Analysis and evaluation in the production process and equipment area of the low-cost solar array project

It was found that the Solarex metallization design and process selection should be modified to yield substantially higher output of the 10 cm x 10 cm cells, while the Westinghouse design is extremely close to the optimum. In addition, further attention to the Solarex pn junction and base high/low junction formation processes could be beneficial. For the future efficiency improvement, it was found that refinement of the various minority carrier lifetime measurement methods is needed, as well as considerably increased sophistication in the interpretation of the results of these methods. In addition, it was determined that further experimental investigation of the Auger lifetime is needed, to conclusively determine the Auger coefficients for the direct Auger recombination at high majority carrier concentrations

Compact electrothermal reliability modeling and experimental characterization of bipolar latchup in SiC and CoolMOS power MOSFETs

In this paper, a compact dynamic and fully coupled electrothermal model for parasitic BJT latchup is presented and validated by measurements. The model can be used to enhance the reliability of the latest generation of commercially available power devices. BJT latchup can be triggered by body-diode reverse-recovery hard commutation with high dV/dt or from avalanche conduction during unclamped inductive switching. In the case of body-diode reverse recovery, the base current that initiates BJT latchup is calculated from the solution of the ambipolar diffusion equation describing the minority carrier distribution in the antiparallel p-i-n body diode. For hard commutation with high dV/dt, the displacement current of the drain-body charging capacitance is critical for BJT latchup, whereas for avalanche conduction, the base current is calculated from impact ionization. The parasitic BJT is implemented in Simulink using the Ebers-Moll model and the temperature is calculated using a thermal network matched to the transient thermal impedance characteristic of the devices. This model has been applied to CoolMOS and SiC MOSFETs. Measurements show that the model correctly predicts BJT latchup during reverse recovery as a function of forward-current density and temperature. The model presented, when calibrated correctly by device manufacturers and applications engineers, is capable of benchmarking the robustness of power MOSFETs

Overview of Power Electronic Switches: A Summary of the Past, State-of-the-Art and Illumination of the Future

publishedVersio

Development, Demonstration, and Device Physics of FET-Accessed One-Transistor GaAs Dynamic Memory Technologies

The introduction of digital GaAs into modem high-speed computing systems has led to an increasing demand for high-density memory in these GaAs technologies. To date, most of the memory development efforts in GaAs have been directed toward four- and six-transistor static RAM\u27s, which consume substantial chip area and dissipate much static power resulting in limited single-chip GaAs storage capacities. As it has successfully done in silicon, a one-transistor dynamic RAM approach could alleviate these problems making higher density GaAs memories possible. This dissertation discusses theoretical and experimental work that presents the possibility for a high-speed, low-power, one-transistor dynamic RAM technology in GaAs. The two elements of the DRAM cell, namely the charge storage capacitor and the access field-effect transistor have been studied in detail. Isolated diode junction charge storage capacitors have demonstrated 30 minutes of storage time at room temperature with charge densities comparable to those obtained in planar silicon DRAM capacitors. GaAs JFET and MESFET technologies have been studied, and with careful device design and choice of proper operating voltages experimental results show that both can function as acceptable access transistors. One-transistor MESFET- and JFET-accessed DRAM cells have been fabricated and operated at room temperature and above with a standby power dissipation that is only a small fraction of the power dissipated by the best commercial GaAs static RAM cells. A 2 x 2 bit demonstration array was built and successfully operated at room temperature to demonstrate the addressable read/write capability of this new technology

Chaotic Oscillations in CMOS Integrated Circuits

Chaos is a purely mathematical term, describing a signal that is aperiodic and sensitive to initial conditions, but deterministic. Yet, engineers usually see it as an undesirable effect to be avoided in electronics. The first part of the dissertation deals with chaotic oscillation in complementary metal-oxide-semiconductor integrated circuits (CMOS ICs) as an effect behavior due to high power microwave or directed electromagnetic energy source. When the circuit is exposed to external electromagnetic sources, it has long been conjectured that spurious oscillation is generated in the circuits. In the first part of this work, we experimentally and numerically demonstrate that these spurious oscillations, or out-of-band oscillations are in fact chaotic oscillations. In the second part of the thesis, we exploit a CMOS chaotic oscillator in building a cryptographic source, a random number generator. We first demonstrate the presence of chaotic oscillation in standard CMOS circuits. At radio frequencies, ordinary digital circuits can show unexpected nonlinear responses. We evaluate a CMOS inverter coupled with electrostatic discharging (ESD) protection circuits, designed with 0.5 μm CMOS technology, for their chaotic oscillations. As the circuit is driven by a direct radio frequency injection, it exhibits a chaotic dynamics, when the input frequency is higher than the typical maximum operating frequency of the CMOS inverter. We observe an aperiodic signal, a broadband spectrum, and various bifurcations in the experimental results. We analytically discuss the nonlinear physical effects in the given circuit : ESD diode rectification, DC bias shift due to a non-quasi static regime operation of the ESD PN-junction diode, and a nonlinear resonant feedback current path. In order to predict these chaotic dynamics, we use a transistor-based model, and compare the model's performance with the experimental results. In order to verify the presence of chaotic oscillations mathematically, we build on an ordinary differential equation model with the circuit-related nonlinearities. We then calculate the largest Lyapunov exponents to verify the chaotic dynamics. The importance of this work lies in investigating chaotic dynamics of standard CMOS ICs that has long been conjectured. In doing so, we experimentally and numerically give evidences for the presence of chaotic oscillations. We then report on a random number generator design, in which randomness derives from a Boolean chaotic oscillator, designed and fabricated as an integrated circuit. The underlying physics of the chaotic dynamics in the Boolean chaotic oscillator is given by the Boolean delay equation. According to numerical analysis of the Boolean delay equation, a single node network generates chaotic oscillations when two delay inputs are incommensurate numbers and the transition time is fast. To test this hypothesis physically, a discrete Boolean chaotic oscillator is implemented. Using a CMOS 0.5 μm process, we design and fabricate a CMOS Boolean chaotic oscillator which consists of a core chaotic oscillator and a source follower buffer. Chaotic dynamics are verified using time and frequency domain analysis, and the largest Lyapunov exponents are calculated. The measured bit sequences do make a suitable randomness source, as determined via National Institute of Standards and Technology (NIST) standard statistical tests version 2.1