Reducing Interconnect Cost in NoC through Serialized Asynchronous Links

This work investigates the application of serialization as a means of reducing the number of wires in NoC combined with asynchronous links in order to simplify the clocking of the link. Throughput is reduced but savings in routing area and reduction in power could make this attractiv

Reducing Interconnect Cost in NoC through Serialized Asynchronous Links

This work investigates the application of serialization as a means of reducing the number of wires in NoC combined with asynchronous links in order to simplify the clocking of the link. Throughput is reduced but savings in routing area and reduction in power could make this attractiv

Serialized Asynchronous Links for NoC

This paper proposes an asynchronous serialized link for NoC that can achieve the same levels of performance in terms of flits per second as a synchronous link but with a reduced number of wires in the point to point switch links and reduced power consumption. This is achieved by employing serialization in the asynchronous domain as opposed to synchronous to facilitate the removal of global clocking on the serial links. Based on transistor level simulations using 0.12 ?m foundry models it has been shown that it is possible to achieve the same level of performance as synchronous but with 75% reduction in wires and 65% reduction in power for a 300 MFlit/s link with 8 buffers with a switch clock speed of 300 MHz. Furthermore the paper presents the design requirements arising from interfacing switches of synchronous NoC and asynchronous serial links

Prelayout Design Of Configurable Serdes For High Speed Signaling In Multidie Interconnect

As the process technology advances, transistor size shrinks and more intellectual properties (IPs) are integrated onto chip. In order to accommodate the current complex functionalities as well as improving the performance of design, integrated circuit (IC) architecture has encouraged the integration of multiple die on a single chip. Communication between die requires full network-on-chip (NoC) which is area intensive. In deep sub-micron process nodes, high speed signaling between multiple die becomes one of the main challenges in multidie chip design. Methods to increase the routability have been proposed as the use of parallel interconnect appears to be the bottleneck of high speed multidie communication. Conversion of parallel data bits into serial data streams before transmission effectively reduced the number of wires required for the interconnect. Synchronous serial transmission requires large design dimension and power hungry auxiliary blocks for synchronization between the transmitted data and clock signals. This is avoided with the implementation of self-timed transmission scheme which eliminates the need to transmit the clock signal in a separate wire. This research is conducted to develop a reusable, scalable and configurable clockless version of SerDes system as the interconnect between multiple die. The proposed design achieves a data rate of 2 Gbps small area 38.71 μm² with architectural simplicity with 308 transistor count and low power consumption of 1.10 mW

Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

Networks on Chips: From Research to Products

Research on Networks on Chips (NoCs) has spanned over a decade and its results are now visible in some products. Thus the seminal idea of using networking technology to address the chip-level interconnect problem has been shown to be correct. Moreover, as technology scales down in geometry and chips scale up in complexity, NoCs become the essential element to achieve the desired levels of performance and quality of service while curbing power consumption levels. Design and timing closure can only be achieved by a sophisticated set of tools that address NoC synthesis, optimization and validation

Doctor of Philosophy

dissertationPortable electronic devices will be limited to available energy of existing battery chemistries for the foreseeable future. However, system-on-chips (SoCs) used in these devices are under a demand to offer more functionality and increased battery life. A difficult problem in SoC design is providing energy-efficient communication between its components while maintaining the required performance. This dissertation introduces a novel energy-efficient network-on-chip (NoC) communication architecture. A NoC is used within complex SoCs due it its superior performance, energy usage, modularity, and scalability over traditional bus and point-to-point methods of connecting SoC components. This is the first academic research that combines asynchronous NoC circuits, a focus on energy-efficient design, and a software framework to customize a NoC for a particular SoC. Its key contribution is demonstrating that a simple, asynchronous NoC concept is a good match for low-power devices, and is a fruitful area for additional investigation. The proposed NoC is energy-efficient in several ways: simple switch and arbitration logic, low port radix, latch-based router buffering, a topology with the minimum number of 3-port routers, and the asynchronous advantages of zero dynamic power consumption while idle and the lack of a clock tree. The tool framework developed for this work uses novel methods to optimize the topology and router oorplan based on simulated annealing and force-directed movement. It studies link pipelining techniques that yield improved throughput in an energy-efficient manner. A simulator is automatically generated for each customized NoC, and its traffic generators use a self-similar message distribution, as opposed to Poisson, to better match application behavior. Compared to a conventional synchronous NoC, this design is superior by achieving comparable message latency with half the energy