March CRF: an Efficient Test for Complex Read Faults in SRAM Memories

In this paper we study Complex Read Faults in SRAMs, a combination of various malfunctions that affect the read operation in nanoscale memories. All the memory elements involved in the read operation are studied, underlining the causes of the realistic faults concerning this operation. The requirements to cover these fault models are given. We show that the different causes of read failure are independent and may coexist in nanoscale SRAMs, summing their effects and provoking Complex Read Faults, CRFs. We show that the test methodology to cover this new read faults consists in test patterns that match the requirements to cover all the different simple read fault models. We propose a low complexity (?2N) test, March CRF, that covers effectively all the realistic Complex Read Fault

Static random-access memory designs based on different FinFET at lower technology node (7nm)

Title from PDF of title page viewed January 15, 2020Thesis advisor: Masud H ChowdhuryVitaIncludes bibliographical references (page 50-57)Thesis (M.S.)--School of Computing and Engineering. University of Missouri--Kansas City, 2019The Static Random-Access Memory (SRAM) has a significant performance impact on current nanoelectronics systems. To improve SRAM efficiency, it is important to utilize emerging technologies to overcome short-channel effects (SCE) of conventional CMOS. FinFET devices are promising emerging devices that can be utilized to improve the performance of SRAM designs at lower technology nodes. In this thesis, I present detail analysis of SRAM cells using different types of FinFET devices at 7nm technology. From the analysis, it can be concluded that the performance of both 6T and 8T SRAM designs are improved. 6T SRAM achieves a 44.97% improvement in the read energy compared to 8T SRAM. However, 6T SRAM write energy degraded by 3.16% compared to 8T SRAM. Read stability and write ability of SRAM cells are determined using Static Noise Margin and N- curve methods. Moreover, Monte Carlo simulations are performed on the SRAM cells to evaluate process variations. Simulations were done in HSPICE using 7nm Asymmetrical Underlap FinFET technology. The quasiplanar FinFET structure gained considerable attention because of the ease of the fabrication process [1] – [4]. Scaling of technology have degraded the performance of CMOS designs because of the short channel effects (SCEs) [5], [6]. Therefore, there has been upsurge in demand for FinFET devices for emerging market segments including artificial intelligence and cloud computing (AI) [8], [9], Internet of Things (IoT) [10] – [13] and biomedical [17] –[18] which have their own exclusive style of design. In recent years, many Underlapped FinFET devices were proposed to have better control of the SCEs in the sub-nanometer technologies [3], [4], [19] – [33]. Underlap on either side of the gate increases effective channel length as seen by the charge carriers. Consequently, the source-to-drain tunneling probability is improved. Moreover, edge direct tunneling leakage components can be reduced by controlling the electric field at the gate-drain junction . There is a limitation on the extent of underlap on drain or source sides because the ION is lower for larger underlap. Additionally, FinFET based designs have major width quantization issue. The width of a FinFET device increases only in quanta of silicon fin height (HFIN) [4]. The width quantization issue becomes critical for ratioed designs like SRAMs, where proper sizing of the transistors is essential for fault-free operation. FinFETs based on Design/Technology Co-Optimization (DTCO_F) approach can overcome these issues [38]. DTCO_F follows special design rules, which provides the specifications for the standard SRAM cells with special spacing rules and low leakages. The performances of 6T SRAM designs implemented by different FinFET devices are compared for different pull-up, pull down and pass gate transistor (PU: PD:PG) ratios to identify the best FinFET device for high speed and low power SRAM applications. Underlapped FinFETs (UF) and Design/Technology Co-Optimized FinFETs (DTCO_F) are used for the design and analysis. It is observed that with the PU: PD:PG ratios of 1:1:1 and 1:5:2 for the UF-SRAMs the read energy has degraded by 3.31% and 48.72% compared to the DTCO_F-SRAMs, respectively. However, the read energy with 2:5:2 ratio has improved by 32.71% in the UF-SRAM compared to the DTCO_F-SRAMs. The write energy with 1:1:1 configuration has improved by 642.27% in the UF-SRAM compared to the DTCO_F-SRAM. On the other hand, the write energy with 1:5:2 and 2:5:2 configurations have degraded by 86.26% and 96% in the UF-SRAMs compared to the DTCO_F-SRAMs. The stability and reliability of different SRAMs are also evaluated for 500mV supply. From the analysis, it can be concluded that Asymmetrical Underlapped FinFET is better for high-speed applications and DTCO FinFET for low power applications.Introduction -- Next generation high performance device: FinFET -- FinFET based SRAM bitcell designs -- Benchmarking of UF-SRAMs and DTCO-F-SRAMS -- Collaborative project -- Internship experience at INTEL and Marvell Semiconductor -- Conclusion and future wor

Test Guideline for Evaluating Low-Energy Proton-Induced Single-Event Effects in Space Systems

No abstract availabl

A PUF based Lightweight Hardware Security Architecture for IoT

With an increasing number of hand-held electronics, gadgets, and other smart devices, data is present in a large number of platforms, thereby increasing the risk of security, privacy, and safety breach than ever before. Due to the extreme lightweight nature of these devices, commonly referred to as IoT or `Internet of Things\u27, providing any kind of security is prohibitive due to high overhead associated with any traditional and mathematically robust cryptographic techniques. Therefore, researchers have searched for alternative intuitive solutions for such devices. Hardware security, unlike traditional cryptography, can provide unique device-specific security solutions with little overhead, address vulnerability in hardware and, therefore, are attractive in this domain. As Moore\u27s law is almost at its end, different emerging devices are being explored more by researchers as they present opportunities to build better application-specific devices along with their challenges compared to CMOS technology. In this work, we have proposed emerging nanotechnology-based hardware security as a security solution for resource constrained IoT domain. Specifically, we have built two hardware security primitives i.e. physical unclonable function (PUF) and true random number generator (TRNG) and used these components as part of a security protocol proposed in this work as well. Both PUF and TRNG are built from metal-oxide memristors, an emerging nanoscale device and are generally lightweight compared to their CMOS counterparts in terms of area, power, and delay. Design challenges associated with designing these hardware security primitives and with memristive devices are properly addressed. Finally, a complete security protocol is proposed where all of these different pieces come together to provide a practical, robust, and device-specific security for resource-limited IoT systems

Charge recycling 8T SRAM design for low voltage robust operation

It is attractive to design power efficient and robust SRAM in low voltage and high performance systems for mobile or battery-powered electronics. To reduce the power consumption resulting from bit-line activities, a new bit-line charge recycling circuit is proposed for 8T SRAMs. By eliminating the use of analog blocks required in existing circuits in literature, this proposed charge recycling scheme results in less design complexity. In addition, two types of SRAM cells are employed to improve the robustness in write operation, and hierarchical bit-line structure is applied to reduce the power consumption in read operation. Post-layout simulations demonstrate the proposed design results in 3.08 and 2.62 times enhancement of WSNM and SWN compared to conventional 6T SRAM design in the same technology, respectively. The power consumption of proposed design results in a reduction of 64.2% and 27.5% in write and read power consumption compared to 6T SRAM design. Moreover, given the same supply voltage (e.g., 1.2 V), post-layout simulation shows the proposed design is able to run at 5 times higher clock rate than the existing designs in literature. Given the same clock frequency requirement (e.g., 100 MHz), a lower supply voltage (e.g., 0.7 V) can sustain robust operation of the proposed design

Impact of aging on the soft error rate of 6T SRAM for planar and bulk technologies

This paper evaluates the impact of aging on the radiation sensitivity of 6T SRAMfor two planar bulk technologies. This study ismotivated by the growing impact of aging and radiation effects on the reliability of CMOS technology. Amodelling methodology dedicated to this newphenomenon is proposed. Thismodelling uses the radiation modelling device MUSCA SEP3 and an electrical aging modelling. First, the impact of aging on SEE sensitivity is studied through a parametric modeling of the threshold voltages of the transistors composing the 6T SRAM. Then, an operative avionics environment is modelled in order to evaluate the consequences on reliability

Embracing Low-Power Systems with Improvement in Security and Energy-Efficiency

As the economies around the world are aligning more towards usage of computing systems, the global energy demand for computing is increasing rapidly. Additionally, the boom in AI based applications and services has already invited the pervasion of specialized computing hardware architectures for AI (accelerators). A big chunk of research in the industry and academia is being focused on providing energy efficiency to all kinds of power hungry computing architectures. This dissertation adds to these efforts. Aggressive voltage underscaling of chips is one the effective low power paradigms of providing energy efficiency. This dissertation identifies and deals with the reliability and performance problems associated with this paradigm and innovates novel energy efficient approaches. Specifically, the properties of a low power security primitive have been improved and, higher performance has been unlocked in an AI accelerator (Google TPU) in an aggressively voltage underscaled environment. And, novel power saving opportunities have been unlocked by characterizing the usage pattern of a baseline TPU with rigorous mathematical analysis