Custom Integrated Circuits

Contains reports on nine research projects.Analog Devices, Inc.International Business Machines CorporationJoint Services Electronics Program Contract DAAL03-89-C-0001U.S. Air Force - Office of Scientific Research Contract AFOSR 86-0164BDuPont CorporationNational Science Foundation Grant MIP 88-14612U.S. Navy - Office of Naval Research Contract N00014-87-K-0825American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

A sequentially constructive circuit semantics for Esterel

Static Single Assignment (SSA) is an established concept that facilitates various program optimizations. However, it is typically restricted to sequential programming. We present an approach that extends SSA for concurrent, reactive programming, specifically for the synchronous language Esterel. This extended SSA transformation expands the class of programs that can be compiled by existing Esterel compilers without causality problems. It also offers a new, efficient solution for the well-studied signal reincarnation problem. Finally, our approach rules out speculation/backtracking, unlike the recently proposed sequentially constructive model of computation

Non-invasive, near-field terahertz imaging of hidden objects using a single pixel detector

Terahertz (THz) imaging has the ability to see through otherwise opaque materials. However, due to the long wavelengths of THz radiation ({\lambda}=300{\mu}m at 1THz), far-field THz imaging techniques are heavily outperformed by optical imaging in regards to the obtained resolution. In this work we demonstrate near-field THz imaging with a single-pixel detector. We project a time-varying optical mask onto a silicon wafer which is used to spatially modulate a pulse of THz radiation. The far-field transmission corresponding to each mask is recorded by a single element detector and this data is used to reconstruct the image of an object placed on the far side of the silicon wafer. We demonstrate a proof of principal application where we image a printed circuit board on the underside of a 115{\mu}m thick silicon wafer with ~100{\mu}m ({\lambda}/4) resolution. With subwavelength resolution and the inherent sensitivity to local conductivity provided by the THz probe frequencies, we show that it is possible to detect fissures in the circuitry wiring of a few microns in size. Imaging systems of this type could have other uses where non-invasive measurement or imaging of concealed structures with high resolution is necessary, such as in semiconductor manufacturing or in bio-imaging

Submicron Systems Architecture Project: Semiannual Technial Report

No abstract available