Dependable Digitally-Assisted Mixed-Signal IPs Based on Integrated Self-Test & Self-Calibration

Heterogeneous SoC devices, including sensors, analogue and mixed-signal front-end circuits and the availability of massive digital processing capability, are being increasingly used in safety-critical applications like in the automotive, medical, and the security arena. Already a significant amount of attention has been paid in literature with respect to the dependability of the digital parts in heterogeneous SoCs. This is in contrast to especially the sensors and front-end mixed-signal electronics; these are however particular sensitive to external influences over time and hence determining their dependability. This paper provides an integrated SoC/IP approach to enhance the dependability. It will give an example of a digitally-assisted mixed-signal front-end IP which is being evaluated under its mission profile of an automotive tyre pressure monitoring system. It will be shown how internal monitoring and digitally-controlled adaptation by using embedded processors can help in terms of improving the dependability of this mixed-signal part under harsh conditions for a long time

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review

Since the last century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The ISO 26262 standard for functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardization of defect modeling and injection mainly focused on digital circuits and, in a minor part, on analog ones. An initial attempt is being made with the IEEE P2427 draft standard that started to give a structured and formal organization to the analog testing field. Various methods have been proposed in the literature to speed up the fault simulation of the defect universe for an analog circuit. A more limited number of papers seek to reduce the overall simulation time by reducing the number of defects to be simulated. This literature survey describes the state-of-the-art of analog defect injection and fault simulation methods. The survey is based on the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodological flow, allowing for a systematic and complete literature survey. Each selected paper has been categorized and presented to provide an overview of all the available approaches. In addition, the limitations of the various approaches are discussed by showing possible future directions

Moving Towards Analog Functional Safety

Over the past century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power systems. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The standard ISO 26262 related to functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardizing fault modeling, injection and simulation mainly focused on digital circuits and disregarding analog ones. An initial attempt is being made with the IEEE P2427 standard draft standard that started to give this field a structured and formal organization. In this context, new fault models, injection, and abstraction methodologies for analog circuits are proposed in this thesis to enhance this application field. The faults proposed by the IEEE P2427 standard draft standard are initially evaluated to understand the associated fault behaviors during the simulation. Moreover, a novel approach is presented for modeling realistic stuck-on/off defects based on oxide defects. These new defects proposed are required because digital stuck-at-fault models where a transistor is frozen in on-state or offstate may not apply well on analog circuits because even a slight variation could create deviations of several magnitudes. Then, for validating the proposed defects models, a novel predictive fault grouping based on faulty AC matrices is applied to group faults with equivalent behaviors. The proposed fault grouping method is computationally cheap because it avoids performing DC or transient simulations with faults injected and limits itself to faulty AC simulations. Using AC simulations results in two different methods that allow grouping faults with the same frequency response are presented. The first method is an AC-based grouping method that exploits the potentialities of the S-parameters ports. While the second is a Circle-based grouping based on the circle-fitting method applied to the extracted AC matrices. Finally, an open-source framework is presented for the fault injection and manipulation perspective. This framework relies on the shared semantics for reading, writing, or manipulating transistor-level designs. The ultimate goal of the framework is: reading an input design written in a specific syntax and then allowing to write the same design in another syntax. As a use case for the proposed framework, a process of analog fault injection is discussed. This activity requires adding, removing, or replacing nodes, components, or even entire sub-circuits. The framework is entirely written in C++, and its APIs are also interfaced with Python. The entire framework is open-source and available on GitHub. The last part of the thesis presents abstraction methodologies that can abstract transistor level models into Verilog-AMS models and Verilog- AMS piecewise and nonlinear models into C++. These abstracted models can be integrated into heterogeneous systems. The purpose of integration is the simulation of heterogeneous components embedded in a Virtual Platforms (VP) needs to be fast and accurate

Towards Multidimensional Verification: Where Functional Meets Non-Functional

Trends in advanced electronic systems' design have a notable impact on design verification technologies. The recent paradigms of Internet-of-Things (IoT) and Cyber-Physical Systems (CPS) assume devices immersed in physical environments, significantly constrained in resources and expected to provide levels of security, privacy, reliability, performance and low power features. In recent years, numerous extra-functional aspects of electronic systems were brought to the front and imply verification of hardware design models in multidimensional space along with the functional concerns of the target system. However, different from the software domain such a holistic approach remains underdeveloped. The contributions of this paper are a taxonomy for multidimensional hardware verification aspects, a state-of-the-art survey of related research works and trends towards the multidimensional verification concept. The concept is motivated by an example for the functional and power verification dimensions.Comment: 2018 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC