45 research outputs found

    Salford postgraduate annual research conference (SPARC) 2012 proceedings

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    These proceedings bring together a selection of papers from the 2012 Salford Postgraduate Annual Research Conference (SPARC). They reflect the breadth and diversity of research interests showcased at the conference, at which over 130 researchers from Salford, the North West and other UK universities presented their work. 21 papers are collated here from the humanities, arts, social sciences, health, engineering, environment and life sciences, built environment and business

    Factories of the Future

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    Engineering; Industrial engineering; Production engineerin

    Factories of the Future

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    Engineering; Industrial engineering; Production engineerin

    International Conference on Civil Infrastructure and Construction (CIC 2020)

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    This is the proceedings of the CIC 2020 Conference, which was held under the patronage of His Excellency Sheikh Khalid bin Khalifa bin Abdulaziz Al Thani in Doha, Qatar from 2 to 5 February 2020. The goal of the conference was to provide a platform to discuss next-generation infrastructure and its construction among key players such as researchers, industry professionals and leaders, local government agencies, clients, construction contractors and policymakers. The conference gathered industry and academia to disseminate their research and field experiences in multiple areas of civil engineering. It was also a unique opportunity for companies and organizations to show the most recent advances in the field of civil infrastructure and construction. The conference covered a wide range of timely topics that address the needs of the construction industry all over the world and particularly in Qatar. All papers were peer reviewed by experts in their field and edited for publication. The conference accepted a total number of 127 papers submitted by authors from five different continents under the following four themes: Theme 1: Construction Management and Process Theme 2: Materials and Transportation Engineering Theme 3: Geotechnical, Environmental, and Geo-environmental Engineering Theme 4: Sustainability, Renovation, and Monitoring of Civil InfrastructureThe list of the Sponsors are listed at page 1

    Performance analysis for wireless G (IEEE 802.11G) and wireless N (IEEE 802.11N) in outdoor environment

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    This paper described an analysis the different capabilities and limitation of both IEEE technologies that has been utilized for data transmission directed to mobile device. In this work, we have compared an IEEE 802.11/g/n outdoor environment to know what technology is better. The comparison consider on coverage area (mobility), throughput and measuring the interferences. The work presented here is to help the researchers to select the best technology depending of their deploying case, and investigate the best variant for outdoor. The tool used is Iperf software which is to measure the data transmission performance of IEEE 802.11n and IEEE 802.11g

    Performance Analysis For Wireless G (IEEE 802.11 G) And Wireless N (IEEE 802.11 N) In Outdoor Environment

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    This paper described an analysis the different capabilities and limitation of both IEEE technologies that has been utilized for data transmission directed to mobile device. In this work, we have compared an IEEE 802.11/g/n outdoor environment to know what technology is better. the comparison consider on coverage area (mobility), through put and measuring the interferences. The work presented here is to help the researchers to select the best technology depending of their deploying case, and investigate the best variant for outdoor. The tool used is Iperf software which is to measure the data transmission performance of IEEE 802.11n and IEEE 802.11g

    JTEC Panel report on electronic manufacturing and packaging in Japan

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    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies
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