Exceptional Anti-Icing Performance of Self-Impregnating Slippery Surfaces

A heat exchange interface at subzero temperature in a water vapor environment, exhibits high probability of frost formation due to freezing condensation, a factor that markedly decreases the heat transfer efficacy due to the considerable thermal resistance of ice. Here we report a novel strategy to delay ice nucleation on these types of solid-water vapor interfaces. With a process-driven mechanism, a self-generated liquid intervening layer immiscible to water, is deposited on a textured superhydrophobic surface and acts as a barrier between the water vapor and the solid substrate. This liquid layer imparts remarkable slippery conditions resulting in high mobility of condensing water droplets. A large increase of the ensuing ice coverage time is shown compared to the cases of standard smooth hydrophilic or textured superhydrophobic surfaces. During deicing of these self-impregnating surfaces we show an impressive tendency of ice fragments to skate expediting defrosting. Robustness of such surfaces is also demonstrated by operating them under subcooling for at least 490hr without a marked degradation. This is attributed to the presence of the liquid intervening layer, which protects the substrate from hydrolyzation enhancing longevity and sustaining heat transfer efficiency.Comment: This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials & Interfaces, copyright (c) American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see pubs.acs.org/doi/abs/10.1021/acsami.7b0018

Index to 1984 NASA Tech Briefs, volume 9, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1984 Tech B Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Position Estimation of Robotic Mobile Nodes in Wireless Testbed using GENI

We present a low complexity experimental RF-based indoor localization system based on the collection and processing of WiFi RSSI signals and processing using a RSS-based multi-lateration algorithm to determine a robotic mobile node's location. We use a real indoor wireless testbed called w-iLab.t that is deployed in Zwijnaarde, Ghent, Belgium. One of the unique attributes of this testbed is that it provides tools and interfaces using Global Environment for Network Innovations (GENI) project to easily create reproducible wireless network experiments in a controlled environment. We provide a low complexity algorithm to estimate the location of the mobile robots in the indoor environment. In addition, we provide a comparison between some of our collected measurements with their corresponding location estimation and the actual robot location. The comparison shows an accuracy between 0.65 and 5 meters.Comment: (c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other work

Effective thermal conductivity of porous solder layers

Microscopic voids in the die attachment solder layers of power semiconductor devices degrade their overall thermal transfer performance. This paper presents analytical results of the effect of spherical and spheroidal void geometries on the thermal conductivity of bulk media. Analytical results are compared with axially symmetric and three-dimensional thermal simulations of single and multiple cavity defects in planar structures. The effective thermal conductivity of the die to the case attachment solder layer of two commercial metal oxide semiconductor field effect transistor (MOSFET) devices is estimated using these results, with cavity dimensions and distributions obtained by electron microscopy