3,194 research outputs found

    Analysis and Mitigation of Soft-Errors on High Performance Embedded GPUs

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    Multiprocessor system-on-chip such as embedded GPUs are becoming very popular in safety-critical applications, such as autonomous and semi-autonomous vehicles. However, these devices can suffer from the effects of soft-errors, such as those produced by radiation effects. These effects are able to generate unpredictable misbehaviors. Fault tolerance oriented to multi-threaded software introduces severe performance degradations due to the redundancy, voting and correction threads operations. In this paper, we propose a new fault injection environment for NVIDIA GPGPU devices and a fault tolerance approach based on error detection and correction threads executed during data transfer operations on embedded GPUs. The fault injection environment is capable of automatically injecting faults into the instructions at SASS level by instrumenting the CUDA binary executable file. The mitigation approach is based on concurrent error detection threads running simultaneously with the memory stream device to host data transfer operations. With several benchmark applications, we evaluate the impact of softerrors classifying Silent Data Corruption, Detection, Unrecoverable Error and Hang. Finally, the proposed mitigation approach has been validated by soft-error fault injection campaigns on an NVIDIA Pascal Architecture GPU controlled by Quad-Core A57 ARM processor (JETSON TX2) demonstrating an advantage of more than 37% with respect to state of the art solution

    Cross layer reliability estimation for digital systems

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    Forthcoming manufacturing technologies hold the promise to increase multifuctional computing systems performance and functionality thanks to a remarkable growth of the device integration density. Despite the benefits introduced by this technology improvements, reliability is becoming a key challenge for the semiconductor industry. With transistor size reaching the atomic dimensions, vulnerability to unavoidable fluctuations in the manufacturing process and environmental stress rise dramatically. Failing to meet a reliability requirement may add excessive re-design cost to recover and may have severe consequences on the success of a product. %Worst-case design with large margins to guarantee reliable operation has been employed for long time. However, it is reaching a limit that makes it economically unsustainable due to its performance, area, and power cost. One of the open challenges for future technologies is building ``dependable'' systems on top of unreliable components, which will degrade and even fail during normal lifetime of the chip. Conventional design techniques are highly inefficient. They expend significant amount of energy to tolerate the device unpredictability by adding safety margins to a circuit's operating voltage, clock frequency or charge stored per bit. Unfortunately, the additional cost introduced to compensate unreliability are rapidly becoming unacceptable in today's environment where power consumption is often the limiting factor for integrated circuit performance, and energy efficiency is a top concern. Attention should be payed to tailor techniques to improve the reliability of a system on the basis of its requirements, ending up with cost-effective solutions favoring the success of the product on the market. Cross-layer reliability is one of the most promising approaches to achieve this goal. Cross-layer reliability techniques take into account the interactions between the layers composing a complex system (i.e., technology, hardware and software layers) to implement efficient cross-layer fault mitigation mechanisms. Fault tolerance mechanism are carefully implemented at different layers starting from the technology up to the software layer to carefully optimize the system by exploiting the inner capability of each layer to mask lower level faults. For this purpose, cross-layer reliability design techniques need to be complemented with cross-layer reliability evaluation tools, able to precisely assess the reliability level of a selected design early in the design cycle. Accurate and early reliability estimates would enable the exploration of the system design space and the optimization of multiple constraints such as performance, power consumption, cost and reliability. This Ph.D. thesis is devoted to the development of new methodologies and tools to evaluate and optimize the reliability of complex digital systems during the early design stages. More specifically, techniques addressing hardware accelerators (i.e., FPGAs and GPUs), microprocessors and full systems are discussed. All developed methodologies are presented in conjunction with their application to real-world use cases belonging to different computational domains

    Systematic Model-based Design Assurance and Property-based Fault Injection for Safety Critical Digital Systems

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    With advances in sensing, wireless communications, computing, control, and automation technologies, we are witnessing the rapid uptake of Cyber-Physical Systems across many applications including connected vehicles, healthcare, energy, manufacturing, smart homes etc. Many of these applications are safety-critical in nature and they depend on the correct and safe execution of software and hardware that are intrinsically subject to faults. These faults can be design faults (Software Faults, Specification faults, etc.) or physically occurring faults (hardware failures, Single-event-upsets, etc.). Both types of faults must be addressed during the design and development of these critical systems. Several safety-critical industries have widely adopted Model-Based Engineering paradigms to manage the design assurance processes of these complex CPSs. This thesis studies the application of IEC 61508 compliant model-based design assurance methodology on a representative safety-critical digital architecture targeted for the Nuclear power generation facilities. The study presents detailed experiences and results to demonstrate the benefits of Model testing in finding design flaws and its relevance to subsequent verification steps in the workflow. Additionally, to study the impact of physical faults on the digital architecture we develop a novel property-based fault injection method that overcomes few deficiencies of traditional fault injection methods. The model-based fault injection approach presented here guarantees high efficiency and near-exhaustive input/state/fault space coverage, by utilizing formal model checking principles to identify fault activation conditions and prove the fault tolerance features. The fault injection framework facilitates automated integration of fault saboteurs throughout the model to enable exhaustive fault location coverage in the model

    Toward Fault-Tolerant Applications on Reconfigurable Systems-on-Chip

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    L'abstract è presente nell'allegato / the abstract is in the attachmen

    Digital design techniques for dependable High-Performance Computing

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    L'abstract è presente nell'allegato / the abstract is in the attachmen

    New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs

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    Tesis por compendio[EN] Relevance of electronics towards safety of common devices has only been growing, as an ever growing stake of the functionality is assigned to them. But of course, this comes along the constant need for higher performances to fulfill such functionality requirements, while keeping power and budget low. In this scenario, industry is struggling to provide a technology which meets all the performance, power and price specifications, at the cost of an increased vulnerability to several types of known faults or the appearance of new ones. To provide a solution for the new and growing faults in the systems, designers have been using traditional techniques from safety-critical applications, which offer in general suboptimal results. In fact, modern embedded architectures offer the possibility of optimizing the dependability properties by enabling the interaction of hardware, firmware and software levels in the process. However, that point is not yet successfully achieved. Advances in every level towards that direction are much needed if flexible, robust, resilient and cost effective fault tolerance is desired. The work presented here focuses on the hardware level, with the background consideration of a potential integration into a holistic approach. The efforts in this thesis have focused several issues: (i) to introduce additional fault models as required for adequate representativity of physical effects blooming in modern manufacturing technologies, (ii) to provide tools and methods to efficiently inject both the proposed models and classical ones, (iii) to analyze the optimum method for assessing the robustness of the systems by using extensive fault injection and later correlation with higher level layers in an effort to cut development time and cost, (iv) to provide new detection methodologies to cope with challenges modeled by proposed fault models, (v) to propose mitigation strategies focused towards tackling such new threat scenarios and (vi) to devise an automated methodology for the deployment of many fault tolerance mechanisms in a systematic robust way. The outcomes of the thesis constitute a suite of tools and methods to help the designer of critical systems in his task to develop robust, validated, and on-time designs tailored to his application.[ES] La relevancia que la electrónica adquiere en la seguridad de los productos ha crecido inexorablemente, puesto que cada vez ésta copa una mayor influencia en la funcionalidad de los mismos. Pero, por supuesto, este hecho viene acompañado de una necesidad constante de mayores prestaciones para cumplir con los requerimientos funcionales, al tiempo que se mantienen los costes y el consumo en unos niveles reducidos. En este escenario, la industria está realizando esfuerzos para proveer una tecnología que cumpla con todas las especificaciones de potencia, consumo y precio, a costa de un incremento en la vulnerabilidad a múltiples tipos de fallos conocidos o la introducción de nuevos. Para ofrecer una solución a los fallos nuevos y crecientes en los sistemas, los diseñadores han recurrido a técnicas tradicionalmente asociadas a sistemas críticos para la seguridad, que ofrecen en general resultados sub-óptimos. De hecho, las arquitecturas empotradas modernas ofrecen la posibilidad de optimizar las propiedades de confiabilidad al habilitar la interacción de los niveles de hardware, firmware y software en el proceso. No obstante, ese punto no está resulto todavía. Se necesitan avances en todos los niveles en la mencionada dirección para poder alcanzar los objetivos de una tolerancia a fallos flexible, robusta, resiliente y a bajo coste. El trabajo presentado aquí se centra en el nivel de hardware, con la consideración de fondo de una potencial integración en una estrategia holística. Los esfuerzos de esta tesis se han centrado en los siguientes aspectos: (i) la introducción de modelos de fallo adicionales requeridos para la representación adecuada de efectos físicos surgentes en las tecnologías de manufactura actuales, (ii) la provisión de herramientas y métodos para la inyección eficiente de los modelos propuestos y de los clásicos, (iii) el análisis del método óptimo para estudiar la robustez de sistemas mediante el uso de inyección de fallos extensiva, y la posterior correlación con capas de más alto nivel en un esfuerzo por recortar el tiempo y coste de desarrollo, (iv) la provisión de nuevos métodos de detección para cubrir los retos planteados por los modelos de fallo propuestos, (v) la propuesta de estrategias de mitigación enfocadas hacia el tratamiento de dichos escenarios de amenaza y (vi) la introducción de una metodología automatizada de despliegue de diversos mecanismos de tolerancia a fallos de forma robusta y sistemática. Los resultados de la presente tesis constituyen un conjunto de herramientas y métodos para ayudar al diseñador de sistemas críticos en su tarea de desarrollo de diseños robustos, validados y en tiempo adaptados a su aplicación.[CA] La rellevància que l'electrònica adquireix en la seguretat dels productes ha crescut inexorablement, puix cada volta més aquesta abasta una major influència en la funcionalitat dels mateixos. Però, per descomptat, aquest fet ve acompanyat d'un constant necessitat de majors prestacions per acomplir els requeriments funcionals, mentre es mantenen els costos i consums en uns nivells reduïts. Donat aquest escenari, la indústria està fent esforços per proveir una tecnologia que complisca amb totes les especificacions de potència, consum i preu, tot a costa d'un increment en la vulnerabilitat a diversos tipus de fallades conegudes, i a la introducció de nous tipus. Per oferir una solució a les noves i creixents fallades als sistemes, els dissenyadors han recorregut a tècniques tradicionalment associades a sistemes crítics per a la seguretat, que en general oferixen resultats sub-òptims. De fet, les arquitectures empotrades modernes oferixen la possibilitat d'optimitzar les propietats de confiabilitat en habilitar la interacció dels nivells de hardware, firmware i software en el procés. Tot i això eixe punt no està resolt encara. Es necessiten avanços a tots els nivells en l'esmentada direcció per poder assolir els objectius d'una tolerància a fallades flexible, robusta, resilient i a baix cost. El treball ací presentat se centra en el nivell de hardware, amb la consideració de fons d'una potencial integració en una estratègia holística. Els esforços d'esta tesi s'han centrat en els següents aspectes: (i) la introducció de models de fallada addicionals requerits per a la representació adequada d'efectes físics que apareixen en les tecnologies de fabricació actuals, (ii) la provisió de ferramentes i mètodes per a la injecció eficient del models proposats i dels clàssics, (iii) l'anàlisi del mètode òptim per estudiar la robustesa de sistemes mitjançant l'ús d'injecció de fallades extensiva, i la posterior correlació amb capes de més alt nivell en un esforç per retallar el temps i cost de desenvolupament, (iv) la provisió de nous mètodes de detecció per cobrir els reptes plantejats pels models de fallades proposats, (v) la proposta d'estratègies de mitigació enfocades cap al tractament dels esmentats escenaris d'amenaça i (vi) la introducció d'una metodologia automatitzada de desplegament de diversos mecanismes de tolerància a fallades de forma robusta i sistemàtica. Els resultats de la present tesi constitueixen un conjunt de ferramentes i mètodes per ajudar el dissenyador de sistemes crítics en la seua tasca de desenvolupament de dissenys robustos, validats i a temps adaptats a la seua aplicació.Espinosa García, J. (2016). New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/73146TESISCompendi

    Improving Radiotherapy Targeting for Cancer Treatment Through Space and Time

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    Radiotherapy is a common medical treatment in which lethal doses of ionizing radiation are preferentially delivered to cancerous tumors. In external beam radiotherapy, radiation is delivered by a remote source which sits several feet from the patient\u27s surface. Although great effort is taken in properly aligning the target to the path of the radiation beam, positional uncertainties and other errors can compromise targeting accuracy. Such errors can lead to a failure in treating the target, and inflict significant toxicity to healthy tissues which are inadvertently exposed high radiation doses. Tracking the movement of targeted anatomy between and during treatment fractions provides valuable localization information that allows for the reduction of these positional uncertainties. Inter- and intra-fraction anatomical localization data not only allows for more accurate treatment setup, but also potentially allows for 1) retrospective treatment evaluation, 2) margin reduction and modification of the dose distribution to accommodate daily anatomical changes (called `adaptive radiotherapy\u27), and 3) targeting interventions during treatment (for example, suspending radiation delivery while the target it outside the path of the beam). The research presented here investigates the use of inter- and intra-fraction localization technologies to improve radiotherapy to targets through enhanced spatial and temporal accuracy. These technologies provide significant advancements in cancer treatment compared to standard clinical technologies. Furthermore, work is presented for the use of localization data acquired from these technologies in adaptive treatment planning, an investigational technique in which the distribution of planned dose is modified during the course of treatment based on biological and/or geometrical changes of the patient\u27s anatomy. The focus of this research is directed at abdominal sites, which has historically been central to the problem of motion management in radiation therapy

    Single Event Effect Hardening Designs in 65nm CMOS Bulk Technology

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    Radiation from terrestrial and space environments is a great danger to integrated circuits (ICs). A single particle from a radiation environment strikes semiconductor materials resulting in voltage and current perturbation, where errors are induced. This phenomenon is termed a Single Event Effect (SEE). With the shrinking of transistor size, charge sharing between adjacent devices leads to less effectiveness of current radiation hardening methods. Improving fault-tolerance of storage cells and logic gates in advanced technologies becomes urgent and important. A new Single Event Upset (SEU) tolerant latch is proposed based on a previous hardened Quatro design. Soft error analysis tools are used and results show that the critical charge of the proposed design is approximately 2 times higher than that of the reference design with negligible penalty in area, delay, and power consumption. A test chip containing the proposed flip-flop chains was designed and exposed to alpha particles as well as heavy ions. Radiation experimental results indicate that the soft error rates of the proposed design are greatly reduced when Linear Energy Transfer (LET) is lower than 4, which makes it a suitable candidate for ground-level high reliability applications. To improve radiation tolerance of combinational circuits, two combinational logic gates are proposed. One is a layout-based hardening Cascode Voltage Switch Logic (CVSL) and the other is a fault-tolerant differential dynamic logic. Results from a SEE simulation tool indicate that the proposed CVSL has a higher critical charge, less cross section, and shorter Single Event Transient (SET) pulses when compared with reference designs. Simulation results also reveal that the proposed differential dynamic logic significantly reduces the SEU rate compared to traditional dynamic logic, and has a higher critical charge and shorter SET pulses than reference hardened design

    Signing and security of Hue software

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    Developing software for the Hue devices poses plenty of challenges among the engineers at Philips Lighting. These challenges arise at each stage of the Software Development Life-Cycle (SDLC). Improvement of it is of immense importance to the Philips Lighting. This report describes a project which focus was to automate the SDLC, as well as to improve the security in it. The end result solves many challenges. It delivers a complete release management tool dedicated to the engineers at the Home Systems department. First, it visualizes release workflows in a simple user interface. Second, the core activities of the SDLC, such as the software signing, are fully automated. What is more important is that the signing is executed in a highly secure environment. This is very important for Philips Lighting not only because this automation saves a lot of time, but also because it reduces the risk of a human error. The same benefits are gained through an automation of other activities, such as approvals, distribution of the software to the factories, and deploying the software to the device cloud. Third, the system provides a traceability about each step executed in the process. Finally, the system is highly configurable, which makes it easy to be extended and adjusted to support different device types with different release workflows
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