1,064 research outputs found
Reliability-aware heterogeneous 3D chip multiprocessor design
Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit area. An important issue in designing a heterogeneous 3D IC is reliability. To achieve this, one needs to select the data mapping and processor layout carefully. This paper addresses this problem using an integer linear programming (ILP) approach. Specifically, on a heterogeneous 3D CMP, it explores how applications can be mapped onto 3D ICs to maximize reliability. Preliminary experiments indicate that the proposed technique generates promising results in both reliability and performance. © 2013 Springer Science+Business Media New York
A Survey of Techniques For Improving Energy Efficiency in Embedded Computing Systems
Recent technological advances have greatly improved the performance and
features of embedded systems. With the number of just mobile devices now
reaching nearly equal to the population of earth, embedded systems have truly
become ubiquitous. These trends, however, have also made the task of managing
their power consumption extremely challenging. In recent years, several
techniques have been proposed to address this issue. In this paper, we survey
the techniques for managing power consumption of embedded systems. We discuss
the need of power management and provide a classification of the techniques on
several important parameters to highlight their similarities and differences.
This paper is intended to help the researchers and application-developers in
gaining insights into the working of power management techniques and designing
even more efficient high-performance embedded systems of tomorrow
A Survey of Prediction and Classification Techniques in Multicore Processor Systems
In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems
Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs
Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms
A Survey and Comparative Study of Hard and Soft Real-time Dynamic Resource Allocation Strategies for Multi/Many-core Systems
Multi-/many-core systems are envisioned to satisfy the ever-increasing performance requirements of complex applications in various domains such as embedded and high-performance computing. Such systems need to cater to increasingly dynamic workloads, requiring efficient dynamic resource allocation strategies to satisfy hard or soft real-time constraints. This article provides an extensive survey of hard and soft real-time dynamic resource allocation strategies proposed since the mid-1990s and highlights the emerging trends for multi-/many-core systems. The survey covers a taxonomy of the resource allocation strategies and considers their various optimization objectives, which have been used to provide comprehensive comparison. The strategies employ various principles, such as market and biological concepts, to perform the optimizations. The trend followed by the resource allocation strategies, open research challenges, and likely emerging research directions have also been provided
A survey on scheduling and mapping techniques in 3D Network-on-chip
Network-on-Chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution.
NoCs enable communications between on-chip Intellectual Property (IP) cores and
allow those cores to achieve higher performance by outsourcing their
communication tasks. Mapping and Scheduling methodologies are key elements in
assigning application tasks, allocating the tasks to the IPs, and organising
communication among them to achieve some specified objectives. The goal of this
paper is to present a detailed state-of-the-art of research in the field of
mapping and scheduling of applications on 3D NoC, classifying the works based
on several dimensions and giving some potential research directions
Exploiting Inter- and Intra-Memory Asymmetries for Data Mapping in Hybrid Tiered-Memories
Modern computing systems are embracing hybrid memory comprising of DRAM and
non-volatile memory (NVM) to combine the best properties of both memory
technologies, achieving low latency, high reliability, and high density. A
prominent characteristic of DRAM-NVM hybrid memory is that it has NVM access
latency much higher than DRAM access latency. We call this inter-memory
asymmetry. We observe that parasitic components on a long bitline are a major
source of high latency in both DRAM and NVM, and a significant factor
contributing to high-voltage operations in NVM, which impact their reliability.
We propose an architectural change, where each long bitline in DRAM and NVM is
split into two segments by an isolation transistor. One segment can be accessed
with lower latency and operating voltage than the other. By introducing tiers,
we enable non-uniform accesses within each memory type (which we call
intra-memory asymmetry), leading to performance and reliability trade-offs in
DRAM-NVM hybrid memory. We extend existing NVM-DRAM OS in three ways. First, we
exploit both inter- and intra-memory asymmetries to allocate and migrate memory
pages between the tiers in DRAM and NVM. Second, we improve the OS's page
allocation decisions by predicting the access intensity of a newly-referenced
memory page in a program and placing it to a matching tier during its initial
allocation. This minimizes page migrations during program execution, lowering
the performance overhead. Third, we propose a solution to migrate pages between
the tiers of the same memory without transferring data over the memory channel,
minimizing channel occupancy and improving performance. Our overall approach,
which we call MNEME, to enable and exploit asymmetries in DRAM-NVM hybrid
tiered memory improves both performance and reliability for both single-core
and multi-programmed workloads.Comment: 15 pages, 29 figures, accepted at ACM SIGPLAN International Symposium
on Memory Managemen
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