A case study for NoC based homogeneous MPSoC architectures

The many-core design paradigm requires flexible and modular hardware and software components to provide the required scalability to next-generation on-chip multiprocessor architectures. A multidisciplinary approach is necessary to consider all the interactions between the different components of the design. In this paper, a complete design methodology that tackles at once the aspects of system level modeling, hardware architecture, and programming model has been successfully used for the implementation of a multiprocessor network-on-chip (NoC)-based system, the NoCRay graphic accelerator. The design, based on 16 processors, after prototyping with field-programmable gate array (FPGA), has been laid out in 90-nm technology. Post-layout results show very low power, area, as well as 500 MHz of clock frequency. Results show that an array of small and simple processors outperform a single high-end general purpose processo

Increasing productivity through Total Reuse Management (TRM)

Total Reuse Management (TRM) is a new concept currently being promoted by the NASA Langley Software Engineering and Ada Lab (SEAL). It uses concepts similar to those promoted in Total Quality Management (TQM). Both technical and management personnel are continually encouraged to think in terms of reuse. Reuse is not something that is aimed for after a product is completed, but rather it is built into the product from inception through development. Lowering software development costs, reducing risk, and increasing code reliability are the more prominent goals of TRM. Procedures and methods used to adopt and apply TRM are described. Reuse is frequently thought of as only being applicable to code. However, reuse can apply to all products and all phases of the software life cycle. These products include management and quality assurance plans, designs, and testing procedures. Specific examples of successfully reused products are given and future goals are discussed

Coarse-Grained Online Monitoring of BTI Aging by Reusing Power-Gating Infrastructure

In this paper, we present a novel coarse-grained technique for monitoring online the bias temperature instability (BTI) aging of circuits by exploiting their power gating infrastructure. The proposed technique relies on monitoring the discharge time of the virtual-power-network during standby operations, the value of which depends on the threshold voltage of the CMOS devices in a power-gated design (PGD). It does not require any distributed sensors, because the virtual-power-network is already distributed in a PGD. It consists of a hardware block for measuring the discharge time concurrently with normal standby operations and a processing block for estimating the BTI aging status of the PGD according to collected measurements. Through SPICE simulation, we demonstrate that the BTI aging estimation error of the proposed technique is less than 1% and 6.2% for PGDs with static operating frequency and dynamic voltage and frequency scaling, respectively. Its area cost is also found negligible. The power gating minimum idle time (MIT) cost induced by the energy consumed for monitoring the discharge time is evaluated on two scalar machine models using either x86 or ARM instruction sets. It is found less than 1.3× and 1.45× the original power gating MIT, respectively. We validate the proposed technique through accelerated aging experiments conducted with five actual chips that contain an ARM cortex M0 processor, manufactured with a 65 nm CMOS technology

Internationalisation of Innovation: Why Chip Design Moving to Asia

This paper will appear in International Journal of Innovation Management, special issue in honor of Keith Pavitt, (Peter Augsdoerfer, Jonathan Sapsed, and James Utterback, guest editors), forthcoming. Among Keith Pavitt's many contributions to the study of innovation is the proposition that physical proximity is advantageous for innovative activities that involve highly complex technological knowledge But chip design, a process that creates the greatest value in the electronics industry and that requires highly complex knowledge, is experiencing a massive dispersion to leading Asian electronics exporting countries. To explain why chip design is moving to Asia, the paper draws on interviews with 60 companies and 15 research institutions that are doing leading-edge chip design in Asia. I demonstrate that "pull" and "policy" factors explain what attracts design to particular locations. But to get to the root causes that shift the balance in favor of geographical decentralization, I examine "push" factors, i.e. changes in design methodology ("system-on-chip design") and organization ("vertical specialization" within global design networks). The resultant increase in knowledge mobility explains why chip design - that, in Pavitt's framework is not supposed to move - is moving from the traditional centers to a few new specialized design clusters in Asia. A completely revised and updated version has been published as: " Complexity and Internationalisation of Innovation: Why is Chip Design Moving to Asia?," in International Journal of Innovation Management, special issue in honour of Keith Pavitt, Vol. 9,1: 47-73.

A 0.8 V T Network-Based 2.6 GHz Downconverter RFIC

A 2.6 GHz downconverter RFIC is designed and implemented using a 0.18 μm CMOS standard process. An important goal of the design is to achieve the high linearity that is required in WiMAX systems with a low supply voltage. A passive T phase-shift network is used as an RF input stage in a Gilbert cell to reduce supply voltage. A single supply voltage of 0.8 V is used with a power consumption of 5.87 mW. The T network-based downconverter achieves a conversion gain (CG) of 5 dB, a single-sideband noise figure (NF) of 16.16 dB, an RF-to-IF isolation of greater than 20 dB, and an input-referred third-order intercept point (IIP3) of 1 dBm when the LO power of -13 dBm is applied