Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

ASIC Technology Migrations: A Design Guide for First Pass Success

This thesis presents a study of Application Specific Integrated Circuit (ASIC) technology migrations. An overview of the design flow methodology used for completing a ASIC design from concept to silicon is presented. The design flow is then augmented with special considerations specifically for ASIC technology migrations. An ASIC technology migration design example, using the special considerations, is preseted. Finally, a summary is presented with considerations regarding future work

Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

A polymorphic hardware platform

In the domain of spatial computing, it appears that platforms based on either reconfigurable datapath units or on hybrid microprocessor/logic cell organizations are in the ascendancy as they appear to offer the most efficient means of providing resources across the greatest range of hardware designs. This paper encompasses an initial exploration of an alternative organization. It looks at the effect of using a very fine-grained approach based on a largely undifferentiated logic cell that can be configured to operate as a state element, logic or interconnect - or combinations of all three. A vertical layout style hides the overheads imposed by reconfigurability to an extent where very fine-grained organizations become a viable option. It is demonstrated that the technique can be used to develop building blocks for both synchronous and asynchronous circuits, supporting the development of hybrid architectures such as globally asynchronous, locally synchronous

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

An Ultra-Low-Energy, Variation-Tolerant FPGA Architecture Using Component-Specific Mapping

As feature sizes scale toward atomic limits, parameter variation continues to increase, leading to increased margins in both delay and energy. Parameter variation both slows down devices and causes devices to fail. For applications that require high performance, the possibility of very slow devices on critical paths forces designers to reduce clock speed in order to meet timing. For an important and emerging class of applications that target energy-minimal operation at the cost of delay, the impact of variation-induced defects at very low voltages mandates the sizing up of transistors and operation at higher voltages to maintain functionality. With post-fabrication configurability, FPGAs have the opportunity to self-measure the impact of variation, determining the speed and functionality of each individual resource. Given that information, a delay-aware router can use slow devices on non-critical paths, fast devices on critical paths, and avoid known defects. By mapping each component individually and customizing designs to a component's unique physical characteristics, we demonstrate that we can eliminate delay margins and reduce energy margins caused by variation. To quantify the potential benefit we might gain from component-specific mapping, we first measure the margins associated with parameter variation, and then focus primarily on the energy benefits of FPGA delay-aware routing over a wide range of predictive technologies (45 nm--12 nm) for the Toronto20 benchmark set. We show that relative to delay-oblivious routing, delay-aware routing without any significant optimizations can reduce minimum energy/operation by 1.72x at 22 nm. We demonstrate how to construct an FPGA architecture specifically tailored to further increase the minimum energy savings of component-specific mapping by using the following techniques: power gating, gate sizing, interconnect sparing, and LUT remapping. With all optimizations considered we show a minimum energy/operation savings of 2.66x at 22 nm, or 1.68--2.95x when considered across 45--12 nm. As there are many challenges to measuring resource delays and mapping per chip, we discuss methods that may make component-specific mapping more practical. We demonstrate that a simpler, defect-aware routing achieves 70% of the energy savings of delay-aware routing. Finally, we show that without variation tolerance, scaling from 16 nm to 12 nm results in a net increase in minimum energy/operation; component-specific mapping, however, can extend minimum energy/operation scaling to 12 nm and possibly beyond.</p

Towards the development of a reliable reconfigurable real-time operating system on FPGAs

In the last two decades, Field Programmable Gate Arrays (FPGAs) have been rapidly developed from simple “glue-logic” to a powerful platform capable of implementing a System on Chip (SoC). Modern FPGAs achieve not only the high performance compared with General Purpose Processors (GPPs), thanks to hardware parallelism and dedication, but also better programming flexibility, in comparison to Application Specific Integrated Circuits (ASICs). Moreover, the hardware programming flexibility of FPGAs is further harnessed for both performance and manipulability, which makes Dynamic Partial Reconfiguration (DPR) possible. DPR allows a part or parts of a circuit to be reconfigured at run-time, without interrupting the rest of the chip’s operation. As a result, hardware resources can be more efficiently exploited since the chip resources can be reused by swapping in or out hardware tasks to or from the chip in a time-multiplexed fashion. In addition, DPR improves fault tolerance against transient errors and permanent damage, such as Single Event Upsets (SEUs) can be mitigated by reconfiguring the FPGA to avoid error accumulation. Furthermore, power and heat can be reduced by removing finished or idle tasks from the chip. For all these reasons above, DPR has significantly promoted Reconfigurable Computing (RC) and has become a very hot topic. However, since hardware integration is increasing at an exponential rate, and applications are becoming more complex with the growth of user demands, highlevel application design and low-level hardware implementation are increasingly separated and layered. As a consequence, users can obtain little advantage from DPR without the support of system-level middleware. To bridge the gap between the high-level application and the low-level hardware implementation, this thesis presents the important contributions towards a Reliable, Reconfigurable and Real-Time Operating System (R3TOS), which facilitates the user exploitation of DPR from the application level, by managing the complex hardware in the background. In R3TOS, hardware tasks behave just like software tasks, which can be created, scheduled, and mapped to different computing resources on the fly. The novel contributions of this work are: 1) a novel implementation of an efficient task scheduler and allocator; 2) implementation of a novel real-time scheduling algorithm (FAEDF) and two efficacious allocating algorithms (EAC and EVC), which schedule tasks in real-time and circumvent emerging faults while maintaining more compact empty areas. 3) Design and implementation of a faulttolerant microprocessor by harnessing the existing FPGA resources, such as Error Correction Code (ECC) and configuration primitives. 4) A novel symmetric multiprocessing (SMP)-based architectures that supports shared memory programing interface. 5) Two demonstrations of the integrated system, including a) the K-Nearest Neighbour classifier, which is a non-parametric classification algorithm widely used in various fields of data mining; and b) pairwise sequence alignment, namely the Smith Waterman algorithm, used for identifying similarities between two biological sequences. R3TOS gives considerably higher flexibility to support scalable multi-user, multitasking applications, whereby resources can be dynamically managed in respect of user requirements and hardware availability. Benefiting from this, not only the hardware resources can be more efficiently used, but also the system performance can be significantly increased. Results show that the scheduling and allocating efficiencies have been improved up to 2x, and the overall system performance is further improved by ~2.5x. Future work includes the development of Network on Chip (NoC), which is expected to further increase the communication throughput; as well as the standardization and automation of our system design, which will be carried out in line with the enablement of other high-level synthesis tools, to allow application developers to benefit from the system in a more efficient manner