Low-fi skin vision: A case study in rapid prototyping a sensory substitution system

We describe the design process we have used to develop a minimal, twenty vibration motor Tactile Vision Sensory Substitution (TVSS) system which enables blind-folded subjects to successfully track and bat a rolling ball and thereby experience 'skin vision'. We have employed a low-fi rapid prototyping approach to build this system and argue that this methodology is particularly effective for building embedded interactive systems. We support this argument in two ways. First, by drawing on theoretical insights from robotics, a discipline that also has to deal with the challenge of building complex embedded systems that interact with their environments; second, by using the development of our TVSS as a case study: describing the series of prototypes that led to our successful design and highlighting what we learnt at each stage

An application generator for rapid prototyping of Ada real-time control software

The need to increase engineering productivity and decrease software life cycle costs in real-time system development establishes a motivation for a method of rapid prototyping. The design by iterative rapid prototyping technique is described. A tool which facilitates such a design methodology for the generation of embedded control software is described

Initial thoughts on rapid prototyping techniques

This paper sets some context, raises issues, and provides our initial thinking on the characteristics of effective rapid prototyping techniques.After discussing the role rapid prototyping techniques can play in the software lifecycle, the paper looks at possible technical approaches including: heavily parameterized models, reusable software, rapid prototyping languages, prefabrication techniques for system generation, and reconfigurable test harnesses.The paper concludes that a multi-faceted approach to rapid prototyping techniques is needed if we are to address a broad range of applications successfully -- no single technical approach suffices for all potentially desirable applications

Slisp: A Flexible Software Toolkit for Hybrid, Embedded and Distributed Applications

We describe Slisp (pronounced ‘Ess-Lisp’), a hybrid Lisp–C programming toolkit for the development of scriptable and distributed applications. Computationally expensive operations implemented as separate C-coded modules are selectively compiled into a small Xlisp interpreter, then called as Lisp functions in a Lisp-coded program. The resulting hybrid program may run in several modes: as a stand-alone executable, embedded in a different C program, as a networked server accessed from another Slisp client, or as a networked server accessed from a C-coded client. Five years of experience with Slisp, as well experience with other scripting languages such as Tcl and Perl, are summarized. These experiences suggest that Slisp will be most useful for mid-sized applications in which the kinds of scripting and embeddability features provided by Tcl and Perl can be extended in an efficient manner to larger applications, while maintaining a well-defined standard (Common Lisp) for these extensions. In addition, the generality of Lisp makes Lisp a good candidate for an application-level communication language in distributed environments

Printing Embedded Circuits

Automated manufacturing technologies such as freeform fabrication can greatly reduce the cost and complexity of infrastructure required to manufacture unique devices or invent new technologies. Multi-material freeform fabrication processes under development have the potential to automatically build complete functional devices including electronics. Making this technology available to creative individuals will revolutionize art and invention, but requires extensive simplification and cost reduction of what is still a laboratory technology. The combination of a Fab@Home Model 1 personal fabrication system and commercially available materials allows the demonstration of simple and inexpensive freeform fabrication of functional embedded electrical circuits, and useful devices. Using this approach, we have been able to demonstrate an LED flashlight, functional printed circuit boards in 2-dimensions and 3- dimensions that are actually entirely printed, and a child’s toy with embedded circuitry. These results, and the materials and methods involved in producing them will be presented in detail.Mechanical Engineerin

Bioengineered Textiles and Nonwovens – the convergence of bio-miniaturisation and electroactive conductive polymers for assistive healthcare, portable power and design-led wearable technology

Today, there is an opportunity to bring together creative design activities to exploit the responsive and adaptive ‘smart’ materials that are a result of rapid development in electro, photo active polymers or OFEDs (organic thin film electronic devices), bio-responsive hydrogels, integrated into MEMS/NEMS devices and systems respectively. Some of these integrated systems are summarised in this paper, highlighting their use to create enhanced functionality in textiles, fabrics and non-woven large area thin films. By understanding the characteristics and properties of OFEDs and bio polymers and how they can be transformed into implementable physical forms, innovative products and services can be developed, with wide implications. The paper outlines some of these opportunities and applications, in particular, an ambient living platform, dealing with human centred needs, of people at work, people at home and people at play. The innovative design affords the accelerated development of intelligent materials (interactive, responsive and adaptive) for a new product & service design landscape, encompassing assistive healthcare (smart bandages and digital theranostics), ambient living, renewable energy (organic PV and solar textiles), interactive consumer products, interactive personal & beauty care (e-Scent) and a more intelligent built environment

The Approach of Complex Insert Packaging Fabrication in Stereolithography

The approach of complex insert packaging fabrication in stereolithography is studied in the paper. There are many difficulties being overcome, such as the dispensing shadowing problem caused by the geometric shape of insert, the polymer feeding problem caused by greater insert height than the layer thickness, and the positioning problem of insert that leads to instability of packaging. These drawbacks led to unsatisfactory results of the insert packaging in stereolithography. In order to solve the problems, a new method of complex inserts packaging fabrication in stereolithography is proposed in this paper. Based on the geometric information, function and assembly direction of the inserts, the packaging approach is developed. The approach proposed in this paper has been verified by experiments. It brings considerable contributions to the application of insert packaging in stereolithography. It is also favorable to the improvement of insert packaging efficiency and assembly fabricationMechanical Engineerin