Design methodology and productivity improvement in high speed VLSI circuits

2017 Spring.Includes bibliographical references.To view the abstract, please see the full text of the document

Manufacturability Aware Design.

The aim of this work is to provide solutions that optimize the tradeoffs among design, manufacturability, and cost of ownership posed by technology scaling and sub-wavelength lithography. These solutions may take the form of robust circuit designs, cost-effective resolution technologies, accurate modeling considering process variations, and design rules assessment. We first establish a framework for assessing the impact of process variation on circuit performance, product value and return on investment on alternative processes. Key features include comprehensive modeling and different handling on die-to-die and within-die variation, accurate models of correlations of variation, realistic and quantified projection to future process nodes, and performance sensitivity analysis to improved control of individual device parameter and variation sources. Then we describe a novel minimum cost of correction methodology which determines the level of correction of each layout feature such that the prescribed parametric yield is attained with minimum RET (Resolution Enhancement Technology) cost. This timing driven OPC (Optical Proximity Correction) insertion flow uses a mathematical programming based slack budgeting algorithm to determine OPC level for all polysilicon gate geometries. Designs adopting this methodology show up to 20% MEBES (Manufacturing Electron Beam Exposure System) data volume reduction and 39% OPC runtime improvement. When the systematic correction residual errors become unavoidable, we analyze their impact on a state-of-art microprocessor's speedpath skew. A platform is created for diagnosing and improving OPC quality on gates with specific functionality such as critical gates or matching transistors. Significant changes in full-chip timing analysis indicate the necessity of a post-OPC performance verification design flow. Finally, we quantify the performance, manufacturability and mask cost impact of globally applying several common restrictive design rules. Novel approaches such as locally adapting FDRs (flexible design rules) based on image parameters range, and DRC Plus (preferred design rule enforcement with 2D pattern matching) are also described.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/57676/2/jiey_1.pd

Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and Heterogeneous Multi-Chip 2.5D Systems

Chip and packaging industries are making significant progress in 2.5D design as a result of increasing popularity of their application. In advanced high-density 2.5D packages, package redistribution layers become similar to chip Back-End-of-Line routing layers, and the gap between them scales down with pin density improvement. Chiplet-package interactions become significant and severely affect system performance and reliability. Moreover, 2.5D integration offers opportunities to apply novel design techniques. The traditional die-by-die design approach neither carefully considers these interactions nor fully exploits the cross-boundary design opportunities. This thesis presents chiplet-package cross-boundary design, extraction, analysis, and optimization tool flows and methodologies for high-density 2.5D packaging technologies. A holistic flow is presented that can capture all parasitics from chiplets and the package and improve system performance through iterative optimizations. Several design techniques are demonstrated for agile development and quick turn-around time. To validate the flow in silicon, a chip was taped out and studied in TSMC 65nm technology. As the holistic flow cannot handle heterogeneous technologies, in-context flows are presented. Three different flavors of the in-context flow are presented, which offer trade-offs between scalability and accuracy in heterogeneous 2.5D system designs. Inductance is an inseparable part of a package design. A holistic flow is presented that takes package inductance into account in timing analysis and optimization steps. Custom CAD tools are developed to make these flows compatible with the industry standard tools and the foundry model. To prove the effectiveness of the flows several design cases of an ARM Cortex-M0 are implemented for comparitive study

The MEG detector for μ+→e+γ{\mu}+\to e+{\gamma} decay search

The MEG (Mu to Electron Gamma) experiment has been running at the Paul Scherrer Institut (PSI), Switzerland since 2008 to search for the decay \meg\ by using one of the most intense continuous $\mu^+$ beams in the world. This paper presents the MEG components: the positron spectrometer, including a thin target, a superconducting magnet, a set of drift chambers for measuring the muon decay vertex and the positron momentum, a timing counter for measuring the positron time, and a liquid xenon detector for measuring the photon energy, position and time. The trigger system, the read-out electronics and the data acquisition system are also presented in detail. The paper is completed with a description of the equipment and techniques developed for the calibration in time and energy and the simulation of the whole apparatus.Comment: 59 pages, 90 figure

CROSS-LAYER DESIGN, OPTIMIZATION AND PROTOTYPING OF NoCs FOR THE NEXT GENERATION OF HOMOGENEOUS MANY-CORE SYSTEMS

This thesis provides a whole set of design methods to enable and manage the runtime heterogeneity of features-rich industry-ready Tile-Based Networkon- Chips at different abstraction layers (Architecture Design, Network Assembling, Testing of NoC, Runtime Operation). The key idea is to maintain the functionalities of the original layers, and to improve the performance of architectures by allowing, joint optimization and layer coordinations. In general purpose systems, we address the microarchitectural challenges by codesigning and co-optimizing feature-rich architectures. In application-specific NoCs, we emphasize the event notification, so that the platform is continuously under control. At the network assembly level, this thesis proposes a Hold Time Robustness technique, to tackle the hold time issue in synchronous NoCs. At the network architectural level, the choice of a suitable synchronization paradigm requires a boost of synthesis flow as well as the coexistence with the DVFS. On one hand this implies the coexistence of mesochronous synchronizers in the network with dual-clock FIFOs at network boundaries. On the other hand, dual-clock FIFOs may be placed across inter-switch links hence removing the need for mesochronous synchronizers. This thesis will study the implications of the above approaches both on the design flow and on the performance and power quality metrics of the network. Once the manycore system is composed together, the issue of testing it arises. This thesis takes on this challenge and engineers various testing infrastructures. At the upper abstraction layer, the thesis addresses the issue of managing the fully operational system and proposes a congestion management technique named HACS. Moreover, some of the ideas of this thesis will undergo an FPGA prototyping. Finally, we provide some features for emerging technology by characterizing the power consumption of Optical NoC Interfaces