Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Discovering New Vulnerabilities in Computer Systems

Vulnerability research plays a key role in preventing and defending against malicious computer system exploitations. Driven by a multi-billion dollar underground economy, cyber criminals today tirelessly launch malicious exploitations, threatening every aspect of daily computing. to effectively protect computer systems from devastation, it is imperative to discover and mitigate vulnerabilities before they fall into the offensive parties\u27 hands. This dissertation is dedicated to the research and discovery of new design and deployment vulnerabilities in three very different types of computer systems.;The first vulnerability is found in the automatic malicious binary (malware) detection system. Binary analysis, a central piece of technology for malware detection, are divided into two classes, static analysis and dynamic analysis. State-of-the-art detection systems employ both classes of analyses to complement each other\u27s strengths and weaknesses for improved detection results. However, we found that the commonly seen design patterns may suffer from evasion attacks. We demonstrate attacks on the vulnerabilities by designing and implementing a novel binary obfuscation technique.;The second vulnerability is located in the design of server system power management. Technological advancements have improved server system power efficiency and facilitated energy proportional computing. However, the change of power profile makes the power consumption subjected to unaudited influences of remote parties, leaving the server systems vulnerable to energy-targeted malicious exploit. We demonstrate an energy abusing attack on a standalone open Web server, measure the extent of the damage, and present a preliminary defense strategy.;The third vulnerability is discovered in the application of server virtualization technologies. Server virtualization greatly benefits today\u27s data centers and brings pervasive cloud computing a step closer to the general public. However, the practice of physical co-hosting virtual machines with different security privileges risks introducing covert channels that seriously threaten the information security in the cloud. We study the construction of high-bandwidth covert channels via the memory sub-system, and show a practical exploit of cross-virtual-machine covert channels on virtualized x86 platforms

Automatic Application-Specific Customization of Softcore Processor Microarchitecture, Masters Thesis, May 2006

Applications for constrained embedded systems are subject to strict runtime and resource utilization bounds. With soft core processors, application developers can customize the processor for their application, constrained by available hardware resources but aimed at high application performance. The more reconfigurable the processor is, the more options the application developers will have for customization and hence increased potential for improving application performance. However, such customization entails developing in-depth familiarity with all the parameters, in order to configure them effectively. This is typically infeasible, given the tight time-to-market pressure on the developers. Alternatively, developers could explore all possible configurations, but being exponential, this is infeasible even given only tens of parameters. This thesis presents an approach based on an assumption of parameter independence, for automatic microarchitecture customization. This approach is linear with the number of parameter values and hence, feasible and scalable. For the dimensions that we customize, namely application runtime and hardware resources, we formulate their costs as a constrained binary integer nonlinear optimization program. Though the results are not guaranteed to be optimal, we find they are near-optimal in practice. Our technique itself is general and can be applied to other design-space exploration problems

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Hardware and Software Optimizations for Accelerating Deep Neural Networks: Survey of Current Trends, Challenges, and the Road Ahead

Currently, Machine Learning (ML) is becoming ubiquitous in everyday life. Deep Learning (DL) is already present in many applications ranging from computer vision for medicine to autonomous driving of modern cars as well as other sectors in security, healthcare, and finance. However, to achieve impressive performance, these algorithms employ very deep networks, requiring a significant computational power, both during the training and inference time. A single inference of a DL model may require billions of multiply-and-accumulated operations, making the DL extremely compute-and energy-hungry. In a scenario where several sophisticated algorithms need to be executed with limited energy and low latency, the need for cost-effective hardware platforms capable of implementing energy-efficient DL execution arises. This paper first introduces the key properties of two brain-inspired models like Deep Neural Network (DNN), and Spiking Neural Network (SNN), and then analyzes techniques to produce efficient and high-performance designs. This work summarizes and compares the works for four leading platforms for the execution of algorithms such as CPU, GPU, FPGA and ASIC describing the main solutions of the state-of-the-art, giving much prominence to the last two solutions since they offer greater design flexibility and bear the potential of high energy-efficiency, especially for the inference process. In addition to hardware solutions, this paper discusses some of the important security issues that these DNN and SNN models may have during their execution, and offers a comprehensive section on benchmarking, explaining how to assess the quality of different networks and hardware systems designed for them

Towards Computational Efficiency of Next Generation Multimedia Systems

To address throughput demands of complex applications (like Multimedia), a next-generation system designer needs to co-design and co-optimize the hardware and software layers. Hardware/software knobs must be tuned in synergy to increase the throughput efficiency. This thesis provides such algorithmic and architectural solutions, while considering the new technology challenges (power-cap and memory aging). The goal is to maximize the throughput efficiency, under timing- and hardware-constraints

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu