315 research outputs found
A framework for generating operational characteristic curves for semiconductor manufacturing systems using flexible and reusable discrete event simulations
This thesis proposes a framework for generating operating curves for semiconductor manufacturing facilities using a modular flexible discrete event simulation (DES) model embedded in an application that automates the design of experiments for the simulations. Typically, operating curves are generated using analytical queueing models that are difficult to implement and hence, can only be used for benchmarking purposes. Alternatively, DES models are more capable of capturing the complexities of a semiconductor manufacturing facility such as re-entrancy, rework and non-identical toolsets. However, traditional craft-based simulations require much time and resources. The proposed methodology aims to reduce this time by automatically calculating the parameters for experimentation and generating the simulation model. It proposes a novel method to more appropriately allocate simulation effort by selecting design points more relevant to the operating curve.
The methodology was initially applied to a single toolset model and tested as a pilot case study using actual factory data. Overall, the resulting operating curves matched that of the actual data. Subsequently, the methodology was applied to a full semiconductor manufacturing facility, using datasets from the Semiconductor Wafer Manufacturing Data Format Specification. The automated framework was shown to generate the curves rapidly and comparisons against a number of queueing model equivalents showed that the DES curves were more accurate. The implications of this work mean that on deployment of the application, semiconductor manufacturers can quickly obtain an accurate operating curve of their factory that could be used to aid in capacity planning and enable better decision-making regarding allocation of resources
Advanced Process Monitoring for Industry 4.0
This book reports recent advances on Process Monitoring (PM) to cope with the many challenges raised by the new production systems, sensors and âextreme dataâ conditions that emerged with Industry 4.0. Concepts such as digital-twins and deep learning are brought to the PM arena, pushing forward the capabilities of existing methodologies to handle more complex scenarios. The evolution of classical paradigms such as Latent Variable modeling, Six Sigma and FMEA are also covered. Applications span a wide range of domains such as microelectronics, semiconductors, chemicals, materials, agriculture, as well as the monitoring of rotating equipment, combustion systems and membrane separation processes
Etudes de bruit du fond dans le canal HâZZ*â4l pour le Run 1 du LHC. Perspectives du mode bbH(âγγ) et Ă©tudes d'un systĂšme de dĂ©tecteur pixel amĂ©liorĂ© pour la mise Ă niveau de l'expĂ©rience ATLAS pour la phase HL-LHC
The discovery of a scalar boson, known as the Higgs boson, marked the first LHC data period (2010-2012). Using mainly di-photon and di-Z decays, with the latest leading to a four leptons final state, the mass of the boson was measured with a precision of <0.2%. Relevant couplings were estimated by combining several final states, while corresponding uncertainties would largely benefit from the increased statistics expected during the next LHC data periods (Run 2, Phase 2).The HâZZ*â4l channel, in spite of its suppressed brunching ratio, benefits from a weak background, making it a prime choice for the investigation of the new bosonâs properties. In this thesis, the analysis aimed to the observation of this mode with the ALTAS detector is presented, with a focus on the measurement and control of the reducible electron background.In the context of preparation for future high luminosity data periods, foreseen from 2025 onwards, two distinct studies are conducted:The first concerns the observability potential of the Higgs associated production mode in conjunction with two b-quarks. A multivariate analysis based on simulated data confirms a very weak expected signal in the Hâdi-photon channel.The second revolves around the conception and development of an inner silicon detector capable of operating in the hostile environment of high radiation and increased occupancy, expected during LHC Phase 2. Main studies were concentrated on improving radiation hardness, geometrical and detection efficiency. Through fabrication process simulation and SiMS measurements, doping profiles and electrical characteristics, expected for innovative technologies, are explored. Prototypes were designed and evaluated in test beams and irradiation experiments in order to asses their performances and that of associated read-out electronics.La premiĂšre prise des donnĂ©es du LHC (2010-2012) a Ă©tĂ© marquĂ©e par la dĂ©couverte du boson scalaire, dit boson de Higgs. Sa masse a Ă©tĂ© mesurĂ©e avec une prĂ©cision de 0.2% en utilisant ses dĂ©sintĂ©grations en deux photons et celles en deux bosons Z donnant quatre leptons dans lâĂ©tat final. Les couplages ont Ă©tĂ© estimĂ©s en combinant plusieurs Ă©tats finaux, tandis que la prĂ©cision sur leur mesure pourra bĂ©nĂ©ficier Ă©normĂ©ment de la grande statistique qui sera accumulĂ©e pendant les prochaines pĂ©riodes de prise des donnĂ©es au LHC (Run 2, Phase 2).Le canal HâZZ*â4 leptons, a un rapport d'embranchement rĂ©duit mais prĂ©sente un faible bruit de fond, ce qui le rend attractif pour la dĂ©termination des propriĂ©tĂ©s du nouveau boson. Dans cette thĂšse, lâanalyse conduite pour la mise en Ă©vidence de ce mode dans lâexpĂ©rience ATLAS est dĂ©taillĂ©e, avec un poids particulier portĂ© Ă la mesure et au contrĂŽle du bruit de fond rĂ©ductible en prĂ©sence dâĂ©lectrons.Dans le cadre de la prĂ©paration de futures prises de donnĂ©es Ă trĂšs haute luminositĂ©, prĂ©vues Ă partir de 2025, deux Ă©tudes sont menĂ©es:La premiĂšre concerne lâobservabilitĂ© du mode de production du boson de Higgs en association avec des quarks b. Une analyse multivariĂ©e, basĂ©e sur des donnĂ©es simulĂ©es, confirme un trĂšs faible signal dans le canal Hâ2 photons.La seconde concerne la conception et le dĂ©veloppement dâun dĂ©tecteur interne en silicium, adaptĂ© Ă lâenvironnement hostile, de haute irradiation et de taux dâoccupation Ă©levĂ©e, attendues pendant la Phase 2 du LHC. Des Ă©tudes concernant lâoptimisation de la gĂ©omĂ©trie, lâamĂ©lioration de lâefficacitĂ© ainsi que la rĂ©sistance Ă lâirradiation ont Ă©tĂ© menĂ©es. A travers des mesures SiMS et des simulations des procĂ©dĂ©s de fabrication, les profiles de dopage et les caractĂ©ristiques Ă©lectriques attendues pour des technologies innovantes sont explorĂ©s. Des prototypes ont Ă©tĂ© testĂ©s sous faisceau et soumis Ă des irradiations, afin dâĂ©valuer les performances du dĂ©tecteur et celles de son Ă©lectronique associĂ©e
Virtual metrology for plasma etch processes.
Plasma processes can present dicult control challenges due to time-varying dynamics
and a lack of relevant and/or regular measurements. Virtual metrology (VM) is the
use of mathematical models with accessible measurements from an operating process to
estimate variables of interest. This thesis addresses the challenge of virtual metrology
for plasma processes, with a particular focus on semiconductor plasma etch.
Introductory material covering the essentials of plasma physics, plasma etching, plasma
measurement techniques, and black-box modelling techniques is rst presented for readers
not familiar with these subjects. A comprehensive literature review is then completed
to detail the state of the art in modelling and VM research for plasma etch processes.
To demonstrate the versatility of VM, a temperature monitoring system utilising a
state-space model and Luenberger observer is designed for the variable specic impulse
magnetoplasma rocket (VASIMR) engine, a plasma-based space propulsion system. The
temperature monitoring system uses optical emission spectroscopy (OES) measurements
from the VASIMR engine plasma to correct temperature estimates in the presence of
modelling error and inaccurate initial conditions. Temperature estimates within 2% of
the real values are achieved using this scheme.
An extensive examination of the implementation of a wafer-to-wafer VM scheme to estimate
plasma etch rate for an industrial plasma etch process is presented. The VM
models estimate etch rate using measurements from the processing tool and a plasma
impedance monitor (PIM). A selection of modelling techniques are considered for VM
modelling, and Gaussian process regression (GPR) is applied for the rst time for VM
of plasma etch rate. Models with global and local scope are compared, and modelling
schemes that attempt to cater for the etch process dynamics are proposed. GPR-based
windowed models produce the most accurate estimates, achieving mean absolute percentage
errors (MAPEs) of approximately 1:15%. The consistency of the results presented
suggests that this level of accuracy represents the best accuracy achievable for
the plasma etch system at the current frequency of metrology.
Finally, a real-time VM and model predictive control (MPC) scheme for control of
plasma electron density in an industrial etch chamber is designed and tested. The VM
scheme uses PIM measurements to estimate electron density in real time. A predictive
functional control (PFC) scheme is implemented to cater for a time delay in the VM
system. The controller achieves time constants of less than one second, no overshoot,
and excellent disturbance rejection properties. The PFC scheme is further expanded by
adapting the internal model in the controller in real time in response to changes in the
process operating point
Virtual metrology for plasma etch processes.
Plasma processes can present dicult control challenges due to time-varying dynamics
and a lack of relevant and/or regular measurements. Virtual metrology (VM) is the
use of mathematical models with accessible measurements from an operating process to
estimate variables of interest. This thesis addresses the challenge of virtual metrology
for plasma processes, with a particular focus on semiconductor plasma etch.
Introductory material covering the essentials of plasma physics, plasma etching, plasma
measurement techniques, and black-box modelling techniques is rst presented for readers
not familiar with these subjects. A comprehensive literature review is then completed
to detail the state of the art in modelling and VM research for plasma etch processes.
To demonstrate the versatility of VM, a temperature monitoring system utilising a
state-space model and Luenberger observer is designed for the variable specic impulse
magnetoplasma rocket (VASIMR) engine, a plasma-based space propulsion system. The
temperature monitoring system uses optical emission spectroscopy (OES) measurements
from the VASIMR engine plasma to correct temperature estimates in the presence of
modelling error and inaccurate initial conditions. Temperature estimates within 2% of
the real values are achieved using this scheme.
An extensive examination of the implementation of a wafer-to-wafer VM scheme to estimate
plasma etch rate for an industrial plasma etch process is presented. The VM
models estimate etch rate using measurements from the processing tool and a plasma
impedance monitor (PIM). A selection of modelling techniques are considered for VM
modelling, and Gaussian process regression (GPR) is applied for the rst time for VM
of plasma etch rate. Models with global and local scope are compared, and modelling
schemes that attempt to cater for the etch process dynamics are proposed. GPR-based
windowed models produce the most accurate estimates, achieving mean absolute percentage
errors (MAPEs) of approximately 1:15%. The consistency of the results presented
suggests that this level of accuracy represents the best accuracy achievable for
the plasma etch system at the current frequency of metrology.
Finally, a real-time VM and model predictive control (MPC) scheme for control of
plasma electron density in an industrial etch chamber is designed and tested. The VM
scheme uses PIM measurements to estimate electron density in real time. A predictive
functional control (PFC) scheme is implemented to cater for a time delay in the VM
system. The controller achieves time constants of less than one second, no overshoot,
and excellent disturbance rejection properties. The PFC scheme is further expanded by
adapting the internal model in the controller in real time in response to changes in the
process operating point
The Boston University Photonics Center annual report 2012-2013
This repository item contains an annual report that summarizes activities of the Boston University Photonics Center in the 2012-2013 academic year. The report provides quantitative and descriptive information regarding photonics programs in education, interdisciplinary research, business innovation, and technology development. The Boston University Photonics Center (BUPC) is an interdisciplinary hub for education, research, scholarship, innovation, and technology development associated with practical uses of light.This report summarizes activities of the Boston University Photonics Center during the period July 2012 through June 2013. These activities span the Centerâs complementary missions in education, research, technology development, and commercialization. The Photonics Center continues to grow as an international leader in photonics research, while executing the Centerâs strategic plan and serving as a university-wide resource for several affiliate Centers. For more information about the strategic plan, read the Photonics Center Strategic Plan section on page 10. In research, Photonics Center faculty published nearly 150 journal papers spanning the field of photonics. A number of awards for outstanding achievement in education and research were presented to Photonics Center faculty members, including a Peter Paul Professorship for Professor Xue Han, an NSF Career Award for Professor Ajay Joshi, and the 2012 Innovator of the Year Award from Boston University for Professor Theodore Moustakas. New external grant funding for the 2012- 2013 fiscal year totaled over $21.8M. For more information on our research activities, read the Research section on page 24. In technology development, the Photonics Center has turned a chapter, by completing the transition from a focus on Defense/ Security applications to a focus on the healthcare market sector. The commercial sector is expected to energize the technology development efforts for the foreseeable future, but the roots in defense/security are still important and the Center will continue to pursue new research grants in this area. For more information on our technology development program and on specific projects, read the Technology Development section on page 45. In education, 20 Photonics Center graduate students received Ph.D. diplomas. Photonics Center faculty taught 32 photonics courses. The Center supported a Research Experiences for Teachers (RET) site in Biophotonic Sensors and Systems for 10 middle school and high school teachers. The Photonics Center sponsored the Herbert J. Berman âFuture of Lightâ Prize at the Universityâs Scholars Day. For more on our education programs, read the Education section on page 54. In commercialization, Boston Universityâs Business Innovation Center (BIC) currently hosts seven technology start-up companies. There is a healthy turnover in the Innovation Center space with a total of 19 companies residing at BIC over the past year. The mix of companies includes: life sciences, biotechnology, medical devices, photonics, and clean energy; and nine of the 19 companies originated from within BU. All the BIC tenants are engaged in the commercialization of new technologies of importance to society and all are active in the BU community in terms of offering internships, employment opportunities or research collaborations. For more information about Business Innovation Center activities, read the Business Innovation Center chapter in the Facilities and Equipment section on page 66
The Boston University Photonics Center annual report 2012-2013
This repository item contains an annual report that summarizes activities of the Boston University Photonics Center in the 2012-2013 academic year. The report provides quantitative and descriptive information regarding photonics programs in education, interdisciplinary research, business innovation, and technology development. The Boston University Photonics Center (BUPC) is an interdisciplinary hub for education, research, scholarship, innovation, and technology development associated with practical uses of light.This report summarizes activities of the Boston University Photonics Center during the period July 2012 through June 2013. These activities span the Centerâs complementary missions in education, research, technology development, and commercialization. The Photonics Center continues to grow as an international leader in photonics research, while executing the Centerâs strategic plan and serving as a university-wide resource for several affiliate Centers. For more information about the strategic plan, read the Photonics Center Strategic Plan section on page 10. In research, Photonics Center faculty published nearly 150 journal papers spanning the field of photonics. A number of awards for outstanding achievement in education and research were presented to Photonics Center faculty members, including a Peter Paul Professorship for Professor Xue Han, an NSF Career Award for Professor Ajay Joshi, and the 2012 Innovator of the Year Award from Boston University for Professor Theodore Moustakas. New external grant funding for the 2012- 2013 fiscal year totaled over $21.8M. For more information on our research activities, read the Research section on page 24. In technology development, the Photonics Center has turned a chapter, by completing the transition from a focus on Defense/ Security applications to a focus on the healthcare market sector. The commercial sector is expected to energize the technology development efforts for the foreseeable future, but the roots in defense/security are still important and the Center will continue to pursue new research grants in this area. For more information on our technology development program and on specific projects, read the Technology Development section on page 45. In education, 20 Photonics Center graduate students received Ph.D. diplomas. Photonics Center faculty taught 32 photonics courses. The Center supported a Research Experiences for Teachers (RET) site in Biophotonic Sensors and Systems for 10 middle school and high school teachers. The Photonics Center sponsored the Herbert J. Berman âFuture of Lightâ Prize at the Universityâs Scholars Day. For more on our education programs, read the Education section on page 54. In commercialization, Boston Universityâs Business Innovation Center (BIC) currently hosts seven technology start-up companies. There is a healthy turnover in the Innovation Center space with a total of 19 companies residing at BIC over the past year. The mix of companies includes: life sciences, biotechnology, medical devices, photonics, and clean energy; and nine of the 19 companies originated from within BU. All the BIC tenants are engaged in the commercialization of new technologies of importance to society and all are active in the BU community in terms of offering internships, employment opportunities or research collaborations. For more information about Business Innovation Center activities, read the Business Innovation Center chapter in the Facilities and Equipment section on page 66
Recommended from our members
Improving process monitoring and modeling of batch-type plasma etching tools
Manufacturing equipments in semiconductor factories (fabs) provide abundant data and opportunities for data-driven process monitoring and modeling. In particular, virtual metrology (VM) is an active area of research. Traditional monitoring techniques using univariate statistical process control charts do not provide immediate feedback to quality excursions, hindering the implementation of fab-wide advanced process control initiatives. VM models or inferential sensors aim to bridge this gap by predicting of quality measurements instantaneously using tool fault detection and classification (FDC) sensor measurements. The existing research in the field of inferential sensor and VM has focused on comparing regressions algorithms to demonstrate their feasibility in various applications. However, two important areas, data pretreatment and post-deployment model maintenance, are usually neglected in these discussions. Since it is well known that the industrial data collected is of poor quality, and that the semiconductor processes undergo drifts and periodic disturbances, these two issues are the roadblocks in furthering the adoption of inferential sensors and VM models. In data pretreatment, batch data collected from FDC systems usually contain inconsistent trajectories of various durations. Most analysis techniques requires the data from all batches to be of same duration with similar trajectory patterns. These inconsistencies, if unresolved, will propagate into the developed model and cause challenges in interpreting the modeling results and degrade model performance. To address this issue, a Constrained selective Derivative Dynamic Time Warping (CsDTW) method was developed to perform automatic alignment of trajectories. CsDTW is designed to preserve the key features that characterizes each batch and can be solved efficiently in polynomial time. Variable selection after trajectory alignment is another topic that requires improvement. To this end, the proposed Moving Window Variable Importance in Projection (MW-VIP) method yields a more robust set of variables with demonstrably more long-term correlation with the predicted output. In model maintenance, model adaptation has been the standard solution for dealing with drifting processes. However, most case studies have already preprocessed the model update data offline. This is an implicit assumption that the adaptation data is free of faults and outliers, which is often not true for practical implementations. To this end, a moving window scheme using Total Projection to Latent Structure (T-PLS) decomposition screens incoming updates to separate the harmless process noise from the outliers that negatively affects the model. The integrated approach was demonstrated to be more robust. In addition, model adaptation is very inefficient when there are multiplicities in the process, multiplicities could occur due to process nonlinearity, switches in product grade, or different operating conditions. A growing structure multiple model system using local PLS and PCA models have been proposed to improve model performance around process conditions with multiplicity. The use of local PLS and PCA models allows the method to handle a much larger set of inputs and overcome several challenges in mixture model systems. In addition, fault detection sensitivities are also improved by using the multivariate monitoring statistics of these local PLS/PCA models. These proposed methods are tested on two plasma etch data sets provided by Texas Instruments. In addition, a proof of concept using virtual metrology in a controller performance assessment application was also tested.Chemical Engineerin
30th International Conference on Information Modelling and Knowledge Bases
Information modelling is becoming more and more important topic for researchers, designers, and users of information systems. The amount and complexity of information itself, the number of abstraction levels of information, and the size of databases and knowledge bases are continuously growing. Conceptual modelling is one of the sub-areas of information modelling. The aim of this conference is to bring together experts from different areas of computer science and other disciplines, who have a common interest in understanding and solving problems on information modelling and knowledge bases, as well as applying the results of research to practice. We also aim to recognize and study new areas on modelling and knowledge bases to which more attention should be paid. Therefore philosophy and logic, cognitive science, knowledge management, linguistics and management science are relevant areas, too. In the conference, there will be three categories of presentations, i.e. full papers, short papers and position papers
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