Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

A Smoothed P-Value Test When There is a Nuisance Parameter under the Alternative

We present a new test when there is a nuisance parameter under the alternative hypothesis. The test exploits the p-value occupation time [PVOT], the measure of the subset of a nuisance parameter on which a p-value test rejects the null hypothesis. Key contributions are: (i) An asymptotic critical value upper bound for our test is the significance level, making inference easy. Conversely, test statistic functionals need a bootstrap or simulation step which can still lead to size and power distortions, and bootstrapped or simulated critical values are not asymptotically valid under weak or non-identification. (ii) We only require the test statistic to have a known or bootstrappable limit distribution, hence we do not require root(n)-Gaussian asymptotics, and weak or non-identification is allowed. Finally, (iii) a test based on the sup-p-value may be conservative and in some cases have nearly trivial power, while the PVOT naturally controls for this by smoothing over the nuisance parameter space. We give examples and related controlled experiments concerning PVOT tests of: omitted nonlinearity; GARCH effects; and a one time structural break. Across cases, the PVOT test variously matches, dominates or strongly dominates standard tests based on the supremum p-value, or supremum or average test statistic (with wild bootstrapped p-value

On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity

Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on efficient implementations of classical SCA countermeasures. That is, SCAs tailored for up-and-coming 3D ICs have been overlooked so far. In this paper, we conduct such a novel study and focus on one of the most accessible and critical side channels: thermal leakage of activity and power patterns. We address the thermal leakage in 3D ICs early on during floorplanning, along with tailored extensions for power and thermal management. Our key idea is to carefully exploit the specifics of material and structural properties in 3D ICs, thereby decorrelating the thermal behaviour from underlying power and activity patterns. Most importantly, we discuss powerful SCAs and demonstrate how our open-source tool helps to mitigate them.Comment: Published in Proc. Design Automation Conference, 201

Side-channel based intrusion detection for industrial control systems

Industrial Control Systems are under increased scrutiny. Their security is historically sub-par, and although measures are being taken by the manufacturers to remedy this, the large installed base of legacy systems cannot easily be updated with state-of-the-art security measures. We propose a system that uses electromagnetic side-channel measurements to detect behavioural changes of the software running on industrial control systems. To demonstrate the feasibility of this method, we show it is possible to profile and distinguish between even small changes in programs on Siemens S7-317 PLCs, using methods from cryptographic side-channel analysis.Comment: 12 pages, 7 figures. For associated code, see https://polvanaubel.com/research/em-ics/code

Integrated phased array systems in silicon

Silicon offers a new set of possibilities and challenges for RF, microwave, and millimeter-wave applications. While the high cutoff frequencies of the SiGe heterojunction bipolar transistors and the ever-shrinking feature sizes of MOSFETs hold a lot of promise, new design techniques need to be devised to deal with the realities of these technologies, such as low breakdown voltages, lossy substrates, low-Q passives, long interconnect parasitics, and high-frequency coupling issues. As an example of complete system integration in silicon, this paper presents the first fully integrated 24-GHz eight-element phased array receiver in 0.18-μm silicon-germanium and the first fully integrated 24-GHz four-element phased array transmitter with integrated power amplifiers in 0.18-μm CMOS. The transmitter and receiver are capable of beam forming and can be used for communication, ranging, positioning, and sensing applications

Phased Array Systems in Silicon

Phased array systems, a special case of MIMO systems, take advantage of spatial directivity and array gain to increase spectral efficiency. Implementing a phased array system at high frequency in a commercial silicon process technology presents several challenges. This article focuses on the architectural and circuit-level trade-offs involved in the design of the first silicon-based fully integrated phased array system operating at 24 GHz. The details of some of the important circuit building blocks are also discussed. The measured results demonstrate the feasibility of using integrated phased arrays for wireless communication and vehicular radar applications at 24 GHz

Towards Realistic Threat Modeling: Attack Commodification, Irrelevant Vulnerabilities, and Unrealistic Assumptions

Current threat models typically consider all possible ways an attacker can penetrate a system and assign probabilities to each path according to some metric (e.g. time-to-compromise). In this paper we discuss how this view hinders the realness of both technical (e.g. attack graphs) and strategic (e.g. game theory) approaches of current threat modeling, and propose to steer away by looking more carefully at attack characteristics and attacker environment. We use a toy threat model for ICS attacks to show how a realistic view of attack instances can emerge from a simple analysis of attack phases and attacker limitations.Comment: Proceedings of the 2017 Workshop on Automated Decision Making for Active Cyber Defens