175 research outputs found
Analog/RF Circuit Design Techniques for Nanometerscale IC Technologies
CMOS evolution introduces several problems in analog design. Gate-leakage mismatch exceeds conventional matching tolerances requiring active cancellation techniques or alternative architectures. One strategy to deal with the use of lower supply voltages is to operate critical parts at higher supply voltages, by exploiting combinations of thin- and thick-oxide transistors. Alternatively, low voltage circuit techniques are successfully developed. In order to benefit from nanometer scale CMOS technology, more functionality is shifted to the digital domain, including parts of the RF circuits. At the same time, analog control for digital and digital control for analog emerges to deal with current and upcoming imperfections
A Fully-Integrated Reconfigurable Dual-Band Transceiver for Short Range Wireless Communications in 180 nm CMOS
© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.A fully-integrated reconfigurable dual-band (760-960 MHz and 2.4-2.5 GHz) transceiver (TRX) for short range wireless communications is presented. The TRX consists of two individually-optimized RF front-ends for each band and one shared power-scalable analog baseband. The sub-GHz receiver has achieved the maximum 75 dBc 3rd-order harmonic rejection ratio (HRR3) by inserting a Q-enhanced notch filtering RF amplifier (RFA). In 2.4 GHz band, a single-ended-to-differential RFA with gain/phase imbalance compensation is proposed in the receiver. A ΣΔ fractional-N PLL frequency synthesizer with two switchable Class-C VCOs is employed to provide the LOs. Moreover, the integrated multi-mode PAs achieve the output P1dB (OP1dB) of 16.3 dBm and 14.1 dBm with both 25% PAE for sub-GHz and 2.4 GHz bands, respectively. A power-control loop is proposed to detect the input signal PAPR in real-time and flexibly reconfigure the PA's operation modes to enhance the back-off efficiency. With this proposed technique, the PAE of the sub-GHz PA is improved by x3.24 and x1.41 at 9 dB and 3 dB back-off powers, respectively, and the PAE of the 2.4 GHz PA is improved by x2.17 at 6 dB back-off power. The presented transceiver has achieved comparable or even better performance in terms of noise figure, HRR, OP1dB and power efficiency compared with the state-of-the-art.Peer reviewe
A Sub-Picosecond Hybrid DLL for Large-Scale Phased Array Synchronization
A large-scale timing synchronization scheme for scalable phased arrays is presented. This approach utilizes a DLL co-designed with a subsequent 2.5GHz PLL. The DLL employs a low noise, fine/coarse delay tuning to reduce the in-band rms jitter to 323fs, an order of magnitude improvement over previous works at similar frequencies. The DLL was fabricated in a 65nm bulk CMOS process and was characterized from 27MHz to 270MHz. It consumes up to 3.3mW from a 1V power supply and has a small footprint of 0.036mm^2
A 0.68V 0.68mW 2.4GHz PLL for ultra-low power RF systems
A 2.4GHz PLL consuming 0.68mW has been implemented in 65nm LPCMOS for use in ultra-low power Bluetooth Low Energy (BLE) applications. VCO, charge pump and dynamic flip-flop design optimization allow low voltage operation at 0.68V, bringing down dynamic power. The integer-N PLL covers all BLE channels and has a phase noise of −110dBc/Hz at 1MHz offset. To extend operation to extremely low duty cycles, extensive power gating is applied to bring the leakage power down to 170pW.Shell Oil CompanyTexas Instruments Incorporate
CDM Robust & Low Noise ESD protection circuits
In spite of significant progress during last couple of decades, ESD still affects production yields, manufacturing costs, product quality, product reliability and profitability. The objective of an ESD protection circuit is to create a harmless shunting path for the static electricity before it damages the sensitive electronic circuits. As the devices are scaling
down, while ESD energy remains the same, VLSIs are becoming more vulnerable to ESD
stress. This higher susceptibility to ESD damage is due to thinner gate oxides and shallower junctions. Furthermore, higher operating frequency of the scaled technologies enforces lower
parasitic capacitance of the ESD protection circuits. Hence, increasing the robustness of the ESD protection circuits with minimum additional parasitic capacitance is the main challenge in state of the art CMOS processes. Furthermore with scaling, the integration of analog blocks such as ADC, PLL’s, DLL’s, oscillator etc. on digital chips has provided cheap system on chip (SOC) solutions. However, when analog and digital chip are combined into single mixed-signal chip, on-chip noise coupling from the digital to the analog circuitry through ESD protection circuits becomes a big concern. Thus, increasing supply noise isolation while ensuring the ESD protection robustness is also a big challenge. In this thesis, several ESD protection circuits and devices have been proposed to address the critical issues like increased leakage current, slower turn-on time of devices, increased
susceptibility to power supply isolation etc. The proposed ESD protection circuits/devices have been classified into two categories: Pad based ESD protection in which the ESD protection circuits are placed in the I/O pads, and Rail based ESD in which ESD protection circuit is placed between power supplies. In our research, both these aspects have been investigated. The Silicon Controlled Rectifier (SCR) based devices have been used for Pad ESD protection as they have highest ESD protection level per unit area. Two novel devices Darlington based SCR (DSCR) and NMOS Darlington based SCR (NMOS-DSCR) having faster turn-on time, lower first breakdown voltage and low capacitance have been proposed.
The transient clamps have been investigated and optimized for Rail based ESD protection. In this research, we have addressed the issue of leakage current in transient clamps. A methodology has been purposed to reduce the leakage current by more than
200,000 times without having major impact on the ESD performance. Also, the issue of noise
coupling from digital supply to analog supply through the ESD protection circuits has been addressed. A new transient clamp has been proposed to increase the power supply noise isolation. Finally, a new methodology of placement of analog circuit with respect to transient clamp has been proposed to further increase the power supply noise isolation
Quadrature Phase-Domain ADPLL with Integrated On-line Amplitude Locked Loop Calibration for 5G Multi-band Applications
5th generation wireless systems (5G) have expanded frequency band coverage with the low-band 5G and mid-band 5G frequencies spanning 600 MHz to 4 GHz spectrum. This dissertation focuses on a microelectronic implementation of CMOS 65 nm design of an All-Digital Phase Lock Loop (ADPLL), which is a critical component for advanced 5G wireless transceivers. The ADPLL is designed to operate in the frequency bands of 600MHz-930MHz, 2.4GHz-2.8GHz and 3.4GHz-4.2GHz. Unique ADPLL sub-components include: 1) Digital Phase Frequency Detector, 2) Digital Loop Filter, 3) Channel Bank Select Circuit, and 4) Digital Control Oscillator. Integrated with the ADPLL is a 90-degree active RC-CR phase shifter with on-line amplitude locked loop (ALL) calibration to facilitate enhanced image rejection while mitigating the effects of fabrication process variations and component mismatch. A unique high-sensitivity high-speed dynamic voltage comparator is included as a key component of the active phase shifter/ALL calibration subsystem. 65nm CMOS technology circuit designs are included for the ADPLL and active phase shifter with simulation performance assessments. Phase noise results for 1 MHz offset with carrier frequencies of 600MHz, 2.4GHz, and 3.8GHz are -130, -122, and -116 dBc/Hz, respectively. Monte Carlo simulations to account for process variations/component mismatch show that the active phase shifter with ALL calibration maintains accurate quadrature phase outputs when operating within the frequency bands 600MHz-930MHz, 2.4GHz-2.8GHz and 3.4GHz-4.2GHz
Design methodology for low-jitter differential clock recovery circuits in high performance ADCs
This paper presents a design methodology for the simultaneous optimization of jitter and power consumption in ultra-low jitter clock recovery circuits (<100fsrms) for high-performance ADCs. The key ideas of the design methodology are: a) a smart parameterization of transistor sizes to have smooth dependence of specifications on the design variables, b) based on this parameterization, carrying out a design space sub-sampling which allows capturing the whole circuit performance for reducing computation resources and time during optimization. The proposed methodology, which can easily incorporate process voltage and temperature (PVT) variations, has been used to perform a systematic design space exploration that provides sub-100fs jitter clock recovery circuits in two CMOS commercial processes at different technological nodes (1.8V 0.18μm and 1.2V 90nm). Post-layout simulation results for a case of study with typical jitter of 68fs for a 1.8V 80dB-SNDR 100Msps Pipeline ADC application are also shown as demonstrator.Gobierno de España TEC2015-68448-REuropean Space Agency 4000108445-13-NL-R
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Metamodeling-based Fast Optimization of Nanoscale Ams-socs
Modern consumer electronic systems are mostly based on analog and digital circuits and are designed as analog/mixed-signal systems on chip (AMS-SoCs). the integration of analog and digital circuits on the same die makes the system cost effective. in AMS-SoCs, analog and mixed-signal portions have not traditionally received much attention due to their complexity. As the fabrication technology advances, the simulation times for AMS-SoC circuits become more complex and take significant amounts of time. the time allocated for the circuit design and optimization creates a need to reduce the simulation time. the time constraints placed on designers are imposed by the ever-shortening time to market and non-recurrent cost of the chip. This dissertation proposes the use of a novel method, called metamodeling, and intelligent optimization algorithms to reduce the design time. Metamodel-based ultra-fast design flows are proposed and investigated. Metamodel creation is a one time process and relies on fast sampling through accurate parasitic-aware simulations. One of the targets of this dissertation is to minimize the sample size while retaining the accuracy of the model. in order to achieve this goal, different statistical sampling techniques are explored and applied to various AMS-SoC circuits. Also, different metamodel functions are explored for their accuracy and application to AMS-SoCs. Several different optimization algorithms are compared for global optimization accuracy and convergence. Three different AMS circuits, ring oscillator, inductor-capacitor voltage-controlled oscillator (LC-VCO) and phase locked loop (PLL) that are present in many AMS-SoC are used in this study for design flow application. Metamodels created in this dissertation provide accuracy with an error of less than 2% from the physical layout simulations. After optimal sampling investigation, metamodel functions and optimization algorithms are ranked in terms of speed and accuracy. Experimental results show that the proposed design flow provides roughly 5,000x speedup over conventional design flows. Thus, this dissertation greatly advances the state-of-the-art in mixed-signal design and will assist towards making consumer electronics cheaper and affordable
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