Low-Voltage Analog Circuit Design Using the Adaptively Biased Body-Driven Circuit Technique

The scaling of MOSFET dimensions and power supply voltage, in conjunction with an increase in system- and circuit-level performance requirements, are the most important factors driving the development of new technologies and design techniques for analog and mixed-signal integrated circuits. Though scaling has been a fact of life for analog circuit designers for many years, the approaching 1-V and sub-1-V power supplies, combined with applications that have increasingly divergent technology requirements, means that the analog and mixed-signal IC designs of the future will probably look quite different from those of the past. Foremost among the challenges that analog designers will face in highly scaled technologies are low power supply voltages, which limit dynamic range and even circuit functionality, and ultra-thin gate oxides, which give rise to significant levels of gate leakage current. The goal of this research is to develop novel analog design techniques which are commensurate with the challenges that designers will face in highly scaled CMOS technologies. To that end, a new and unique body-driven design technique called adaptive gate biasing has been developed. Adaptive gate biasing is a method for guaranteeing that MOSFETs in a body-driven simple current mirror, cascode current mirror, or regulated cascode current source are biased in saturation—independent of operating region, temperature, or supply voltage—and is an enabling technology for high-performance, low-voltage analog circuits. To prove the usefulness of the new design technique, a body-driven operational amplifier that heavily leverages adaptive gate biasing has been developed. Fabricated on a 3.3-V/0.35-μm partially depleted silicon-onv-insulator (PD-SOI) CMOS process, which has nMOS and pMOS threshold voltages of 0.65 V and 0.85 V, respectively, the body-driven amplifier displayed an open-loop gain of 88 dB, bandwidth of 9 MHz, and PSRR greater than 50 dB at 1-V power supply

Low-Power Reconfigurable Sensing Circuitry for the Internet-of-Things Paradigm

With ubiquitous wireless communication via Wi-Fi and nascent 5th Generation mobile communications, more devices -- both smart and traditionally dumb -- will be interconnected than ever before. This burgeoning trend is referred to as the Internet-of-Things. These new sensing opportunities place a larger burden on the underlying circuitry that must operate on finite battery power and/or within energy-constrained environments. New developments of low-power reconfigurable analog sensing platforms like field-programmable analog arrays (FPAAs) present an attractive sensing solution by processing data in the analog domain while staying flexible in design. This work addresses some of the contemporary challenges of low-power wireless sensing via traditional application-specific sensing and with FPAAs. A large emphasis is placed on furthering the development of FPAAs by making them more accessible to designers without a strong integrated-circuit background -- much like FPGAs have done for digital designers

Integrated Circuits for Programming Flash Memories in Portable Applications

Smart devices such as smart grids, smart home devices, etc. are infrastructure systems that connect the world around us more than before. These devices can communicate with each other and help us manage our environment. This concept is called the Internet of Things (IoT). Not many smart nodes exist that are both low-power and programmable. Floating-gate (FG) transistors could be used to create adaptive sensor nodes by providing programmable bias currents. FG transistors are mostly used in digital applications like Flash memories. However, FG transistors can be used in analog applications, too. Unfortunately, due to the expensive infrastructure required for programming these transistors, they have not been economical to be used in portable applications. In this work, we present low-power approaches to programming FG transistors which make them a good candidate to be employed in future wireless sensor nodes and portable systems. First, we focus on the design of low-power circuits which can be used in programming the FG transistors such as high-voltage charge pumps, low-drop-out regulators, and voltage reference cells. Then, to achieve the goal of reducing the power consumption in programmable sensor nodes and reducing the programming infrastructure, we present a method to program FG transistors using negative voltages. We also present charge-pump structures to generate the necessary negative voltages for programming in this new configuration

High-Gain Transimpedance Amplifier With DC Photodiode Current Rejection

This master\u27s thesis deals with the design of a differential high-gain transimpedance amplifier in TSMC\u27s 0.18 um mixed signal process that utilizes a DC photodiode current cancellation loop and a switching automatic gain control (AGC) with a bilinear gain curve. The amplifier is designed to satisfy the demands of Optical Coherence Tomography applications where the receiver is expected to measure the envelope power of an amplitude modulated sinusoidal optical signal that incorporates a large DC component. Methods of increasing dynamic range and gain linearity through the use of DC photodiode current cancellation and bilinear gain are explored. Effects of changing DC photodiode current on the overall system response is also demonstrated

Design and implementation of a multi-modal sensor with on-chip security

With the advancement of technology, wearable devices for fitness tracking, patient monitoring, diagnosis, and disease prevention are finding ways to be woven into modern world reality. CMOS sensors are known to be compact, with low power consumption, making them an inseparable part of wireless medical applications and Internet of Things (IoT). Digital/semi-digital output, by the translation of transmitting data into the frequency domain, takes advantages of both the analog and digital world. However, one of the most critical measures of communication, security, is ignored and not considered for fabrication of an integrated chip. With the advancement of Moore\u27s law and the possibility of having a higher number of transistors and more complex circuits, the feasibility of having on-chip security measures is drawing more attention. One of the fundamental means of secure communication is real-time encryption. Encryption/ciphering occurs when we encode a signal or data, and prevents unauthorized parties from reading or understanding this information. Encryption is the process of transmitting sensitive data securely and with privacy. This measure of security is essential since in biomedical devices, the attacker/hacker can endanger users of IoT or wearable sensors (e.g. attacks at implanted biosensors can cause fatal harm to the user). This work develops 1) A low power and compact multi-modal sensor that can measure temperature and impedance with a quasi-digital output and 2) a low power on-chip signal cipher for real-time data transfer

Integrated Circuits/Microchips

With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

Design Techniques for High Speed Low Voltage and Low Power Non-Calibrated Pipeline Analog to Digital Converters

The profound digitization of modern microelectronic modules made Analog-to- Digital converters (ADC) key components in many systems. With resolutions up to 14bits and sampling rates in the 100s of MHz, the pipeline ADC is a prime candidate for a wide range of applications such as instrumentation, communications and consumer electronics. However, while past work focused on enhancing the performance of the pipeline ADC from an architectural standpoint, little has been done to individually address its fundamental building blocks. This work aims to achieve the latter by proposing design techniques to improve the performance of these blocks with minimal power consumption in low voltage environments, such that collectively high performance is achieved in the pipeline ADC. Towards this goal, a Recycling Folded Cascode (RFC) amplifier is proposed as an enhancement to the general performance of the conventional folded cascode. Tested in Taiwan Semiconductor Manufacturing Company (TSMC) 0.18?m Complementary Metal Oxide Semiconductor (CMOS) technology, the RFC provides twice the bandwidth, 8-10dB additional gain, more than twice the slew rate and improved noise performance over the conventional folded cascode-all at no additional power or silicon area. The direct auto-zeroing offset cancellation scheme is optimized for low voltage environments using a dual level common mode feedback (CMFB) circuit, and amplifier differential offsets up to 50mV are effectively cancelled. Together with the RFC, the dual level CMFB was used to implement a sample and hold amplifier driving a singleended load of 1.4pF and using only 2.6mA; at 200MS/s better than 9bit linearity is achieved. Finally a power conscious technique is proposed to reduce the kickback noise of dynamic comparators without resorting to the use of pre-amplifiers. When all techniques are collectively used to implement a 1Vpp 10bit 160MS/s pipeline ADC in Semiconductor Manufacturing International Corporation (SMIC) 0.18[mu]m CMOS, 9.2 effective number of bits (ENOB) is achieved with a near Nyquist-rate full scale signal. The ADC uses an area of 1.1mm2 and consumes 42mW in its analog core. Compared to recent state-of-the-art implementations in the 100-200MS/s range, the presented pipeline ADC uses the least power per conversion rated at 0.45pJ/conversion-step

Advanced CMOS Integrated Circuit Design and Application

The recent development of various application systems and platforms, such as 5G, B5G, 6G, and IoT, is based on the advancement of CMOS integrated circuit (IC) technology that enables them to implement high-performance chipsets. In addition to development in the traditional fields of analog and digital integrated circuits, the development of CMOS IC design and application in high-power and high-frequency operations, which was previously thought to be possible only with compound semiconductor technology, is a core technology that drives rapid industrial development. This book aims to highlight advances in all aspects of CMOS integrated circuit design and applications without discriminating between different operating frequencies, output powers, and the analog/digital domains. Specific topics in the book include: Next-generation CMOS circuit design and application; CMOS RF/microwave/millimeter-wave/terahertz-wave integrated circuits and systems; CMOS integrated circuits specially used for wireless or wired systems and applications such as converters, sensors, interfaces, frequency synthesizers/generators/rectifiers, and so on; Algorithm and signal-processing methods to improve the performance of CMOS circuits and systems

Low-power current-mode ADC for CMOS sensor IC

A low-energy current-mode algorithmic pipelined ADC targeted for use in distributed sensor networks is presented. The individual nodes combine sensing, computation and communications into an extremely small volume. The nodes operate with very low duty cycle due to limited energy. Ideally these sensor networks will be massive in size and dense in order to promote redundancy. In addition the networks will be collectively intelligent and adaptive. To achieve these goals, distributed sensor networks will require very small,inexpensive nodes that run for long periods of time on very little energy. One component of such network nodes is an A/D converter. An ADC acts as a crucial interface between the sensed environment and the sensor network as a whole. The work presented here focuses on moderate resolution, and moderate speed, but ultra-low-power ADCs. The 6 bit current-mode algorithmic pipelined ADC reported here consumes 8 pJ/bit samples at 0.65V supply and 130 kS/s. The current was chosen as the information carrying quantity instead of voltage as it is more favorable for low-voltage and low-power applications. The reference current chosen was 150nA. All the blocks are using transistors operating in subthreshold or weak inversion region of operation, to work in low-voltage and low current supply. The DNL and INL plots are given in simulation results section. The area of the overall ADC was 0.046 mm2 only