Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

Block-level test scheduling under power dissipation constraints

As dcvicc technologies such as VLSI and Multichip Module (MCM) become mature, and larger and denser memory ICs arc implemented for high-performancc digital systems, power dissipation becomes a critical factor and can no longer be ignored cither in normal operation of the system or under test conditions. One of the major considerations in test scheduling is the fact that heat dissipated during test application is significantly higher than during normal operation (sometimes 100 - 200% higher). Therefore, this is one of the recent major considerations in test scheduling. Test scheduling is strongly related to test concurrency. Test concurrency is a design property which strongly impacts testability and power dissipation. To satisfy high fault coverage goals with reduced test application time under certain power dissipation constraints, the testing of all components on the system should be performed m parallel to the greatest extent possible. Some theoretical analysis of this problem has been carried out, but only at IC level. The problem was basically described as a compatible test clustering, where the compatibility among tests was given by test resource and power dissipation conflicts at the same time. From an implementation point of view this problem was identified as an Non-Polynomial (NP) complete problem In this thesis, an efficient scheme for overlaying the block-tcsts, called the extended tree growing technique, is proposed together with classical scheduling algorithms to search for power-constrained blocktest scheduling (PTS) profiles m a polynomial time Classical algorithms like listbased scheduling and distribution-graph based scheduling arc employed to tackle at high level the PTS problem. This approach exploits test parallelism under power constraints. This is achieved by overlaying the block-tcst intervals of compatible subcircuits to test as many of them as possible concurrently so that the maximum accumulated power dissipation is balanced and does not exceed the given limit. The test scheduling discipline assumed here is the partitioned testing with run to completion. A constant additive model is employed for power dissipation analysis and estimation throughout the algorithm

Protein Alignment Systolic Array Throughput Optimization

Protein comparison is gaining importance year after year since it has been demonstrated that biologists can find cor- relation between different species, or genetic mutations that can lead to cancer and genetic diseases. Protein sequence alignment is the most computational intensive task when performing protein comparison. In order to speed-up alignment, dedicated processors that can perform different computations in parallel have been designed. Among them, the best performance have been achieved using Systolic Arrays. However, when the Processing Elements of the Systolic Array have an internal loop, performance could be highly reduced. In this work we present an architectural strategy to address this problem applying pipeline interleaving; this strategy is applied to a Systolic Array for Smith Waterman algorithm that we designed. Results encourage the adoption of pipeline interleaving for parallel circuits with loop based Processing Elements. We demonstrate that important benefits in terms of higher operating frequency can be derived without so relevant costs as increased complexity, area and power required

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

Custom Integrated Circuits

Contains reports on ten research projects.Analog Devices, Inc.IBM CorporationNational Science Foundation/Defense Advanced Research Projects Agency Grant MIP 88-14612Analog Devices Career Development Assistant ProfessorshipU.S. Navy - Office of Naval Research Contract N0014-87-K-0825AT&TDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process