10 research outputs found

    Prelayout interconnect yield prediction

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    Addressing Manufacturing Challenges in NoC-based ULSI Designs

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    Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

    Efficient FPGA implementation and power modelling of image and signal processing IP cores

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    Field Programmable Gate Arrays (FPGAs) are the technology of choice in a number ofimage and signal processing application areas such as consumer electronics, instrumentation, medical data processing and avionics due to their reasonable energy consumption, high performance, security, low design-turnaround time and reconfigurability. Low power FPGA devices are also emerging as competitive solutions for mobile and thermally constrained platforms. Most computationally intensive image and signal processing algorithms also consume a lot of power leading to a number of issues including reduced mobility, reliability concerns and increased design cost among others. Power dissipation has become one of the most important challenges, particularly for FPGAs. Addressing this problem requires optimisation and awareness at all levels in the design flow. The key achievements of the work presented in this thesis are summarised here. Behavioural level optimisation strategies have been used for implementing matrix product and inner product through the use of mathematical techniques such as Distributed Arithmetic (DA) and its variations including offset binary coding, sparse factorisation and novel vector level transformations. Applications to test the impact of these algorithmic and arithmetic transformations include the fast Hadamard/Walsh transforms and Gaussian mixture models. Complete design space exploration has been performed on these cores, and where appropriate, they have been shown to clearly outperform comparable existing implementations. At the architectural level, strategies such as parallelism, pipelining and systolisation have been successfully applied for the design and optimisation of a number of cores including colour space conversion, finite Radon transform, finite ridgelet transform and circular convolution. A pioneering study into the influence of supply voltage scaling for FPGA based designs, used in conjunction with performance enhancing strategies such as parallelism and pipelining has been performed. Initial results are very promising and indicated significant potential for future research in this area. A key contribution of this work includes the development of a novel high level power macromodelling technique for design space exploration and characterisation of custom IP cores for FPGAs, called Functional Level Power Analysis and Modelling (FLPAM). FLPAM is scalable, platform independent and compares favourably with existing approaches. A hybrid, top-down design flow paradigm integrating FLPAM with commercially available design tools for systematic optimisation of IP cores has also been developed.EThOS - Electronic Theses Online ServiceGBUnited Kingdo

    Efficient architectures and power modelling of multiresolution analysis algorithms on FPGA

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    In the past two decades, there has been huge amount of interest in Multiresolution Analysis Algorithms (MAAs) and their applications. Processing some of their applications such as medical imaging are computationally intensive, power hungry and requires large amount of memory which cause a high demand for efficient algorithm implementation, low power architecture and acceleration. Recently, some MAAs such as Finite Ridgelet Transform (FRIT) Haar Wavelet Transform (HWT) are became very popular and they are suitable for a number of image processing applications such as detection of line singularities and contiguous edges, edge detection (useful for compression and feature detection), medical image denoising and segmentation. Efficient hardware implementation and acceleration of these algorithms particularly when addressing large problems are becoming very chal-lenging and consume lot of power which leads to a number of issues including mobility, reliability concerns. To overcome the computation problems, Field Programmable Gate Arrays (FPGAs) are the technology of choice for accelerating computationally intensive applications due to their high performance. Addressing the power issue requires optimi- sation and awareness at all level of abstractions in the design flow. The most important achievements of the work presented in this thesis are summarised here. Two factorisation methodologies for HWT which are called HWT Factorisation Method1 and (HWTFM1) and HWT Factorasation Method2 (HWTFM2) have been explored to increase number of zeros and reduce hardware resources. In addition, two novel efficient and optimised architectures for proposed methodologies based on Distributed Arithmetic (DA) principles have been proposed. The evaluation of the architectural results have shown that the proposed architectures results have reduced the arithmetics calculation (additions/subtractions) by 33% and 25% respectively compared to direct implementa-tion of HWT and outperformed existing results in place. The proposed HWTFM2 is implemented on advanced and low power FPGA devices using Handel-C language. The FPGAs implementation results have outperformed other existing results in terms of area and maximum frequency. In addition, a novel efficient architecture for Finite Radon Trans-form (FRAT) has also been proposed. The proposed architecture is integrated with the developed HWT architecture to build an optimised architecture for FRIT. Strategies such as parallelism and pipelining have been deployed at the architectural level for efficient im-plementation on different FPGA devices. The proposed FRIT architecture performance has been evaluated and the results outperformed some other existing architecture in place. Both FRAT and FRIT architectures have been implemented on FPGAs using Handel-C language. The evaluation of both architectures have shown that the obtained results out-performed existing results in place by almost 10% in terms of frequency and area. The proposed architectures are also applied on image data (256 £ 256) and their Peak Signal to Noise Ratio (PSNR) is evaluated for quality purposes. Two architectures for cyclic convolution based on systolic array using parallelism and pipelining which can be used as the main building block for the proposed FRIT architec-ture have been proposed. The first proposed architecture is a linear systolic array with pipelining process and the second architecture is a systolic array with parallel process. The second architecture reduces the number of registers by 42% compare to first architec-ture and both architectures outperformed other existing results in place. The proposed pipelined architecture has been implemented on different FPGA devices with vector size (N) 4,8,16,32 and word-length (W=8). The implementation results have shown a signifi-cant improvement and outperformed other existing results in place. Ultimately, an in-depth evaluation of a high level power macromodelling technique for design space exploration and characterisation of custom IP cores for FPGAs, called func-tional level power modelling approach have been presented. The mathematical techniques that form the basis of the proposed power modeling has been validated by a range of custom IP cores. The proposed power modelling is scalable, platform independent and compares favorably with existing approaches. A hybrid, top-down design flow paradigm integrating functional level power modelling with commercially available design tools for systematic optimisation of IP cores has also been developed. The in-depth evaluation of this tool enables us to observe the behavior of different custom IP cores in terms of power consumption and accuracy using different design methodologies and arithmetic techniques on virous FPGA platforms. Based on the results achieved, the proposed model accuracy is almost 99% true for all IP core's Dynamic Power (DP) components.EThOS - Electronic Theses Online ServiceThomas Gerald Gray Charitable TrustGBUnited Kingdo

    Strain integration and performance optimization in sub-20nm FDSOI CMOS technology

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    La technologie CMOS à base de Silicium complètement déserté sur isolant (FDSOI) est considérée comme une option privilégiée pour les applications à faible consommation telles que les applications mobiles ou les objets connectés. Elle doit cela à son architecture garantissant un excellent comportement électrostatique des transistors ainsi qu'à l'intégration de canaux contraints améliorant la mobilité des porteurs. Ce travail de thèse explore des solutions innovantes en FDSOI pour nœuds 20nm et en deçà, comprenant l'ingénierie de la contrainte mécanique à travers des études sur les matériaux, les dispositifs, les procédés d'intégration et les dessins des circuits. Des simulations mécaniques, caractérisations physiques (µRaman), et intégrations expérimentales de canaux contraints (sSOI, SiGe) ou de procédés générant de la contrainte (nitrure, fluage de l'oxyde enterré) nous permettent d'apporter des recommandations pour la technologie et le dessin physique des transistors en FDSOI. Dans ce travail de thèse, nous avons étudié le transport dans les dispositifs à canal court, ce qui nous a amené à proposer une méthode originale pour extraire simultanément la mobilité des porteurs et la résistance d'accès. Nous mettons ainsi en évidence la sensibilité de la résistance d'accès à la contrainte que ce soit pour des transistors FDSOI ou nanofils. Nous mettons en évidence et modélisons la relaxation de la contrainte dans le SiGe apparaissant lors de la gravure des motifs et causant des effets géométriques (LLE) dans les technologies FDSOI avancées. Nous proposons des solutions de type dessin ainsi que des solutions technologiques afin d'améliorer la performance des cellules standard digitales et de mémoire vive statique (SRAM). En particulier, nous démontrons l'efficacité d'une isolation duale pour la gestion de la contrainte et l'extension de la capacité de polarisation arrière, qui un atout majeur de la technologie FDSOI. Enfin, la technologie 3D séquentielle rend possible la polarisation arrière en régime dynamique, à travers une co-optimisation dessin/technologie (DTCO).The Ultra-Thin Body and Buried oxide Fully Depleted Silicon On Insulator (UTBB FDSOI) CMOS technology has been demonstrated to be highly efficient for low power and low leakage applications such as mobile, internet of things or wearable. This is mainly due to the excellent electrostatics in the transistor and the successful integration of strained channel as a carrier mobility booster. This work explores scaling solutions of FDSOI for sub-20nm nodes, including innovative strain engineering, relying on material, device, process integration and circuit design layout studies. Thanks to mechanical simulations, physical characterizations and experimental integration of strained channels (sSOI, SiGe) and local stressors (nitride, oxide creeping, SiGe source/drain) into FDSOI CMOS transistors, we provide guidelines for technology and physical circuit design. In this PhD, we have in-depth studied the carrier transport in short devices, leading us to propose an original method to extract simultaneously the carrier mobility and the access resistance and to clearly evidence and extract the strain sensitivity of the access resistance, not only in FDSOI but also in strained nanowire transistors. Most of all, we evidence and model the patterning-induced SiGe strain relaxation, which is responsible for electrical Local Layout Effects (LLE) in advanced FDSOI transistors. Taking into account these geometrical effects observed at the nano-scale, we propose design and technology solutions to enhance Static Random Access Memory (SRAM) and digital standard cells performance and especially an original dual active isolation integration. Such a solution is not only stress-friendly but can also extend the powerful back-bias capability, which is a key differentiating feature of FDSOI. Eventually the 3D monolithic integration can also leverage planar Fully-Depleted devices by enabling dynamic back-bias owing to a Design/Technology Co-Optimization

    Prelayout interconnect yield prediction

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    Functional yield is a term used to describe the percentage of dies on a wafer that are not affected by catastrophic defects. Within the interconnect these defects are usually caused by particle contamination and are divided into bridging defects, which join adjacent wires and cuts, which result in broken wires. Functional yield is therefore determined by the geometry of the routing channels, how these channels are filled with wire and the distribution of defect sizes. Since the wire spacing and width are usually fixed and the distribution of defects within a mature production facility is well known, the problem reduces to estimating individual wire lengths for cuts and to estimating the overlapping distance that two wires share in neighboring sections of the routing grid for bridges. Previous work in this area has analyzed the problem by assuming that all wiring tracks are occupied with wire, leading to overestimates for the probability of failure due to both cuts and bridges. This paper utilizes statistical models of the placement/routing process to provide a more realistic approach for cut and bridge yield estimation. A comparison of the predicted probability of failure within each wiring layer with postlayout data indicate an average error of 20% for cuts and 26% for bridges

    Prelayout interconnect yield prediction

    Get PDF
    Functional yield is a term used to describe the percentage of dies on a wafer that are not affected by catastrophic defects. Within the interconnect these defects are usually caused by particle contamination and are divided into bridging defects, which join adjacent wires and cuts, which result in broken wires. Functional yield is therefore determined by the geometry of the routing channels, how these channels are filled with wire and the distribution of defect sizes. Since the wire spacing and width are usually fixed and the distribution of defects within a mature production facility is well known, the problem reduces to estimating individual wire lengths for cuts and to estimating the overlapping distance that two wires share in neighboring sections of the routing grid for bridges. Previous work in this area has analyzed the problem by assuming that all wiring tracks are occupied with wire, leading to overestimates for the probability of failure due to both cuts and bridges. This paper utilizes statistical models of the placement/routing process to provide a more realistic approach for cut and bridge yield estimation. A comparison of the predicted probability of failure within each wiring layer with postlayout data indicate an average error of 20% for cuts and 26% for bridges
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