Machine learning at the interface of structural health monitoring and non-destructive evaluation

While both non-destructive evaluation (NDE) and structural health monitoring (SHM) share the objective of damage detection and identification in structures, they are distinct in many respects. This paper will discuss the differences and commonalities and consider ultrasonic/guided-wave inspection as a technology at the interface of the two methodologies. It will discuss how data-based/machine learning analysis provides a powerful approach to ultrasonic NDE/SHM in terms of the available algorithms, and more generally, how different techniques can accommodate the very substantial quantities of data that are provided by modern monitoring campaigns. Several machine learning methods will be illustrated using case studies of composite structure monitoring and will consider the challenges of high-dimensional feature data available from sensing technologies like autonomous robotic ultrasonic inspection. This article is part of the theme issue ‘Advanced electromagnetic non-destructive evaluation and smart monitoring’

Sensor-Based Monitoring and Inspection of Surface Morphology in Ultraprecision Manufacturing Processes

This research proposes approaches for monitoring and inspection of surface morphology with respect to two ultraprecision/nanomanufacturing processes, namely, ultraprecision machining (UPM) and chemical mechanical planarization (CMP). The methods illustrated in this dissertation are motivated from the compelling need for in situ process monitoring in nanomanufacturing and invoke concepts from diverse scientific backgrounds, such as artificial neural networks, Bayesian learning, and algebraic graph theory. From an engineering perspective, this work has the following contributions:1. A combined neural network and Bayesian learning approach for early detection of UPM process anomalies by integrating data from multiple heterogeneous in situ sensors (force, vibration, and acoustic emission) is developed. The approach captures process drifts in UPM of aluminum 6061 discs within 15 milliseconds of their inception and is therefore valuable for minimizing yield losses.2. CMP process dynamics are mathematically represented using a deterministic multi-scale hierarchical nonlinear differential equation model. This process-machine inter-action (PMI) model is evocative of the various physio-mechanical aspects in CMP and closely emulates experimentally acquired vibration signal patterns, including complex nonlinear dynamics manifest in the process. By combining the PMI model predictions with features gathered from wirelessly acquired CMP vibration signal patterns, CMP process anomalies, such as pad wear, and drifts in polishing were identified in their nascent stage with high fidelity (R2 ~ 75%).3. An algebraic graph theoretic approach for quantifying nano-surface morphology from optical micrograph images is developed. The approach enables a parsimonious representation of the topological relationships between heterogeneous nano-surface fea-tures, which are enshrined in graph theoretic entities, namely, the similarity, degree, and Laplacian matrices. Topological invariant measures (e.g., Fiedler number, Kirchoff index) extracted from these matrices are shown to be sensitive to evolving nano-surface morphology. For instance, we observed that prominent nanoscale morphological changes on CMP processed Cu wafers, although discernible visually, could not be tractably quantified using statistical metrology parameters, such as arithmetic average roughness (Sa), root mean square roughness (Sq), etc. In contrast, CMP induced nanoscale surface variations were captured on invoking graph theoretic topological invariants. Consequently, the graph theoretic approach can enable timely, non-contact, and in situ metrology of semiconductor wafers by obviating the need for reticent profile mapping techniques (e.g., AFM, SEM, etc.), and thereby prevent the propagation of yield losses over long production runs.Industrial Engineering & Managemen

Mathematical and Numerical Aspects of Dynamical System Analysis

From Preface: This is the fourteenth time when the conference “Dynamical Systems: Theory and Applications” gathers a numerous group of outstanding scientists and engineers, who deal with widely understood problems of theoretical and applied dynamics. Organization of the conference would not have been possible without a great effort of the staff of the Department of Automation, Biomechanics and Mechatronics. The patronage over the conference has been taken by the Committee of Mechanics of the Polish Academy of Sciences and Ministry of Science and Higher Education of Poland. It is a great pleasure that our invitation has been accepted by recording in the history of our conference number of people, including good colleagues and friends as well as a large group of researchers and scientists, who decided to participate in the conference for the first time. With proud and satisfaction we welcomed over 180 persons from 31 countries all over the world. They decided to share the results of their research and many years experiences in a discipline of dynamical systems by submitting many very interesting papers. This year, the DSTA Conference Proceedings were split into three volumes entitled “Dynamical Systems” with respective subtitles: Vibration, Control and Stability of Dynamical Systems; Mathematical and Numerical Aspects of Dynamical System Analysis and Engineering Dynamics and Life Sciences. Additionally, there will be also published two volumes of Springer Proceedings in Mathematics and Statistics entitled “Dynamical Systems in Theoretical Perspective” and “Dynamical Systems in Applications”

International Conference on Continuous Optimization (ICCOPT) 2019 Conference Book

The Sixth International Conference on Continuous Optimization took place on the campus of the Technical University of Berlin, August 3-8, 2019. The ICCOPT is a flagship conference of the Mathematical Optimization Society (MOS), organized every three years. ICCOPT 2019 was hosted by the Weierstrass Institute for Applied Analysis and Stochastics (WIAS) Berlin. It included a Summer School and a Conference with a series of plenary and semi-plenary talks, organized and contributed sessions, and poster sessions. This book comprises the full conference program. It contains, in particular, the scientific program in survey style as well as with all details, and information on the social program, the venue, special meetings, and more