Max Operation in Statistical Static Timing Analysis on the Non-Gaussian Variation Sources for VLSI Circuits

As CMOS technology continues to scale down, process variation introduces significant uncertainty in power and performance to VLSI circuits and significantly affects their reliability. If this uncertainty is not properly handled, it may become the bottleneck of CMOS technology improvement. As a result, deterministic analysis is no longer conservative and may result in either overestimation or underestimation of the circuit delay. As we know that Static-Timing Analysis (STA) is a deterministic way of computing the delay imposed by the circuits design and layout. It is based on a predetermined set of possible events of process variations, also called corners of the circuit. Although it is an excellent tool, current trends in process scaling have imposed significant difficulties to STA. Therefore, there is a need for another tool, which can resolve the aforementioned problems, and Statistical Static Timing Analysis (SSTA) has become the frontier research topic in recent years in combating such variation effects. There are two types of SSTA methods, path-based SSTA and block-based SSTA. The goal of SSTA is to parameterize timing characteristics of the timing graph as a function of the underlying sources of process parameters that are modeled as random variables. By performing SSTA, designers can obtain the timing distribution (yield) and its sensitivity to various process parameters. Such information is of tremendous value for both timing sign-off and design optimization for robustness and high profit margins. The block-based SSTA is the most efficient SSTA method in recent years. In block-based SSTA, there are two major atomic operations max and add. The add operation is simple; however, the max operation is much more complex. There are two main challenges in SSTA. The Topological Correlation that emerges from reconvergent paths, these are the ones that originate from a common node and then converge again at another node (reconvergent node). Such correlation complicates the maximum operation. The second challenge is the Spatial Correlation. It arises due to device proximity on the die and gives rise to the problems of modeling delay and arrival time. This dissertation presents statistical Nonlinear and Nonnormals canonical form of timing delay model considering process variation. This dissertation is focusing on four aspects: (1) Statistical timing modeling and analysis; (2) High level circuit synthesis with system level statistical static timing analysis; (3) Architectural implementations of the atomic operations (max and add); and (4) Design methodology. To perform statistical timing modeling and analysis, we first present an efficient and accurate statistical static timing analysis (SSTA) flow for non-linear cell delay model with non-Gaussian variation sources. To achieve system level SSTA we apply statistical timing analysis to high-level synthesis flow, and develop yield driven synthesis framework so that the impact of process variations is taken into account during high-level synthesis. To accomplish architectural implementation, we present the vector thread architecture for max operator to minimize delay and variation. Finally, we present comparison analysis with ISCAS benchmark circuits suites. In the last part of this dissertation, a SSTA design methodology is presented

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Liquid State Machine with Dendritically Enhanced Readout for Low-power, Neuromorphic VLSI Implementations

In this paper, we describe a new neuro-inspired, hardware-friendly readout stage for the liquid state machine (LSM), a popular model for reservoir computing. Compared to the parallel perceptron architecture trained by the p-delta algorithm, which is the state of the art in terms of performance of readout stages, our readout architecture and learning algorithm can attain better performance with significantly less synaptic resources making it attractive for VLSI implementation. Inspired by the nonlinear properties of dendrites in biological neurons, our readout stage incorporates neurons having multiple dendrites with a lumped nonlinearity. The number of synaptic connections on each branch is significantly lower than the total number of connections from the liquid neurons and the learning algorithm tries to find the best 'combination' of input connections on each branch to reduce the error. Hence, the learning involves network rewiring (NRW) of the readout network similar to structural plasticity observed in its biological counterparts. We show that compared to a single perceptron using analog weights, this architecture for the readout can attain, even by using the same number of binary valued synapses, up to 3.3 times less error for a two-class spike train classification problem and 2.4 times less error for an input rate approximation task. Even with 60 times larger synapses, a group of 60 parallel perceptrons cannot attain the performance of the proposed dendritically enhanced readout. An additional advantage of this method for hardware implementations is that the 'choice' of connectivity can be easily implemented exploiting address event representation (AER) protocols commonly used in current neuromorphic systems where the connection matrix is stored in memory. Also, due to the use of binary synapses, our proposed method is more robust against statistical variations.Comment: 14 pages, 19 figures, Journa

Calculation of Generalized Polynomial-Chaos Basis Functions and Gauss Quadrature Rules in Hierarchical Uncertainty Quantification

Stochastic spectral methods are efficient techniques for uncertainty quantification. Recently they have shown excellent performance in the statistical analysis of integrated circuits. In stochastic spectral methods, one needs to determine a set of orthonormal polynomials and a proper numerical quadrature rule. The former are used as the basis functions in a generalized polynomial chaos expansion. The latter is used to compute the integrals involved in stochastic spectral methods. Obtaining such information requires knowing the density function of the random input {\it a-priori}. However, individual system components are often described by surrogate models rather than density functions. In order to apply stochastic spectral methods in hierarchical uncertainty quantification, we first propose to construct physically consistent closed-form density functions by two monotone interpolation schemes. Then, by exploiting the special forms of the obtained density functions, we determine the generalized polynomial-chaos basis functions and the Gauss quadrature rules that are required by a stochastic spectral simulator. The effectiveness of our proposed algorithm is verified by both synthetic and practical circuit examples.Comment: Published by IEEE Trans CAD in May 201

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Probabilistic modeling of noise transfer characteristics in digital circuits

Device scaling, the driving force of CMOS technology, led to continuous decrease in the energy level representing logic states. The resulting small noise margins in combination with increasing problems regarding the supply voltage stability and process variability creates a design conflict between efficiency and reliability. This conflict is expected to rise more in future technologies. Current research approaches on fault-tolerance architectures and countermeasures at circuit level, unfortunately, cause a significant area and energy penalty without guaranteeing absence of errors. To overcome this problem, it seems to be attractive to tolerate bit errors at circuit level and employ error handling methods at higher system levels. To do this, an estimate of the bit error rate (BER) at circuit level is necessary. Due to the size of the circuits, Monte Carlo simulation suffers from impractical runtimes. Therefore the needed modeling scheme is proposed. The model allows a probabilistic estimation of error rates at circuit level taking into account statistical effects ranging from supply noise and electromagnetic coupling to process variability within reasonable runtimes