Coarse-grained reconfigurable array architectures

Coarse-Grained Reconfigurable Array (CGRA) architectures accelerate the same inner loops that benefit from the high ILP support in VLIW architectures. By executing non-loop code on other cores, however, CGRAs can focus on such loops to execute them more efficiently. This chapter discusses the basic principles of CGRAs, and the wide range of design options available to a CGRA designer, covering a large number of existing CGRA designs. The impact of different options on flexibility, performance, and power-efficiency is discussed, as well as the need for compiler support. The ADRES CGRA design template is studied in more detail as a use case to illustrate the need for design space exploration, for compiler support and for the manual fine-tuning of source code

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

VThreads: A novel VLIW chip multiprocessor with hardware-assisted PThreads

We discuss VThreads, a novel VLIW CMP with hardware-assisted shared-memory Thread support. VThreads supports Instruction Level Parallelism via static multiple-issue and Thread Level Parallelism via hardware-assisted POSIX Threads along with extensive customization. It allows the instantiation of tightlycoupled streaming accelerators and supports up to 7-address Multiple-Input, Multiple-Output instruction extensions. VThreads is designed in technology-independent Register-Transfer-Level VHDL and prototyped on 40 nm and 28 nm Field-Programmable gate arrays. It was evaluated against a PThreads-based multiprocessor based on the Sparc-V8 ISA. On a 65 nm ASIC implementation VThreads achieves up to x7.2 performance increase on synthetic benchmarks, x5 on a parallel Mandelbrot implementation, 66% better on a threaded JPEG implementation, 79% better on an edge-detection benchmark and ~13% improvement on DES compared to the Leon3MP CMP. In the range of 2 to 8 cores VThreads demonstrates a post-route (statistical) power reduction between 65% to 57% at an area increase of 1.2%-10% for 1-8 cores, compared to a similarly-configured Leon3MP CMP. This combination of micro-architectural features, scalability, extensibility, hardware support for low-latency PThreads, power efficiency and area make the processor an attractive proposition for low-power, deeply-embedded applications requiring minimum OS support

An OpenCL software compilation framework targeting an SoC-FPGA VLIW chip multiprocessor

Modern systems-on-chip augment their baseline CPU with coprocessors and accelerators to increase overall computational capability and power efficiency, and thus have evolved into heterogeneous multi-core systems. Several languages have been developed to enable this paradigm shift, including CUDA and OpenCL. This paper discusses a unified compilation environment to enable heterogeneous system design through the use of OpenCL and a highly configurable VLIW Chip Multiprocessor architecture known as the LE1. An LLVM compilation framework was researched and a prototype developed to enable the execution of OpenCL applications on a number of hardware configurations of the LE1 CMP. The presented OpenCL framework fully automates the compilation flow and supports work-item coalescing which better maps onto the ILP processor cores of the LE1 architecture. This paper discusses in detail both the software stack and target hardware architecture and evaluates the scalability of the proposed framework by running 12 industry-standard OpenCL benchmarks drawn from the AMD SDK and the Rodinia suites. The benchmarks are executed on 40 LE1 configurations with 10 implemented on an SoC-FPGA and the remaining on a cycle-accurate simulator. Across 12 OpenCL benchmarks results demonstrate near-linear wall-clock performance improvement of 1.8x (using 2 dual-issue cores), up to 5.2x (using 8 dual-issue cores) and on one case, super-linear improvement of 8.4x (FixOffset kernel, 8 dual-issue cores). The number of OpenCL benchmarks evaluated makes this study one of the most complete in the literature

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout