Integrated sensors for process monitoring and health monitoring in microsystems

This thesis presents the development of integrated sensors for health monitoring in Microsystems, which is an emerging method for early diagnostics of status or “health” of electronic systems and devices under operation based on embedded tests. Thin film meander temperature sensors have been designed with a minimum footprint of 240 m × 250 m. A microsensor array has been used successfully for accurate temperature monitoring of laser assisted polymer bonding for MEMS packaging. Using a frame-shaped beam, the temperature at centre of bottom substrate was obtained to be ~50 ºC lower than that obtained using a top-hat beam. This is highly beneficial for packaging of temperature sensitive MEMS devices. Polymer based surface acoustic wave humidity sensors were designed and successfully fabricated on 128° cut lithium niobate substrates. Based on reflection signals, a sensitivity of 0.26 dB/RH% was achieved between 8.6 %RH and 90.6 %RH. Fabricated piezoresistive pressure sensors have also been hybrid integrated and electrically contacted using a wire bonding method. Integrated sensors based on both LiNbO3 and ZnO/Si substrates are proposed. Integrated sensors were successfully fabricated on a LiNbO3 substrate with a footprint of 13 mm × 12 mm, having multi monitoring functions for simultaneous temperature, measurement of humidity and pressure in the health monitoring applications

FLEXIBLE LOW-COST HW/SW ARCHITECTURES FOR TEST, CALIBRATION AND CONDITIONING OF MEMS SENSOR SYSTEMS

During the last years smart sensors based on Micro-Electro-Mechanical systems (MEMS) are widely spreading over various fields as automotive, biomedical, optical and consumer, and nowadays they represent the outstanding state of the art. The reasons of their diffusion is related to the capability to measure physical and chemical information using miniaturized components. The developing of this kind of architectures, due to the heterogeneities of their components, requires a very complex design flow, due to the utilization of both mechanical parts typical of the MEMS sensor and electronic components for the interfacing and the conditioning. In these kind of systems testing activities gain a considerable importance, and they concern various phases of the life-cycle of a MEMS based system. Indeed, since the design phase of the sensor, the validation of the design by the extraction of characteristic parameters is important, because they are necessary to design the sensor interface circuit. Moreover, this kind of architecture requires techniques for the calibration and the evaluation of the whole system in addition to the traditional methods for the testing of the control circuitry. The first part of this research work addresses the testing optimization by the developing of different hardware/software architecture for the different testing stages of the developing flow of a MEMS based system. A flexible and low-cost platform for the characterization and the prototyping of MEMS sensors has been developed in order to provide an environment that allows also to support the design of the sensor interface. To reduce the reengineering time requested during the verification testing a universal client-server architecture has been designed to provide a unique framework to test different kind of devices, using different development environment and programming languages. Because the use of ATE during the engineering phase of the calibration algorithm is expensive in terms of ATE’s occupation time, since it requires the interruption of the production process, a flexible and easily adaptable low-cost hardware/software architecture for the calibration and the evaluation of the performance has been developed in order to allow the developing of the calibration algorithm in a user-friendly environment that permits also to realize a small and medium volume production. The second part of the research work deals with a topic that is becoming ever more important in the field of applications for MEMS sensors, and concerns the capability to combine information extracted from different typologies of sensors (typically accelerometers, gyroscopes and magnetometers) to obtain more complex information. In this context two different algorithm for the sensor fusion has been analyzed and developed: the first one is a fully software algorithm that has been used as a means to estimate how much the errors in MEMS sensor data affect the estimation of the parameter computed using a sensor fusion algorithm; the second one, instead, is a sensor fusion algorithm based on a simplified Kalman filter. Starting from this algorithm, a bit-true model in Mathworks Simulink(TM) has been created as a system study for the implementation of the algorithm on chip

An Optical Density Detection Platform with Integrated Microfluidics for In Situ Growth, Monitoring, and Treatment of Bacterial Biofilms

Systems engineering strategies utilizing platform-based design methodologies are implemented to achieve the integration of biological and physical system components in a biomedical system. An application of this platform explored, in which an integrated microsystem is developed capable of the on-chip growth, monitoring, and treatment of bacterial biofilms for drug development and fundamental study applications. In this work, the developed systems engineering paradigm is utilized to develop a device system implementing linear array charge-coupled devices to enable real time, non-invasive, label-free monitoring of bacterial biofilms. A novel biofilm treatment method is demonstrated within the developed microsystem showing drastic increases in treatment efficacy by decreasing both bacterial biomass and cell viability within treated biofilms. Demonstration of this treatment at the microscale enables future applications of this method for the in vivo treatment of biofilm-associated infections

Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary

Design, evaluation, and control of nexus: a multiscale additive manufacturing platform with integrated 3D printing and robotic assembly.

Additive manufacturing (AM) technology is an emerging approach to creating three-dimensional (3D) objects and has seen numerous applications in medical implants, transportation, aerospace, energy, consumer products, etc. Compared with manufacturing by forming and machining, additive manufacturing techniques provide more rapid, economical, efficient, reliable, and complex manufacturing processes. However, additive manufacturing also has limitations on print strength and dimensional tolerance, while traditional additive manufacturing hardware platforms for 3D printing have limited flexibility. In particular, part geometry and materials are limited to most 3D printing hardware. In addition, for multiscale and complex products, samples must be printed, fabricated, and transferred among different additive manufacturing platforms in different locations, which leads to high cost, long process time, and low yield of products. This thesis investigates methods to design, evaluate, and control the NeXus, which is a novel custom robotic platform for multiscale additive manufacturing with integrated 3D printing and robotic assembly. NeXus can be used to prototype miniature devices and systems, such as wearable MEMS sensor fabrics, microrobots for wafer-scale microfactories, tactile robot skins, next generation energy storage (solar cells), nanostructure plasmonic devices, and biosensors. The NeXus has the flexibility to fixture, position, transport, and assemble components across a wide spectrum of length scales (Macro-Meso-Micro-Nano, 1m to 100nm) and provides unparalleled additive process capabilities such as 3D printing through both aerosol jetting and ultrasonic bonding and forming, thin-film photonic sintering, fiber loom weaving, and in-situ Micro-Electro-Mechanical System (MEMS) packaging and interconnect formation. The NeXus system has a footprint of around 4m x 3.5m x 2.4m (X-Y-Z) and includes two industrial robotic arms, precision positioners, multiple manipulation tools, and additive manufacturing processes and packaging capabilities. The design of the NeXus platform adopted the Lean Robotic Micromanufacturing (LRM) design principles and simulation tools to mitigate development risks. The NeXus has more than 50 degrees of freedom (DOF) from different instruments, precise evaluation of the custom robots and positioners is indispensable before employing them in complex and multiscale applications. The integration and control of multi-functional instruments is also a challenge in the NeXus system due to different communication protocols and compatibility. Thus, the NeXus system is controlled by National Instruments (NI) LabVIEW real-time operating system (RTOS) with NI PXI controller and a LabVIEW State Machine User Interface (SMUI) and was programmed considering the synchronization of various instruments and sequencing of additive manufacturing processes for different tasks. The operation sequences of each robot along with relevant tools must be organized in safe mode to avoid crashes and damage to tools during robots’ motions. This thesis also describes two demonstrators that are realized by the NeXus system in detail: skin tactile sensor arrays and electronic textiles. The fabrication process of the skin tactile sensor uses the automated manufacturing line in the NeXus with pattern design, precise calibration, synchronization of an Aerosol Jet printer, and a custom positioner. The fabrication process for electronic textiles is a combination of MEMS fabrication techniques in the cleanroom and the collaboration of multiple NeXus robots including two industrial robotic arms and a custom high-precision positioner for the deterministic alignment process

Soldering interconnects through self-propagating reaction process

This thesis presents a research into the solder interconnects made through the reactive bonding process based on the self-propagating reaction. A numerical study of soldering conditions in the heat affected zone (HAZ) during bonding was initially carried out in order to understand the self-propagating reactive bonding and the related influencing factors. This was subsequently followed by an extensive experimental work to evaluate the feasibility and reliability of the reactive bonding process to enable the optimisation of processing parameters, which had provided a detailed understanding in terms of interfacial characteristics and bonding strengths. In addition, by focusing on the microstructure of the bonds resulted from the self-propagating reactions, the interfacial reactions and microstructural evolution of the bonded structures and effects of high-temperature aging were studied in details and discussed accordingly. To study the soldering conditions, a 3D time-dependent model is established to describe the temperature and stress field induced during self-propagating reactions. The transient temperature and stress distribution at the critical locations are identified. This thus allows the prediction of the melting status of solder alloys and the stress concentration points (weak points) in the bond under certain soldering conditions, e.g. ambient temperature, pressure, dimension and type of solder materials. Experimentally, the characterisation of interconnects bonded using various materials under different technical conditions is carried out. This ultimately assists the understanding of the feasibility, reliability and failure modes of reactive bonding technique, as well as the criteria and optimisation to form robust joints. The formation of phases such as intermetallic compounds (IMCs) and mechanism of interfacial reactions during reactive bonding and subsequent aging are elaborated. The composition, dimension, distribution of phases have been examined through cross-sectional observations. The underlying temperature and stress profile determining the diffusion, crystallization and growth of phases are defined by numerical predictions. XXI Through the comparative analysis of the experimental and numerical results, the unique phases developed in the self-propagating joints are attributed to the solid-liquid-convective diffusion, directional solidification and non-equilibrium crystallization. The recrystallization and growth of phases during aging are revealed to be resulted from the solid-state diffusion and equilibration induced by the high-temperature heating. In conclusion, the interfacial reactions and microstructural evolution of interconnect developed through self-propagating reactive bonding are studied and correlated with the related influencing factors that has been obtained from these predictions and experiments. The results and findings enable the extensive uses of self-propagating reactive bonding technology for new design and assembly capable of various applications in electronic packaging. It also greatly contributes to the fundamentals of the crystallization and soldering mechanism of materials under the non-equilibrium conditions

Wireless Techniques for Body-Centric Cooperative Communications

Body-centric and cooperative communications are new trends in telecommunications field. Being concerned with human behaviour, body-centric communication networks, also known as Wireless Body Area Networks (WBANs), are suitable for a wide variety of applications. The advances in the miniaturisation of embedded devices to be placed on or around the body, foster the diffusion of these systems, where the human body is the key element defining communication characteristics. Cooperative communications paradigm, on the other hand, is one of the emerging technologies that promises significantly higher reliability and spectral efficiency in wireless networks. This thesis investigates possible applications of the cooperative communication paradigm to body-centric networks and, more generally, to Wireless Sensor Networks (WSNs). Firstly, communication protocols for WBANs are in the spotlight. Performance achieved by different approaches is evaluated and compared through experimentation providing guidelines for choosing appropriate protocol and setting protocol parameters to meet application requirements. Secondly, a cooperative Multiple Input Multiple Output (MIMO) scheme for WBANs is presented. The scheme, named B-MIMO, exploits the natural heterogeneity of the WBAN propagation channel to improve energy efficiency of the system. Finally, a WSN scenario is considered, where sensor nodes cooperate to establish a massive MIMO-like system. The analysis and subsequent optimisation show the advantages of cooperation in terms of energy efficiency and provide insights on how many nodes should be deployed in such a scenario

In Situ Preconcentration by AC Electrokinetics for Rapid and Sensitive Nanoparticle Detection

Reducing cost and time is a major concern in clinical diagnostics. Current molecular diagnostics are multi-step processes that usually take at least several hours or even days to complete multiple reagents delivery, incubations and several washing processes. This highly labor-intensive work and lack of automation could result in reduced reliability and low efficiency. The Laboratory-on-a-chip (LOC), taking advantage of the merger and development of microfluidics and biosensor technology, has shown promise towards a solution for performing analytical tests in a self-contained and compact unit, enabling earlier and decentralized testing. However, challenges are to integrate the fluid regulatory elements on a single platform and to detect target analytes with high sensitivity and selectivity. The goal of this research work is to develop an AC electrokinetic (ACEK) flow through concentrator for in-situ concentration of biomolecules and develop a comprehensive understanding of effects of ACEK flow on the biomolecule transport (in-situ concentration) and their impact on electronic biosensing mechanism and performance, achieving automation and miniaturization. ACEK is a new and promising technique to manipulate micro/bio-fluids and particles. It has many advantages over other techniques for its low applied voltage, portability and compatibility for integration into lab-on-a-chip devices. Numerical study on preconcentration system design in this work has provided an optimization rule for various biosensor designs using ACEK technique. And the microfluidic immunoassay lab-chip designed based on ACET effect has showed promising prospect for accelerated diagnostics. With optimized design of channel geometry, electrode patterns, and properly selected operation condition (ac frequency and voltage), the preconcentration system greatly reduced the reaction time to several minutes instead of several hours, and improved sensitivity of the assay. With the design of immunoassay lab-chip, one can quantitatively study the effect of ACET micropumping and mixing on molecular level binding. Improved sensors with single-chip form factor as a general platform could have a significant impact on a wide-range of biochemical detection and disease diagnostics including pathogen/virus detection, whole blood analysis, immune-screening, gene expression, as well as home land security