Test exploration and validation using transaction level models

The complexity of the test infrastructure and test strategies in systems-on-chip approaches the complexity of the functional design space. This paper presents test design space exploration and validation of test strategies and schedules using transaction level models (TLMs). Since many aspects of testing involve the transfer of a significant amount of test stimuli and responses, the communication-centric view of TLMs suits this purpose exceptionally wel

Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

High level behavioural modelling of boundary scan architecture.

This project involves the development of a software tool which enables the integration of the IEEE 1149.1/JTAG Boundary Scan Test Architecture automatically into an ASIC (Application Specific Integrated Circuit) design. The tool requires the original design (the ASIC) to be described in VHDL-IEEE 1076 Hardware Description Language. The tool consists of the two major elements: i) A parsing and insertion algorithm developed and implemented in 'C'; ii) A high level model of the Boundary Scan Test Architecture implemented in 'VHDL'. The parsing and insertion algorithm is developed to deal with identifying the design Input/Output (I/O) terminals, their types and the order they appear in the ASIC design. It then attaches suitable Boundary Scan Cells to each I/O, except power and ground and inserts the high level models of the full Boundary Scan Architecture into the ASIC without altering the design core structure

Non-destructive quantification of tissue scaffolds and augmentation implants using X-ray microtomography

A three dimensional (3D), interconnected, porous structure is essential for bone tissue engineering scaffolds and skeletal augmentation implants. Current methods of characterising these structures, however, are limited to average properties such as percentage porosity. More accurate quantitative properties, such as pore and interconnect size distributions, are required. Once measured, these parameters need to be correlated to tissue regeneration and integration criteria, including solute transport, blood vessel regeneration, bone ingrowth, and mechanical properties. Ideally, these techniques would work in vitro and in vivo, and hence allow evaluation of osteoconduction and osseointegration after implantation. This thesis will focus on developing and applying algorithms for use with X-ray microtomography (micro-CT or μCT) which can non-destructively image internal structure at the micron scale. The technique will be demonstrated on two separate materials: bioactive glass scaffolds and titanium (Ti) augmentation devices. Using the developed techniques, the structural and compositional evolutions of bioactive glass scaffolds in a simulated body fluid (SBF) flow environment were quantified using micro-CT scans taken at different dissolution stages. Results show that 70S30C bioactive scaffolds retain favourable 3D structures during a 28 d dissolution experiment, with a modal equivalent pore diameter of 682 μm staying unchanged, and a modal equivalent interconnect diameter decreasing from 252 μm to 209 μm. The techniques were then applied to porous Ti augmentation scaffolds. These scaffolds, produced by selective laser melting have very different pore networks with graded randomness and unit size. They present new challenges when applying the developed micro-CT quantification techniques. Using a further adapted methodology, the interconnecting pore sizes, strut thickness, and surface roughness were measured. This demonstrated the robustness of the methodologies and their applicability to a range of tissue scaffolds and augmentation devices

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

TOWARDS INTEGRATION OF GRAPHENE IN ADVANCED CMOS INTERCONNECT TECHNOLOGY

The integration of graphene into existing state-of-the-art semiconductor manufacturing is a topic of worldwide interest. With its unprecedented electrical, thermal and mechanical properties, graphene is ideally suited for back-end of line (BEOL) technology to boost the performance of on-chip copper (Cu) interconnects. However, the lack of BEOL compatible methods has stymied the true evaluation of Cu/graphene hybrid (Cu-G) technology. The objectives of this thesis proposal are to demonstrate BEOL-compatible graphene growth techniques, and explore various avenues for practical integration of graphene in order to achieve better electrical, thermal and reliability metrics than traditional interconnect technology

SINGLE EVENT UPSET DETECTION IN FIELD PROGRAMMABLE GATE ARRAYS

The high-radiation environment in space can lead to anomalies in normal satellite operation. A major cause of concern to spacecraft-designers is the single event upset (SEU). SEUs can result in deviations from expected component behavior and are capable of causing irreversible damage to hardware. In particular, Field Programmable Gate Arrays (FPGAs) are known to be highly susceptible to SEUs. Radiation-hardened versions of such devices are associated with an increase in power consumption and cost in addition to being technologically inferior when compared to contemporary commercial-off-the-shelf (COTS) parts. This thesis consequently aims at exploring the option of using COTS FPGAs in satellite payloads. A framework is developed, allowing the SEU susceptibility of such a device to be studied. SEU testing is carried out in a software-simulated fault environment using a set of Java classes called JBits. A radiation detector module, to measure the radiation backdrop of the device, is also envisioned as part of the final design implementation