36,214 research outputs found

    Survey on wireless technology trade-offs for the industrial internet of things

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    Aside from vast deployment cost reduction, Industrial Wireless Sensor and Actuator Networks (IWSAN) introduce a new level of industrial connectivity. Wireless connection of sensors and actuators in industrial environments not only enables wireless monitoring and actuation, it also enables coordination of production stages, connecting mobile robots and autonomous transport vehicles, as well as localization and tracking of assets. All these opportunities already inspired the development of many wireless technologies in an effort to fully enable Industry 4.0. However, different technologies significantly differ in performance and capabilities, none being capable of supporting all industrial use cases. When designing a network solution, one must be aware of the capabilities and the trade-offs that prospective technologies have. This paper evaluates the technologies potentially suitable for IWSAN solutions covering an entire industrial site with limited infrastructure cost and discusses their trade-offs in an effort to provide information for choosing the most suitable technology for the use case of interest. The comparative discussion presented in this paper aims to enable engineers to choose the most suitable wireless technology for their specific IWSAN deployment

    Nature-Inspired Interconnects for Self-Assembled Large-Scale Network-on-Chip Designs

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    Future nano-scale electronics built up from an Avogadro number of components needs efficient, highly scalable, and robust means of communication in order to be competitive with traditional silicon approaches. In recent years, the Networks-on-Chip (NoC) paradigm emerged as a promising solution to interconnect challenges in silicon-based electronics. Current NoC architectures are either highly regular or fully customized, both of which represent implausible assumptions for emerging bottom-up self-assembled molecular electronics that are generally assumed to have a high degree of irregularity and imperfection. Here, we pragmatically and experimentally investigate important design trade-offs and properties of an irregular, abstract, yet physically plausible 3D small-world interconnect fabric that is inspired by modern network-on-chip paradigms. We vary the framework's key parameters, such as the connectivity, the number of switch nodes, the distribution of long- versus short-range connections, and measure the network's relevant communication characteristics. We further explore the robustness against link failures and the ability and efficiency to solve a simple toy problem, the synchronization task. The results confirm that (1) computation in irregular assemblies is a promising and disruptive computing paradigm for self-assembled nano-scale electronics and (2) that 3D small-world interconnect fabrics with a power-law decaying distribution of shortcut lengths are physically plausible and have major advantages over local 2D and 3D regular topologies

    Dynamic Knobs for Responsive Power-Aware Computing

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    We present PowerDial, a system for dynamically adapting application behavior to execute successfully in the face of load and power fluctuations. PowerDial transforms static configuration parameters into dynamic knobs that the PowerDial control system can manipulate to dynamically trade off the accuracy of the computation in return for reductions in the computational resources that the application requires to produce its results. These reductions translate directly into performance improvements and power savings. Our experimental results show that PowerDial can enable our benchmark applications to execute responsively in the face of power caps that would otherwise significantly impair responsiveness. They also show that PowerDial can significantly reduce the number of machines required to service intermittent load spikes, enabling reductions in power and capital costs.National Science Foundation (U.S.). (Grant Number 0937060)United States. Defense Advanced Research Projects Agency (Grant number FA8750-06-2-0189
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