High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

Design Methodologies and Architecture Solutions for High-Performance Interconnects

ABSTRACT In Deep Sub-Micron (DSM) technologies, interconnects play a crucial role in the correct functionality and largely impact the performance of complex System-on-Chip (SoC) designs. For technologies of 0.25µm and below, wiring capacitance dominates gate capacitance, thus rapidly increasing the interconnect-induced delay. Moreover, the coupling capacitance becomes a significant portion of the on-chip total wiring capacitance, and coupling between adjacent wires cannot be considered as a second-order effect any longer. As a consequence, the traditional top-down design methodology is ineffective, since the actual wiring delays can be computed only after layout parasitic extraction, when the physical design is completed. Fixing all the timing violations often requires several time-consuming iterations of logical and physical design, and it is essentially a trial-and-error approach. Increasingly tighter time-to-market requirements dictate that interconnect parasitics must be taken into account during all phases of the design flow, at different level of abstractions. However, given the aggressive technology scaling trends and the growing design complexity, this approach will only temporarily ameliorate the interconnect problem. We believe that in order to achieve gigascale designs in the nanometer regime, a novel design paradigm, based on new forms of regularity and newly created IP (Intellectual Property) blocks must be developed, to provide a direct path from system-level architectural exploration to physical implementation

Design methodology and productivity improvement in high speed VLSI circuits

2017 Spring.Includes bibliographical references.To view the abstract, please see the full text of the document

Wire management for coherence traffic in chip multiprocessors

Journal ArticleImprovements in semiconductor technology have made it possible to include multiple processor cores on a single die. Chip Multi-Processors (CMP) are an attractive choice for future billion transistor architectures due to their low design complexity, high clock frequency, and high throughput. In a typical CMP architecture, the L2 cache is shared by multiple cores and data coherence is maintained among private L1s. Coherence operations entail frequent communication over global on-chip wires. In future technologies, communication between different L1s will have a significant impact on overall processor performance and power consumption. On-chip wires can be designed to have different latency, bandwidth, and energy properties. Likewise, coherence protocol messages have different latency and bandwidth needs. We propose an interconnect comprised of wires with varying latency, bandwidth, and energy characteristics, and advocate intelligently mapping coherence operations to the appropriate wires. In this paper, we present a comprehensive list of techniques that allow coherence protocols to exploit a heterogeneous interconnect and present preliminary data that indicates the potential of these techniques to significantly improve performance and reduce power consumption. We further demonstrate that most of these techniques can be implemented at a minimum complexity overhead

Advanced information processing system for advanced launch system: Hardware technology survey and projections

The major goals of this effort are as follows: (1) to examine technology insertion options to optimize Advanced Information Processing System (AIPS) performance in the Advanced Launch System (ALS) environment; (2) to examine the AIPS concepts to ensure that valuable new technologies are not excluded from the AIPS/ALS implementations; (3) to examine advanced microprocessors applicable to AIPS/ALS, (4) to examine radiation hardening technologies applicable to AIPS/ALS; (5) to reach conclusions on AIPS hardware building blocks implementation technologies; and (6) reach conclusions on appropriate architectural improvements. The hardware building blocks are the Fault-Tolerant Processor, the Input/Output Sequencers (IOS), and the Intercomputer Interface Sequencers (ICIS)

ポータビリティを意識したCMOSミックスドシグナルVLSI回路設計手法に関する研究

本研究は、半導体上に集積されたアナログ・ディジタル・メモリ回路から構成されるミクストシグナルシステムを別の製造プロセスへ移行することをポーティングとして定義し、効率的なポーティングを行うための設計方式と自動回路合成アルゴリズムを提案し、いくつかの典型的な回路に対する設計事例を示し、提案手法の妥当性を立証している。北九州市立大

Reconfigurable nanoelectronics using graphene based spintronic logic gates

This paper presents a novel design concept for spintronic nanoelectronics that emphasizes a seamless integration of spin-based memory and logic circuits. The building blocks are magneto-logic gates based on a hybrid graphene/ferromagnet material system. We use network search engines as a technology demonstration vehicle and present a spin-based circuit design with smaller area, faster speed, and lower energy consumption than the state-of-the-art CMOS counterparts. This design can also be applied in applications such as data compression, coding and image recognition. In the proposed scheme, over 100 spin-based logic operations are carried out before any need for a spin-charge conversion. Consequently, supporting CMOS electronics requires little power consumption. The spintronic-CMOS integrated system can be implemented on a single 3-D chip. These nonvolatile logic circuits hold potential for a paradigm shift in computing applications.Comment: 14 pages (single column), 6 figure

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast