Signal and Power Integrity Challenges for High Density System-on-Package

As the increasing desire for more compact, portable devices outpaces Moore’s law, innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself, as the case for system-on-package (SoP), has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining, let alone improving, reliability and performance. The fundamental signal, power, and thermal integrity issues are discussed in detail, along with published techniques from around the industry to mitigate these issues in SoP applications

Multiplexed, High Density Electrophysiology with Nanofabricated Neural Probes

Extracellular electrode arrays can reveal the neuronal network correlates of behavior with single-cell, single-spike, and sub-millisecond resolution. However, implantable electrodes are inherently invasive, and efforts to scale up the number and density of recording sites must compromise on device size in order to connect the electrodes. Here, we report on silicon-based neural probes employing nanofabricated, high-density electrical leads. Furthermore, we address the challenge of reading out multichannel data with an application-specific integrated circuit (ASIC) performing signal amplification, band-pass filtering, and multiplexing functions. We demonstrate high spatial resolution extracellular measurements with a fully integrated, low noise 64-channel system weighing just 330 mg. The on-chip multiplexers make possible recordings with substantially fewer external wires than the number of input channels. By combining nanofabricated probes with ASICs we have implemented a system for performing large-scale, high-density electrophysiology in small, freely behaving animals that is both minimally invasive and highly scalable

JRA3 Electromagnetic Calorimeter Technical Design Report

This report describes the design of the prototype for an Silicon Tungsten electromagnetic calorimeter with unprecedented high granularity to be operated in a detector at the International Linear Collider (ILC). The R&D for the prototype is co-funded by the European Union in the FP6 framework within the so called EUDET project in the years 2006-2010. The dimensions of the prototype are similar to those envisaged for the final detector. Already at this stage the prototype features a highly compact design. The sensitive layers, the Very Front End Electronics serving 64 channels per ASIC and copper plates for heat draining are integrated within 2000 μm