Evaluation of temperature-performance trade-offs in wireless network-on-chip architectures

Continued scaling of device geometries according to Moore\u27s Law is enabling complete end-user systems on a single chip. Massive multicore processors are enablers for many information and communication technology (ICT) innovations spanning various domains, including healthcare, defense, and entertainment. In the design of high-performance massive multicore chips, power and heat are dominant constraints. Temperature hotspots witnessed in multicore systems exacerbate the problem of reliability in deep submicron technologies. Hence, there is a great need to explore holistic power and thermal optimization and management strategies for the massive multicore chips. High power consumption not only raises chip temperature and cooling cost, but also decreases chip reliability and performance. Thus, addressing thermal concerns at different stages of the design and operation is critical to the success of future generation systems. The performance of a multicore chip is also influenced by its overall communication infrastructure, which is predominantly a Network-on-Chip (NoC). The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency, significant power consumption, and temperature hotspots arising out of long, multi-hop wireline links used in data exchange. On-chip wireless networks are envisioned as an enabling technology to design low power and high bandwidth massive multicore architectures. However, optimizing wireless NoCs for best performance does not necessarily guarantee a thermally optimal interconnection architecture. The wireless links being highly efficient attract very high traffic densities which in turn results in temperature hotspots. Therefore, while the wireless links result in better performance and energy-efficiency, they can also cause temperature hotspots and undermine the reliability of the system. Consequently, the location and utilization of the wireless links is an important factor in thermal optimization of high performance wireless Networks-on-Chip. Architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance yet energy-efficient massive multicore chips. This work contributes to exploration of various the design methodologies for establishing wireless NoC architectures that achieve the best trade-offs between temperature, performance and energy-efficiency. It further demonstrates that incorporating Dynamic Thermal Management (DTM) on a multicore chip designed with such temperature and performance optimized Wireless Network-on-Chip architectures improves thermal profile while simultaneously providing lower latency and reduced network energy dissipation compared to its conventional counterparts

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric

Artificial Neural Network Based Prediction Mechanism for Wireless Network on Chips Medium Access Control

As per Moore’s law, continuous improvement over silicon process technologies has made the integration of hundreds of cores on to a single chip possible. This has resulted in the paradigm shift towards multicore and many-core chips where, hundreds of cores can be integrated on the same die and interconnected using an on-chip packet-switched network called a Network-on-Chip (NoC). Various tasks running on different cores generate different rates of communication between pairs of cores. This lead to the increase in spatial and temporal variation in the workloads, which impact the long distance data communication over multi-hop wire line paths in conventional NoCs. Among different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnects operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem in traditional NoCs. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). In a WiNoC, the mm-wave wireless interconnect is realized by equipping some NoC switches with an wireless interface (WI) that contains an antenna and transceiver circuit tuned to operate in the mm-wave frequency. To enable collision free and energy-efficient communication among the WIs, the WIs is also equipped with a medium access control mechanism (MAC) unit. Due to the simplicity and low-overhead implementation, a token passing based MAC mechanism to enable Time Division Multiple Access (TDMA) has been adopted in many WiNoC architectures. However, such simple MAC mechanism is agnostic of the demand of the WIs. Based on the tasks mapped on a multicore system the demand through the WIs can vary both spatially and temporally. Hence, if the MAC is agnostic of such demand variation, energy is wasted when no flit is transferred through the wireless channel. To efficiently utilize the wireless channel, MAC mechanisms that can dynamically allocate token possession period of the WIs have been explored in recent time for WiNoCs. In the dynamic MAC mechanism, a history-based prediction is used to predict the bandwidth demand of the WIs to adjust the token possession period with respect to the traffic variation. However, such simple history based predictors are not accurate and limits the performance gain due to the dynamic MACs in a WiNoC. In this work, we investigate the design of an artificial neural network (ANN) based prediction methodology to accurately predict the bandwidth demand of each WI. Through system level simulation, we show that the dynamic MAC mechanisms enabled with the ANN based prediction mechanism can significantly improve the performance of a WiNoC in terms of peak bandwidth, packet energy and latency compared to the state-of-the-art dynamic MAC mechanisms

Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture

An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

FDMA Enabled Phase-based Wireless Network-on-Chip using Graphene-based THz-band Antennas

The future growth in System-on-chip design is moving in the direction of multicore systems. Design of efficient interconnects between cores are crucial for improving the performance of a multicore processor. Such trends are seen due to the benefits the multicore systems provide in terms of power reduction and scalability. Network-on-chips (NoC) are viewed as an emerging solution in the design of interconnects in multicore systems. However, Traditional Network-on-chip architectures are no longer able to satisfy the performance requirements due to long distance communication over multi-hop wireline paths. Multi-hop communication leads to higher energy consumption, increase in latency and reduction in bandwidth. Research in recent years has explored emerging technologies such as 3D integration, photonic and radio frequency based Network-on-chips. The use of wireless interconnects using mm-wave antennas are able to alleviate the performance issues in a wireline interconnect system. However, to satisfy the increasing demand for higher bandwidth and lower energy consumption, Wireless Network-on-Chip enabled with high speed direct links operating in THz band between distant cores is desired. Recent research has brought to light highly efficient graphene-based antennas operating in THz band. These antennas can provide high data rate and are found to consume less power with low area overheads. In this thesis, an innovative approach using novel devices based on graphene structures is proposed to provide a high-performance on-chip interconnection. This novel approach combines the regular NoC structure with the proposed wireless infrastructure to exploit the performance benefits. An architecture with wireless interfaces on every core is explored in this work. Simultaneous multiple communications in a network can be achieved by adopting Frequency Division Multiple access (FDMA). However, in a system where all cores are equipped with a wireless interface, FDMA requires more number of frequency bands. This becomes difficult to achieve as the system scales and the number of cores increase. Therefore, a FDMA protocol along with a 4-phased repetitive multi-band architecture is envisioned in this work. The phase-based protocol allows multiple wireless links to be active at a time, the phase-based protocol along with the FDMA protocol provides a reliable data transfer between cores with lesser number of frequency bands. In this thesis, an architecture with a combination of FDMA and phase-based protocol using point-to-point graphene-based wireless links is proposed. The proposed architecture is also extended for a multichip system. With cycle accurate system-level simulations, it is shown that the proposed architecture provides huge gains in performance and energy-efficiency in data transfer both in NoC based multicore and multichip systems

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

Network-on-Chip Synchronization

Technology scaling has enabled the number of cores within a System on Chip (SoC) to increase significantly. Globally Asynchronous Locally Synchronous (GALS) systems using Dynamic Voltage and Frequency Scaling (DVFS) operate each of these cores on distinct and dynamic clock domains. The main communication method between these cores is increasingly more likely to be a Network-on-Chip (NoC). Typically, the interfaces between these clock domains experience multi-cycle synchronization latencies due to their use of “brute-force” synchronizers. This dissertation aims to improve the performance of NoCs and thereby SoCs as a whole by reducing this synchronization latency. First, a survey of NoC improvement techniques is presented. One such improvement technique: a multi-layer NoC, has been successfully simulated. Given how one of the most commonly used techniques is DVFS, a thorough analysis and simulation of brute-force synchronizer circuits in both current and future process technologies is presented. Unfortunately, a multi-cycle latency is unavoidable when using brute-force synchronizers, so predictive synchronizers which require only a single cycle of latency have been proposed. To demonstrate the impact of these predictive synchronizer circuits at a high level, multi-core system simulations incorporating these circuits have been completed. Multiple forms of GALS NoC configurations have been simulated, including multi-synchronous, NoC-synchronous, and single-synchronizer. Speedup on the SPLASH benchmark suite was measured to directly quantify the performance benefit of predictive synchronizers in a full system. Additionally, Mean Time Between Failures (MTBF) has been calculated for each NoC synchronizer configuration to determine the reliability benefit possible when using predictive synchronizers

Combined Dynamic Thermal Management Exploiting Broadcast-Capable Wireless Network-on-Chip Architecture

With the continuous scaling of device dimensions, the number of cores on a single die is constantly increasing. This integration of hundreds of cores on a single die leads to high power dissipation and thermal issues in modern Integrated Circuits (ICs). This causes problems related to reliability, timing violations and lifetime of electronic devices. Dynamic Thermal Management (DTM) techniques have emerged as potential solutions that mitigate the increasing temperatures on a die. However, considering the scaling of system sizes and the adoption of the Network-on-Chip (NoC) paradigm to serve as the interconnection fabric exacerbates the problem as both cores and NoC elements contribute to the increased heat dissipation on the chip. Typically, DTM techniques can either be proactive or reactive. Proactive DTM techniques, where the system has the ability to predict the thermal profile of the chip ahead of time are more desirable than reactive DTM techniques where the system utilizes thermal sensors to determine the current temperature of the chip. Moreover, DTM techniques either address core or NoC level thermal issues separately. Hence, this thesis proposes a combined proactive DTM technique that integrates both core level and NoC level DTM techniques. The combined DTM mechanism includes a dynamic temperature-aware routing approach for the NoC level elements, and includes task reallocation heuristics for the core level elements. On-chip wireless interconnects recently envisioned to enable energy-efficient data exchange between cores in a multicore chip will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM. Combining the proactive DTM technique with on-chip wireless interconnects, the on-chip temperature is restricted within target temperatures without significantly affecting the performance of the NoC based interconnection fabric of the multicore chip