Chapter One – An Overview of Architecture-Level Power- and Energy-Efficient Design Techniques

Power dissipation and energy consumption became the primary design constraint for almost all computer systems in the last 15 years. Both computer architects and circuit designers intent to reduce power and energy (without a performance degradation) at all design levels, as it is currently the main obstacle to continue with further scaling according to Moore's law. The aim of this survey is to provide a comprehensive overview of power- and energy-efficient “state-of-the-art” techniques. We classify techniques by component where they apply to, which is the most natural way from a designer point of view. We further divide the techniques by the component of power/energy they optimize (static or dynamic), covering in that way complete low-power design flow at the architectural level. At the end, we conclude that only a holistic approach that assumes optimizations at all design levels can lead to significant savings.Peer ReviewedPostprint (published version

A Construction Kit for Efficient Low Power Neural Network Accelerator Designs

Implementing embedded neural network processing at the edge requires efficient hardware acceleration that couples high computational performance with low power consumption. Driven by the rapid evolution of network architectures and their algorithmic features, accelerator designs are constantly updated and improved. To evaluate and compare hardware design choices, designers can refer to a myriad of accelerator implementations in the literature. Surveys provide an overview of these works but are often limited to system-level and benchmark-specific performance metrics, making it difficult to quantitatively compare the individual effect of each utilized optimization technique. This complicates the evaluation of optimizations for new accelerator designs, slowing-down the research progress. This work provides a survey of neural network accelerator optimization approaches that have been used in recent works and reports their individual effects on edge processing performance. It presents the list of optimizations and their quantitative effects as a construction kit, allowing to assess the design choices for each building block separately. Reported optimizations range from up to 10'000x memory savings to 33x energy reductions, providing chip designers an overview of design choices for implementing efficient low power neural network accelerators

Energy-Aware Compilation and Hardware Design for VLIW Embedded Systems

Tomorrow's embedded devices need to run multimedia applications demanding high computational power with low energy consumption constraints. In this context, the register file is a key source of power consumption and its inappropriate design and management severely affects system power. In this paper, we present a new approach to reduce the energy of shared register files in forthcoming embedded VLIW processors running real-life applications up to 60% without performance penalty. This approach relies on limited hardware extensions and a compiler-based energy-aware register assignment algorithm to deactivate at run-time parts of the register file (i.e., sub-banks) in an independent way

Joint Hardware-Software Leakage Minimization Approach for the Register File of VLIW Embedded Architectures

New applications demand very high processing power when run on embedded systems. Very Long Instruction Word (VLIW) architectures have emerged as a promising alternative to provide such processing capabilities under the given energy budget. However, in this new VLIW-based architectures, the register file is a very critical contributor to the overall power consumption and new approaches have to be proposed to reduce its power while preserving system performance. In this paper, we propose a novel joint hardware–software approach that reduces the leakage energy in the register files of these embedded VLIW architectures. This approach relies upon an energy-aware register assignment method and a hardware support that creates sub-banks in the global register file that can be switched on/off at run time. Our results indicate energy savings in the register file, after considering the overhead of the added extra hardware, up to 50% for modern multimedia embedded applications without performance degradation. We illustrate this approach using real-life applications running on these processors. We also illustrate the tradeoff between the area overhead vs. the gains in the leakage energy for the different strategies

A Survey on Low-Power Techniques with Emerging Technologies: From Devices to Systems

Nowadays, power consumption is one of the main limitations of electronic systems. In this context, novel and emerging devices provide us with new opportunities to keep the trend to low-power design. In this survey paper, we present a transversal survey on energy efficient techniques ranging from devices to architectures. The actual trends of device research, with fully-depleted planar devices, tri-gate geometries and gate-all-around structures, allows us to reach an increasingly higher level of performance while reducing the associated power. In addition, beyond the simple device properties enhancements, emerging devices also lead to innovations at circuit and architectural levels. In particular, devices whose properties can be tuned through additional terminals enable a fine and dynamic control of device threshold. They also enable designers to realize logic gates and to implement power-related techniques in a compact way unreachable to standard technologies. These innovations reduce the power consumption at the gate level and unlock new means of actuation in architectural solutions like adaptive voltage and frequency scaling

Power Management for Deep Submicron Microprocessors

As VLSI technology scales, the enhanced performance of smaller transistors comes at the expense of increased power consumption. In addition to the dynamic power consumed by the circuits there is a tremendous increase in the leakage power consumption which is further exacerbated by the increasing operating temperatures. The total power consumption of modern processors is distributed between the processor core, memory and interconnects. In this research two novel power management techniques are presented targeting the functional units and the global interconnects. First, since most leakage control schemes for processor functional units are based on circuit level techniques, such schemes inherently lack information about the operational profile of higher-level components of the system. This is a barrier to the pivotal task of predicting standby time. Without this prediction, it is extremely difficult to assess the value of any leakage control scheme. Consequently, a methodology that can predict the standby time is highly beneficial in bridging the gap between the information available at the application level and the circuit implementations. In this work, a novel Dynamic Sleep Signal Generator (DSSG) is presented. It utilizes the usage traces extracted from cycle accurate simulations of benchmark programs to predict the long standby periods associated with the various functional units. The DSSG bases its decisions on the current and previous standby state of the functional units to accurately predict the length of the next standby period. The DSSG presents an alternative to Static Sleep Signal Generation (SSSG) based on static counters that trigger the generation of the sleep signal when the functional units idle for a prespecified number of cycles. The test results of the DSSG are obtained by the use of a modified RISC superscalar processor, implemented by SimpleScalar, the most widely accepted open source vehicle for architectural analysis. In addition, the results are further verified by a Simultaneous Multithreading simulator implemented by SMTSIM. Leakage saving results shows an increase of up to 146% in leakage savings using the DSSG versus the SSSG, with an accuracy of 60-80% for predicting long standby periods. Second, chip designers in their effort to achieve timing closure, have focused on achieving the lowest possible interconnect delay through buffer insertion and routing techniques. This approach, though, taxes the power budget of modern ICs, especially those intended for wireless applications. Also, in order to achieve more functionality, die sizes are constantly increasing. This trend is leading to an increase in the average global interconnect length which, in turn, requires more buffers to achieve timing closure. Unconstrained buffering is bound to adversely affect the overall chip performance, if the power consumption is added as a major performance metric. In fact, the number of global interconnect buffers is expected to reach hundreds of thousands to achieve an appropriate timing closure. To mitigate the impact of the power consumed by the interconnect buffers, a power-efficient multi-pin routing technique is proposed in this research. The problem is based on a graph representation of the routing possibilities, including buffer insertion and identifying the least power path between the interconnect source and set of sinks. The novel multi-pin routing technique is tested by applying it to the ISPD and IBM benchmarks to verify the accuracy, complexity, and solution quality. Results obtained indicate that an average power savings as high as 32% for the 130-nm technology is achieved with no impact on the maximum chip frequency

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

FDSOI Design using Automated Standard-Cell-Grained Body Biasing

With the introduction of FDSOI processes at competitive technology nodes, body biasing on an unprecedented scale was made possible. Body biasing influences one of the central transistor characteristics, the threshold voltage. By being able to heighten or lower threshold voltage by more than 100mV, the very physics of transistor switching can be manipulated at run time. Furthermore, as body biasing does not lead to different signal levels, it can be applied much more fine-grained than, e.g., DVFS. With the state of the art mainly focused on combinations of body biasing with DVFS, it has thus ignored granularities unfeasible for DVFS. This thesis fills this gap by proposing body bias domain partitioning techniques and for body bias domain partitionings thereby generated, algorithms that search for body bias assignments. Several different granularities ranging from entire cores to small groups of standard cells were examined using two principal approaches: Designer aided pre-partitioning based determination of body bias domains and a first-time, fully automatized, netlist based approach called domain candidate exploration. Both approaches operate along the lines of activation and timing of standard cell groups. These approaches were evaluated using the example of a Dynamically Reconfigurable Processor (DRP), a highly efficient category of reconfigurable architectures which consists of an array of processing elements and thus offers many opportunities for generalization towards many-core architectures. Finally, the proposed methods were validated by manufacturing a test-chip. Extensive simulation runs as well as the test-chip evaluation showed the validity of the proposed methods and indicated substantial improvements in energy efficiency compared to the state of the art. These improvements were accomplished by the fine-grained partitioning of the DRP design. This method allowed reducing dynamic power through supply voltage levels yielding higher clock frequencies using forward body biasing, while simultaneously reducing static power consumption in unused parts.Die Einführung von FDSOI Prozessen in gegenwärtigen Prozessgrößen ermöglichte die Nutzung von Substratvorspannung in nie zuvor dagewesenem Umfang. Substratvorspannung beeinflusst unter anderem eine zentrale Eigenschaft von Transistoren, die Schwellspannung. Mittels Substratvorspannung kann diese um mehr als 100mV erhöht oder gesenkt werden, was es ermöglicht, die schiere Physik des Schaltvorgangs zu manipulieren. Da weiterhin hiervon der Signalpegel der digitalen Signale unberührt bleibt, kann diese Technik auch in feineren Granularitäten angewendet werden, als z.B. Dynamische Spannungs- und Frequenz Anpassung (Engl. Dynamic Voltage and Frequency Scaling, Abk. DVFS). Da jedoch der Stand der Technik Substratvorspannung hauptsächlich in Kombinationen mit DVFS anwendet, werden feinere Granularitäten, welche für DVFS nicht mehr wirtschaftlich realisierbar sind, nicht berücksichtigt. Die vorliegende Arbeit schließt diese Lücke, indem sie Partitionierungsalgorithmen zur Unterteilung eines Entwurfs in Substratvorspannungsdomänen vorschlägt und für diese hierdurch unterteilten Domänen entsprechende Substratvorspannungen berechnet. Hierzu wurden verschiedene Granularitäten berücksichtigt, von ganzen Prozessorkernen bis hin zu kleinen Gruppen von Standardzellen. Diese Entwürfe wurden dann mit zwei verschiedenen Herangehensweisen unterteilt: Chipdesigner unterstützte, vorpartitionierungsbasierte Bestimmung von Substratvorspannungsdomänen, sowie ein erstmals vollautomatisierter, Netzlisten basierter Ansatz, in dieser Arbeit Domänen Kandidaten Exploration genannt. Beide Ansätze funktionieren nach dem Prinzip der Aktivierung, d.h. zu welchem Zeitpunkt welcher Teil des Entwurfs aktiv ist, sowie der Signallaufzeit durch die entsprechenden Entwurfsteile. Diese Ansätze wurden anhand des Beispiels Dynamisch Rekonfigurierbarer Prozessoren (DRP) evaluiert. DRPs stellen eine Klasse hocheffizienter rekonfigurierbarer Architekturen dar, welche hauptsächlich aus einem Feld von Rechenelementen besteht und dadurch auch zahlreiche Möglichkeiten zur Verallgemeinerung hinsichtlich Many-Core Architekturen zulässt. Schließlich wurden die vorgeschlagenen Methoden in einem Testchip validiert. Alle ermittelten Ergebnisse zeigen im Vergleich zum Stand der Technik drastische Verbesserungen der Energieeffizienz, welche durch die feingranulare Unterteilung in Substratvorspannungsdomänen erzielt wurde. Hierdurch konnten durch die Anwendung von Substratvorspannung höhere Taktfrequenzen bei gleicher Versorgungsspannung erzielt werden, während zeitgleich in zeitlich unkritischen oder ungenutzten Entwurfsteilen die statische Leistungsaufnahme minimiert wurde

Power and Energy Aware Heterogeneous Computing Platform

During the last decade, wireless technologies have experienced significant development, most notably in the form of mobile cellular radio evolution from GSM to UMTS/HSPA and thereon to Long-Term Evolution (LTE) for increasing the capacity and speed of wireless data networks. Considering the real-time constraints of the new wireless standards and their demands for parallel processing, reconfigurable architectures and in particular, multicore platforms are part of the most successful platforms due to providing high computational parallelism and throughput. In addition to that, by moving toward Internet-of-Things (IoT), the number of wireless sensors and IP-based high throughput network routers is growing at a rapid pace. Despite all the progression in IoT, due to power and energy consumption, a single chip platform for providing multiple communication standards and a large processing bandwidth is still missing.The strong demand for performing different sets of operations by the embedded systems and increasing the computational performance has led to the use of heterogeneous multicore architectures with the help of accelerators for computationally-intensive data-parallel tasks acting as coprocessors. Currently, highly heterogeneous systems are the most power-area efficient solution for performing complex signal processing systems. Additionally, the importance of IoT has increased significantly the need for heterogeneous and reconfigurable platforms.On the other hand, subsequent to the breakdown of the Dennardian scaling and due to the enormous heat dissipation, the performance of a single chip was obstructed by the utilization wall since all cores cannot be clocked at their maximum operating frequency. Therefore, a thermal melt-down might be happened as a result of high instantaneous power dissipation. In this context, a large fraction of the chip, which is switched-off (Dark) or operated at a very low frequency (Dim) is called Dark Silicon. The Dark Silicon issue is a constraint for the performance of computers, especially when the up-coming IoT scenario will demand a very high performance level with high energy efficiency. Among the suggested solution to combat the problem of Dark-Silicon, the use of application-specific accelerators and in particular Coarse-Grained Reconfigurable Arrays (CGRAs) are the main motivation of this thesis work.This thesis deals with design and implementation of Software Defined Radio (SDR) as well as High Efficiency Video Coding (HEVC) application-specific accelerators for computationally intensive kernels and data-parallel tasks. One of the most important data transmission schemes in SDR due to its ability of providing high data rates is Orthogonal Frequency Division Multiplexing (OFDM). This research work focuses on the evaluation of Heterogeneous Accelerator-Rich Platform (HARP) by implementing OFDM receiver blocks as designs for proof-of-concept. The HARP template allows the designer to instantiate a heterogeneous reconfigurable platform with a very large amount of custom-tailored computational resources while delivering a high performance in terms of many high-level metrics. The availability of this platform lays an excellent foundation to investigate techniques and methods to replace the Dark or Dim part of chip with high-performance silicon dissipating very low power and energy. Furthermore, this research work is also addressing the power and energy issues of the embedded computing systems by tailoring the HARP for self-aware and energy-aware computing models. In this context, the instantaneous power dissipation and therefore the heat dissipation of HARP are mitigated on FPGA/ASIC by using Dynamic Voltage and Frequency Scaling (DVFS) to minimize the dark/dim part of the chip. Upgraded HARP for self-aware and energy-aware computing can be utilized as an energy-efficient general-purpose transceiver platform that is cognitive to many radio standards and can provide high throughput while consuming as little energy as possible. The evaluation of HARP has shown promising results, which makes it a suitable platform for avoiding Dark Silicon in embedded computing platforms and also for diverse needs of IoT communications.In this thesis, the author designed the blocks of OFDM receiver by crafting templatebased CGRA devices and then attached them to HARP’s Network-on-Chip (NoC) nodes. The performance of application-specific accelerators generated from templatebased CGRAs, the performance of the entire platform subsequent to integrating the CGRA nodes on HARP and the NoC traffic are recorded in terms of several highlevel performance metrics. In evaluating HARP on FPGA prototype, it delivers a performance of 0.012 GOPS/mW. Because of the scalability and regularity in HARP, the author considered its value as architectural constant. In addition to showing the gain and the benefits of maximizing the number of reconfigurable processing resources on a platform in comparison to the scaled performance of several state-of-the-art platforms, HARP’s architectural constant ensures application-independent figure of merit. HARP is further evaluated by implementing various sizes of Discrete Cosine transform (DCT) and Discrete Sine Transform (DST) dedicated for HEVC standard, which showed its ability to sustain Full HD 1080p format at 30 fps on FPGA. The author also integrated self-aware computing model in HARP to mitigate the power dissipation of an OFDM receiver. In the case of FPGA implementation, the total power dissipation of the platform showed 16.8% reduction due to employing the Feedback Control System (FCS) technique with Dynamic Frequency Scaling (DFS). Furthermore, by moving to ASIC technology and scaling both frequency and voltage simultaneously, significant dynamic power reduction (up to 82.98%) was achieved, which proved the DFS/DVFS techniques as one step forward to mitigate the Dark Silicon issue