Tensor Computation: A New Framework for High-Dimensional Problems in EDA

Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

Application and Challenges of Signal Processing Techniques for Lamb Waves Structural Integrity Evaluation: Part A-Lamb Waves Signals Emitting and Optimization Techniques

Lamb waves have been widely studied in structural integrity evaluation during the past decades with their low-attenuation and multi-defects sensitive nature. The performance of the evaluation has close relationship with the vibration property and the frequency of Lamb waves signals. Influenced by the nature of Lamb waves and the environment, the received signals may be difficult to interpret that limits the performance of the detection. So pure Lamb waves mode emitting and high-resolution signals acquisition play important roles in Lamb waves structural integrity evaluation. In this chapter, the basic theory of Lamb waves nature and some environment factors that should be considered in structural integrity evaluation are introduced. Three kinds of typical transduces used for specific Lamb waves mode emitting and sensing are briefly introduced. Then the development of techniques to improve the interpretability of signals are discussed, including the waveform modulation techniques, multi-scale analysis techniques and the temperature effect compensation techniques are summarized

A combination of capillary and dielectrophoresis-driven assembly methods for wafer scale integration of carbon-nanotube-based nanocarpets

The wafer scale integration of carbon nanotubes (CNT) remains a challenge for electronic and electromechanical applications. We propose a novel CNT integration process relying on the combination of controlled capillary assembly and buried electrode dielectrophoresis (DEP). This process enables us to monitor the precise spatial localization of a high density of CNTs and their alignment in a pre-defined direction. Large arrays of independent and low resistivity (4.4 x 10-5 omega m) interconnections were achieved using this hybrid assembly with double-walled carbon nanotubes (DWNT). Finally, arrays of suspended individual CNT carpets are realized and we demonstrate their potential use as functional devices by monitoring their resonance frequencies (ranging between 1.7 and 10.5 MHz) using a Fabry–Perot interferometer

Black Silicon with high density and high aspect ratio nanowhiskers

Physical properties of black Silicon (b-Si) formed on Si wafers by reactive ion etching in chlorine plasma are reported in an attempt to clarify the formation mechanism and the origin of the observed optical and electrical phenomena which are promising for a variety of applications. The b-Si consisting of high density and high aspect ratio sub-micron length whiskers or pillars with tip diameters of well under 3 nm exhibits strong photoluminescence (PL) both in visible and infrared, which are interpreted in conjunction with defects, confinement effects and near band-edge emission. Structural analysis indicate that the whiskers are all crystalline and encapsulated by a thin Si oxide layer. Infrared vibrational spectrum of Si-O-Si bondings in terms of transverse-optic (TO) and longitudinal-optic (LO) phonons indicates that disorder induced LO-TO optical mode coupling can be an effective tool in assessing structural quality of the b-Si. The same phonons are likely coupled to electrons in visible region PL transitions. Field emission properties of these nanoscopic features are demonstrated indicating the influence of the tip shape on the emission. Overall properties are discussed in terms of surface morphology of the nano whiskers

Guided Lamb Wave Based 2-D Spiral Phased Array for Structural Health Monitoring of Thin Panel Structures

In almost all industries of mechanical, aerospace, and civil engineering fields, structural health monitoring (SHM) technology is essentially required for providing the reliable information of structural integrity of safety-critical structures, which can help reduce the risk of unexpected and sometimes catastrophic failures, and also offer cost-effective inspection and maintenance of the structures. State of the art SHM research on structural damage diagnosis is focused on developing global and real-time technologies to identify the existence, location, extent, and type of damage. In order to detect and monitor the structural damage in plate-like structures, SHM technology based on guided Lamb wave (GLW) interrogation is becoming more attractive due to its potential benefits such as large inspection area coverage in short time, simple inspection mechanism, and sensitivity to small damage. However, the GLW method has a few critical issues such as dispersion nature, mode conversion and separation, and multiple-mode existence. Phased array technique widely used in all aspects of civil, military, science, and medical industry fields may be employed to resolve the drawbacks of the GLW method. The GLW-based phased array approach is able to effectively examine and analyze complicated structural vibration responses in thin plate structures. Because the phased sensor array operates as a spatial filter for the GLW signals, the array signal processing method can enhance a desired signal component at a specific direction while eliminating other signal components from other directions. This dissertation presents the development, the experimental validation, and the damage detection applications of an innovative signal processing algorithm based on two-dimensional (2-D) spiral phased array in conjunction with the GLW interrogation technique. It starts with general backgrounds of SHM and the associated technology including the GLW interrogation method. Then, it is focused on the fundamentals of the GLW-based phased array approach and the development of an innovative signal processing algorithm associated with the 2-D spiral phased sensor array. The SHM approach based on array responses determined by the proposed phased array algorithm implementation is addressed. The experimental validation of the GLW-based 2-D spiral phased array technology and the associated damage detection applications to thin isotropic plate and anisotropic composite plate structures are presented

Quantification of Ultraprecision Surface Morphology using an Algebraic Graph Theoretic Approach

Assessment of progressive, nano-scale variation of surface morphology during ultraprecision manufacturing processes, such as fine-abrasive polishing of semiconductor wafers, is a challenging proposition owing to limitations with traditional surface quantifiers. We present an algebraic graph theoretic approach that uses graph topological invariants for quantification of ultraprecision surface morphology. The graph theoretic approach captures heterogeneous multi-scaled aspects of surface morphology from optical micrographs, and is therefore valuable for in situ real-time assessment of surface quality. Extensive experimental investigations with specular finished (Sa ~ 5 nm) blanket copper wafers from a chemical mechanical planarization (CMP) process suggest that the proposed method was able to quantify and track variations in surface morphology more effectively than statistical quantifiers reported in literature