A design methodology for robust, energy-efficient, application-aware memory systems

Memory design is a crucial component of VLSI system design from area, power and performance perspectives. To meet the increasingly challenging system specifications, architecture, circuit and device level innovations are required for existing memory technologies. Emerging memory solutions are widely explored to cater to strict budgets. This thesis presents design methodologies for custom memory design with the objective of power-performance benefits across specific applications. Taking example of STTRAM (spin transfer torque random access memory) as an emerging memory candidate, the design space is explored to find optimal energy design solution. A thorough thermal reliability study is performed to estimate detection reliability challenges and circuit solutions are proposed to ensure reliable operation. Adoption of the application-specific optimal energy solution is shown to yield considerable energy benefits in a read-heavy application called MBC (memory based computing). Circuit level customizations are studied for the volatile SRAM (static random access memory) memory, which will provide improved energy-delay product (EDP) for the same MBC application. Memory design has to be aware of upcoming challenges from not only the application nature but also from the packaging front. Taking 3D die-folding as an example, SRAM performance shift under die-folding is illustrated. Overall the thesis demonstrates how knowledge of the system and packaging can help in achieving power efficient and high performance memory design.Ph.D

A Holistic Solution for Reliability of 3D Parallel Systems

As device scaling slows down, emerging technologies such as 3D integration and carbon nanotube field-effect transistors are among the most promising solutions to increase device density and performance. These emerging technologies offer shorter interconnects, higher performance, and lower power. However, higher levels of operating temperatures and current densities project significantly higher failure rates. Moreover, due to the infancy of the manufacturing process, high variation, and defect densities, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Silicon-based transistors. The goal of this dissertation is to introduce new architectural and circuit techniques that can work around high-fault rates in the emerging 3D technologies, improving performance and reliability comparable to Silicon. We propose a new holistic approach to the reliability problem that addresses the necessary aspects of an effective solution such as detection, diagnosis, repair, and prevention synergically for a practical solution. By leveraging 3D fabric layouts, it proposes the underlying architecture to efficiently repair the system in the presence of faults. This thesis presents a fault detection scheme by re-executing instructions on idle identical units that distinguishes between transient and permanent faults while localizing it to the granularity of a pipeline stage. Furthermore, with the use of a dynamic and adaptive reconfiguration policy based on activity factors and temperature variation, we propose a framework that delivers a significant improvement in lifetime management to prevent faults due to aging. Finally, a design framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up Carbon Nano Tube-based technology is presented. The proposed framework is capable of efficiently supporting high-variation technologies by providing protection against manufacturing defects at different granularities: module and pipeline-stage levels.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168118/1/javadb_1.pd

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Computing with Spintronics: Circuits and architectures

This thesis makes the following contributions towards the design of computing platforms with spintronic devices. 1) It explores the use of spintronic memories in the design of a domain-specific processor for an emerging class of data-intensive applications, namely recognition, mining and synthesis (RMS). Two different spintronic memory technologies — Domain Wall Memory (DWM) and STT-MRAM — are utilized to realize the different levels in the memory hierarchy of the domain-specific processor, based on their respective access characteristics. Architectural tradeoffs created by the use of spintronic memories are analyzed. The proposed design achieves 1.5X-4X improvements in energy-delay product compared to a CMOS baseline. 2) It describes the first attempt to use DWM in the cache hierarchy of general-purpose processors. DWM promises unparalleled density by packing several bits of data into each bit-cell. TapeCache, the proposed DWM-based cache architecture, utilizes suitable circuit and architectural optimizations to address two key challenges (i) the high energy and latency requirement of write operations and (ii) the need for shift operations to access the data stored in each DWM bit-cell. At the circuit level, DWM bit-cells that are tailored to the distinct design requirements of different levels in the cache hierarchy are proposed. At the architecture level, TapeCache proposes suitable cache organization and management policies to alleviate the performance impact of shift operations required to access data stored in DWM bit-cells. TapeCache achieves more than 7X improvements in both cache area and energy with virtually identical performance compared to an SRAM-based cache hierarchy. 3) It investigates the design of the on-chip memory hierarchy of general-purpose graphics processing units (GPGPUs)—massively parallel processors that are optimized for data-intensive high-throughput workloads—using DWM. STAG, a high density, energy-efficient Spintronic- Tape Architecture for GPGPU cache hierarchies is described. STAG utilizes different DWM bit-cells to realize different memory arrays in the GPGPU cache hierarchy. To address the challenge of high access latencies due to shifts, STAG predicts upcoming cache accesses by leveraging unique characteristics of GPGPU architectures and workloads, and prefetches data that are both likely to be accessed and require large numbers of shift operations. STAG achieves 3.3X energy reduction and 12.1% performance improvement over CMOS SRAM under iso-area conditions. 4) While the potential of spintronic devices for memories is widely recognized, their utility in realizing logic is much less clear. The thesis presents Spintastic, a new paradigm that utilizes Stochastic Computing (SC) to realize spintronic logic. In SC, data is encoded in the form of pseudo-random bitstreams, such that the probability of a \u271\u27 in a bitstream corresponds to the numerical value that it represents. SC can enable compact, low-complexity logic implementations of various arithmetic functions. Spintastic establishes the synergy between stochastic computing and spin-based logic by demonstrating that they mutually alleviate each other\u27s limitations. On the one hand, various building blocks of SC, which incur significant overheads in CMOS implementations, can be efficiently realized by exploiting the physical characteristics of spin devices. On the other hand, the reduced logic complexity and low logic depth of SC circuits alleviates the shortcomings of spintronic logic. Based on this insight, the design of spin-based stochastic arithmetic circuits, bitstream generators, bitstream permuters and stochastic-to-binary converter circuits are presented. Spintastic achieves 7.1X energy reduction over CMOS implementations for a wide range of benchmarks from the image processing, signal processing, and RMS application domains. 5) In order to evaluate the proposed spintronic designs, the thesis describes various device-to-architecture modeling frameworks. Starting with devices models that are calibrated to measurements, the characteristics of spintronic devices are successively abstracted into circuit-level and architectural models, which are incorporated into suitable simulation frameworks. (Abstract shortened by UMI.

Improving the Reliability of Microprocessors under BTI and TDDB Degradations

Reliability is a fundamental challenge for current and future microprocessors with advanced nanoscale technologies. With smaller gates, thinner dielectric and higher temperature microprocessors are vulnerable under aging mechanisms such as Bias Temperature Instability (BTI) and Temperature Dependent Dielectric Breakdown (TDDB). Under continuous stress both parametric and functional errors occur, resulting compromised microprocessor lifetime. In this thesis, based on the thorough study on BTI and TDDB mechanisms, solutions are proposed to mitigating the aging processes on memory based and random logic structures in modern out-of-order microprocessors. A large area of processor core is occupied by memory based structure that is vulnerable to BTI induced errors. The problem is exacerbated when PBTI degradation in NMOS is as severe as NBTI in PMOS in high-k metal gate technology. Hence a novel design is proposed to recover 4 internal gates within a SRAM cell simultaneously to mitigate both NBTI and PBTI effects. This technique is applied to both the L2 cache banks and the busy function units with storage cells in out-of-order pipeline in two different ways. For the L2 cache banks, redundant cache bank is added exclusively for proactive recovery rotation. For the critical and busy function units in out-of-order pipelines, idle cycles are exploited at per-buffer-entry level. Different from memory based structures, combinational logic structures such as function units in execution stage can not use low overhead redundancy to tolerate errors due to their irregular structure. A design framework that aims to improve the reliability of the vulnerable functional units of a processor core is designed and implemented. The approach is designing a generic function unit (GFU) that can be reconfigured to replace a particular functional unit (FU) while it is being recovered for improved lifetime. Although flexible, the GFU is slower than the original target FUs. So GFU is carefully designed so as to minimize the performance loss when it is in-use. More schemes are also designed to avoid using the GFU on performance critical paths of a program execution

NASA Tech Briefs, February 1997

Topics include: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Report

Towards Computational Efficiency of Next Generation Multimedia Systems

To address throughput demands of complex applications (like Multimedia), a next-generation system designer needs to co-design and co-optimize the hardware and software layers. Hardware/software knobs must be tuned in synergy to increase the throughput efficiency. This thesis provides such algorithmic and architectural solutions, while considering the new technology challenges (power-cap and memory aging). The goal is to maximize the throughput efficiency, under timing- and hardware-constraints

The deep space network

Progress is reported in flight project support, tracking and data acquisition research and technology, network engineering, hardware and software implementation, and operations. The functions and facilities of the Deep Space Network are emphasized

Muon (g-2) Technical Design Report

The Muon (g-2) Experiment, E989 at Fermilab, will measure the muon anomalous magnetic moment a factor-of-four more precisely than was done in E821 at the Brookhaven National Laboratory AGS. The E821 result appears to be greater than the Standard-Model prediction by more than three standard deviations. When combined with expected improvement in the Standard-Model hadronic contributions, E989 should be able to determine definitively whether or not the E821 result is evidence for physics beyond the Standard Model. After a review of the physics motivation and the basic technique, which will use the muon storage ring built at BNL and now relocated to Fermilab, the design of the new experiment is presented. This document was created in partial fulfillment of the requirements necessary to obtain DOE CD-2/3 approval