem is likely to become much worse with future generations of technology. To achieve a non-iterative design flow, early synthesis stages should use wire planning to distribute delays over the functional elements and interconnect, and layout synthesis should use its degrees of freedom to realize those delays

Low-swing signaling for energy efficient on-chip networks

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 65-69).On-chip networks have emerged as a scalable and high-bandwidth communication fabric in many-core processor chips. However, the energy consumption of these networks is becoming comparable to that of computation cores, making further scaling of core counts difficult. This thesis makes several contributions to low-swing signaling circuit design for the energy efficient on-chip networks in two separate projects: on-chip networks optimized for one-to-many multicasts and broadcasts, and link designs that allow on-chip networks to approach an ideal interconnection fabric. A low-swing crossbar switch, which is based on tri-state Reduced-Swing Drivers (RSDs), is presented for the first project. Measurement results of its test chip fabricated in 45nm SOI CMOS show that the tri-state RSD-based crossbar enables 55% power savings as compared to an equivalent full-swing crossbar and link. Also, the measurement results show that the proposed crossbar allows the broadcast-optimized on-chip networks using a single pipeline stage for physical data transmission to operate at 21% higher data rate, when compared with the full-swing networks. For the second project, two clockless low-swing repeaters, a Self-Resetting Logic Repeater (SRLR) and a Voltage-Locked Repeater (VLR), have been proposed and analyzed in simulation only. They both require no reference clock, differential signaling, and bias current. Such digital-intensive properties enable them to approach energy and delay performance of a point-to-point interconnect of variable lengths. Simulated in 45nm SOI CMOS, the 10mm SRLR featured with high energy efficiency consumes 338fJ/b at 5.4Gb/s/ch while the 10mm VLR raises its data rate up to 16.OGb/s/ch with 427fJ/b.by Sunghyun Park.S.M

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Clock routing for high performance microprocessor designs.

Tian, Haitong.Chinese abstract is on unnumbered page.Thesis (M.Phil.)--Chinese University of Hong Kong, 2011.Includes bibliographical references (p. 65-74).Abstracts in English and Chinese.Abstract --- p.iAcknowledgement --- p.iiiChapter 1 --- Introduction --- p.1Chapter 1.1 --- Motivations --- p.1Chapter 1.2 --- Our Contributions --- p.2Chapter 1.3 --- Organization of the Thesis --- p.3Chapter 2 --- Background Study --- p.4Chapter 2.1 --- Traditional Clock Routing Problem --- p.4Chapter 2.2 --- Tree-Based Clock Routing Algorithms --- p.5Chapter 2.2.1 --- Clock Routing Using H-tree --- p.5Chapter 2.2.2 --- Method of Means and Medians(MMM) --- p.6Chapter 2.2.3 --- Geometric Matching Algorithm (GMA) --- p.8Chapter 2.2.4 --- Exact Zero-Skew Algorithm --- p.9Chapter 2.2.5 --- Deferred Merge Embedding (DME) --- p.10Chapter 2.2.6 --- Boundary Merging and Embedding (BME) Algorithm --- p.14Chapter 2.2.7 --- Planar Clock Routing Algorithm --- p.17Chapter 2.2.8 --- Useful-skew Tree Algorithm --- p.18Chapter 2.3 --- Non-Tree Clock Distribution Networks --- p.19Chapter 2.3.1 --- Grid (Mesh) Structure --- p.20Chapter 2.3.2 --- Spine Structure --- p.20Chapter 2.3.3 --- Hybrid Structure --- p.21Chapter 2.4 --- Post-grid Clock Routing Problem --- p.22Chapter 2.5 --- Limitations of the Previous Work --- p.24Chapter 3 --- Post-Grid Clock Routing Problem --- p.26Chapter 3.1 --- Introduction --- p.26Chapter 3.2 --- Problem Definition --- p.27Chapter 3.3 --- Our Approach --- p.30Chapter 3.3.1 --- Delay-driven Path Expansion Algorithm --- p.31Chapter 3.3.2 --- Pre-processing to Connect Critical ports --- p.34Chapter 3.3.3 --- Post-processing to Reduce Capacitance --- p.36Chapter 3.4 --- Experimental Results --- p.39Chapter 3.4.1 --- Experiment Setup --- p.39Chapter 3.4.2 --- Validations of the Delay and Slew Estimation --- p.39Chapter 3.4.3 --- Comparisons with the Tree Grow (TG) Approach --- p.41Chapter 3.4.4 --- Lowest Achievable Delays --- p.42Chapter 3.4.5 --- Simulation Results --- p.42Chapter 4 --- Non-tree Based Post-Grid Clock Routing Problem --- p.44Chapter 4.1 --- Introduction --- p.44Chapter 4.2 --- Handling Ports with Large Load Capacitances --- p.46Chapter 4.2.1 --- Problem Ports Identification --- p.47Chapter 4.2.2 --- Non-Tree Construction --- p.47Chapter 4.2.3 --- Wire Link Selection --- p.48Chapter 4.3 --- Path Expansion in Non-tree Algorithm --- p.51Chapter 4.4 --- Limitations of the Non-tree Algorithm --- p.51Chapter 4.5 --- Experimental Results --- p.51Chapter 4.5.1 --- Experiment Setup --- p.51Chapter 4.5.2 --- Validations of the Delay and Slew Estimation --- p.52Chapter 4.5.3 --- Lowest Achievable Delays --- p.53Chapter 4.5.4 --- Results on New Benchmarks --- p.53Chapter 4.5.5 --- Simulation Results --- p.55Chapter 5 --- Efficient Partitioning-based Extension --- p.57Chapter 5.1 --- Introduction --- p.57Chapter 5.2 --- Partition-based Extension --- p.58Chapter 5.3 --- Experimental Results --- p.61Chapter 5.3.1 --- Experiment Setup --- p.61Chapter 5.3.2 --- Running Time Improvement with Partitioning Technique --- p.61Chapter 6 --- Conclusion --- p.63Bibliography --- p.6

Synthesis Methodologies for Robust and Reconfigurable Clock Networks

In today\u27s aggressively scaled technology nodes, billions of transistors are packaged into a single integrated circuit. Electronic Design Automation (EDA) tools are needed to automatically assemble the transistors into a functioning system. One of the most important design steps in the physical synthesis is the design of the clock network. The clock network delivers a synchronizing clock signal to each sequential element. The clock signal is required to be delivered meeting timing constraints under variations and in multiple operating modes. Synthesizing such clock networks is becoming increasingly difficult with the complex power management methodologies and severe manufacturing variations. Clock network synthesis is an important problem because it has a direct impact on the functional correctness, the maximum operating frequency, and the overall power consumption of each synchronous integrated circuit. In this dissertation, we proposed synthesis methodologies for robust and reconfigurable clock networks. We have made three contributions to this topic. First, we have proposed a clock network optimization framework that can achieve better timing quality than previous frameworks. Our proposed framework improves timing quality by reducing the propagation delay on critical paths in a clock network using buffer sizing and layer assignment. Second, we have proposed a clock tree synthesis methodology that integrates the clock tree synthesis with the clock tree optimization. The methodology improves timing quality by avoiding to synthesize clock trees with topologies that are sensitive to variations. Third, we have proposed a clock network that can reconfigure the topology based on the active mode of operation. Lastly, we conclude the dissertation with future research directions