153 research outputs found

    On-Chip Transparent Wire Pipelining (invited paper)

    Get PDF
    Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects

    Throughput-driven floorplanning with wire pipelining

    Get PDF
    The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

    Correct-by-construction microarchitectural pipelining

    Get PDF
    This paper presents a method for correct-by-construction microarchitectural pipelining that handles cyclic systems with dependencies between iterations. Our method combines previously known bypass and retiming transformations with a few transformations valid only for elastic systems with early evaluation (namely, empty FIFO insertion, FIFO capacity sizing, insertion of anti-tokens, and introducing early evaluation multiplexors). By converting the design to a synchronous elastic form and then applying this extended set of transformations, one can pipeline a functional specification with an automatically generated distributed controller that implements stalling logic resolving data hazards off the critical path of the design. We have developed an interactive toolkit for exploring elastic microarchitectural transformations. The method is illustrated by pipelining a few simple examples of instruction set architecture ISA specifications.Peer ReviewedPostprint (published version

    Elastic systems

    Get PDF
    Elastic systems provide tolerance to the variations in computation and communication delays. The incorporation of elasticity opens new opportunities for optimization using new correct-by-construction transformations that cannot be applied to rigid non-elastic systems. The basics of synchronous and asynchronous elastic systems will be reviewed. A set of behavior-preserving transformations will be presented: retiming, recycling, early evaluation, variable-latency units and speculative execution. The application of these transformations for performance and power optimization will be discussed. Finally, a novel framework for microarchitectural exploration will be introduced, showing that the optimal pipelining of a circuit can be automatically obtained by using the previous transformations.Peer ReviewedPostprint (published version

    Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

    Get PDF
    The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout
    • …
    corecore