Bacteria have transient influences on marine corrosion of steel

The contribution of bacteria to the corrosion mass loss and to pitting of mild steel was observed over 2.5 years using parallel streams of unpolluted natural (biotic) and nominally sterilized (abiotic) Pacific Ocean coastal seawater. As also observed by others, in artificial laboratory exposures, corrosion mass loss within the first few days of exposure was much greater in the biotic stream. However, after only about 10 days the difference in mass losses were gradually reduced and were very similar up to about one year of exposure. Thereafter, the corrosion loss in the biotic stream again became more severe. Pitting corrosion in the biotic stream was more severe from the very first exposure throughout the 2.5 years. Corrosion in both seawater streams exhibited three distinct but transient time-dependent phases. Of these only the first and third obviously involve bacteria. Similar longer-term observations in real seawaters have not been described previously but are generally consistent with some long-term field data. The results show that longer-term corrosion behavior and possible microbial influences cannot be predicted from short-term laboratory observations, even if natural seawater is used

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact

Process techniques study of integrated circuits Final scientific report

Surface impurity and structural defect analysis on thermally grown silicon oxide integrated circui

Flat-plate solar array project. Volume 5: Process development

The goal of the Process Development Area, as part of the Flat-Plate Solar Array (FSA) Project, was to develop and demonstrate solar cell fabrication and module assembly process technologies required to meet the cost, lifetime, production capacity, and performance goals of the FSA Project. R&D efforts expended by Government, Industry, and Universities in developing processes capable of meeting the projects goals during volume production conditions are summarized. The cost goals allocated for processing were demonstrated by small volume quantities that were extrapolated by cost analysis to large volume production. To provide proper focus and coverage of the process development effort, four separate technology sections are discussed: surface preparation, junction formation, metallization, and module assembly

White paper on the future of plasma science and technology in plastics and textiles

This is the peer reviewed version of the following article: “Uros, C., Walsh, J., Cernák, M., Labay, C., Canal, J.M., Canal, C. (2019) White paper on the future of plasma science and technology in plastics and textiles. Plasma processes and polymers, 16 1 which has been published in final form at [doi: 10.1002/ppap.201700228]. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving."This white paper considers the future of plasma science and technology related to the manufacturing and modifications of plastics and textiles, summarizing existing efforts and the current state‐of‐art for major topics related to plasma processing techniques. It draws on the frontier of plasma technologies in order to see beyond and identify the grand challenges which we face in the following 5–10 years. To progress and move the frontier forward, the paper highlights the major enabling technologies and topics related to the design of surfaces, coatings and materials with non‐equilibrium plasmas. The aim is to progress the field of plastics and textile production using advanced plasma processing as the key enabling technology which is environmentally friendly, cost efficient, and offers high‐speed processingPeer ReviewedPostprint (author's final draft

Secondary aerospace batteries and battery materials: A bibliography, 1969 - 1974

This annotated bibliography on the subject of secondary aerospace battery materials and related physical and electrochemical processes was compiled from references to journal articles published between 1969 and 1974. A total of 332 citations are arranged in chronological order under journal titles. Indices by system and component, techniques and processes, and author are included

種々の表面処理を行った鉛フリーハンダ接合部の機械的性質と信頼性

Tohoku University小池淳一課

Low pressure chemical vapor deposition of copper films from CU(I)(HFAC)(TMVS)

Recently, copper has been found as a possible substitute for Al alloys because of its low resistivity (1.67 μΩ • cm) and potentially improved resistance to electromigration. Conventional physical vapor deposition (PVD) method do not provide the conformal deposition profile for the high density integrated circuit, therefore, chemical vapor deposition (CVD) has become the most promising method for the resulting conformal profile. In this work, a cold wall, single wafer, CVD tungsten reactor was used for the deposition of copper with Cu(I)(hfac)(tmvs). Film growth rates were between 100 to 800 A/min depending on processing conditions, and an Arrhenius type activation energy of 16.1 kcal/mole was obtained in the temperature region of 150-180 °C. No significant amount of contamination is detected in the copper films, and the resistivity of the films was routinely near 2.2 μΩ • cm when the film was 5000 A or more. The surface roughness of the films increased with increasing film thickness, and the crystal orientation was found as a function of growth rate. These obtained results demonstrated the feasibility of using Cu(I)(hfac)(tmvs) in the synthesis of high purity copper films using liquid injection by LPCVD