Adaptive memory hierarchies for next generation tiled microarchitectures

Les últimes dècades el rendiment dels processadors i de les memòries ha millorat a diferent ritme, limitant el rendiment dels processadors i creant el conegut memory gap. Sol·lucionar aquesta diferència de rendiment és un camp d'investigació d'actualitat i que requereix de noves sol·lucions. Una sol·lució a aquest problema són les memòries “cache”, que permeten reduïr l'impacte d'unes latències de memòria creixents i que conformen la jerarquia de memòria. La majoria de d'organitzacions de les “caches” estan dissenyades per a uniprocessadors o multiprcessadors tradicionals. Avui en dia, però, el creixent nombre de transistors disponible per xip ha permès l'aparició de xips multiprocessador (CMPs). Aquests xips tenen diferents propietats i limitacions i per tant requereixen de jerarquies de memòria específiques per tal de gestionar eficientment els recursos disponibles. En aquesta tesi ens hem centrat en millorar el rendiment i la eficiència energètica de la jerarquia de memòria per CMPs, des de les “caches” fins als controladors de memòria. A la primera part d'aquesta tesi, s'han estudiat organitzacions tradicionals per les “caches” com les privades o compartides i s'ha pogut constatar que, tot i que funcionen bé per a algunes aplicacions, un sistema que s'ajustés dinàmicament seria més eficient. Tècniques com el Cooperative Caching (CC) combinen els avantatges de les dues tècniques però requereixen un mecanisme centralitzat de coherència que té un consum energètic molt elevat. És per això que en aquesta tesi es proposa el Distributed Cooperative Caching (DCC), un mecanisme que proporciona coherència en CMPs i aplica el concepte del cooperative caching de forma distribuïda. Mitjançant l'ús de directoris distribuïts s'obté una sol·lució més escalable i que, a més, disposa d'un mecanisme de marcatge més flexible i eficient energèticament. A la segona part, es demostra que les aplicacions fan diferents usos de la “cache” i que si es realitza una distribució de recursos eficient es poden aprofitar els que estan infrautilitzats. Es proposa l'Elastic Cooperative Caching (ElasticCC), una organització capaç de redistribuïr la memòria “cache” dinàmicament segons els requeriments de cada aplicació. Una de les contribucions més importants d'aquesta tècnica és que la reconfiguració es decideix completament a través del maquinari i que tots els mecanismes utilitzats es basen en estructures distribuïdes, permetent una millor escalabilitat. ElasticCC no només és capaç de reparticionar les “caches” segons els requeriments de cada aplicació, sinó que, a més a més, és capaç d'adaptar-se a les diferents fases d'execució de cada una d'elles. La nostra avaluació també demostra que la reconfiguració dinàmica de l'ElasticCC és tant eficient que gairebé proporciona la mateixa taxa de fallades que una configuració amb el doble de memòria.Finalment, la tesi es centra en l'estudi del comportament de les memòries DRAM i els seus controladors en els CMPs. Es demostra que, tot i que els controladors tradicionals funcionen eficientment per uniprocessadors, en CMPs els diferents patrons d'accés obliguen a repensar com estan dissenyats aquests sistemes. S'han presentat múltiples sol·lucions per CMPs però totes elles es veuen limitades per un compromís entre el rendiment global i l'equitat en l'assignació de recursos. En aquesta tesi es proposen els Thread Row Buffers (TRBs), una zona d'emmagatenament extra a les memòries DRAM que permetria guardar files de dades específiques per a cada aplicació. Aquest mecanisme permet proporcionar un accés equitatiu a la memòria sense perjudicar el seu rendiment global. En resum, en aquesta tesi es presenten noves organitzacions per la jerarquia de memòria dels CMPs centrades en la escalabilitat i adaptativitat als requeriments de les aplicacions. Els resultats presentats demostren que les tècniques proposades proporcionen un millor rendiment i eficiència energètica que les millors tècniques existents fins a l'actualitat.Processor performance and memory performance have improved at different rates during the last decades, limiting processor performance and creating the well known "memory gap". Solving this performance difference is an important research field and new solutions must be proposed in order to have better processors in the future. Several solutions exist, such as caches, that reduce the impact of longer memory accesses and conform the system memory hierarchy. However, most of the existing memory hierarchy organizations were designed for single processors or traditional multiprocessors. Nowadays, the increasing number of available transistors has allowed the apparition of chip multiprocessors, which have different constraints and require new ad-hoc memory systems able to efficiently manage memory resources. Therefore, in this thesis we have focused on improving the performance and energy efficiency of the memory hierarchy of chip multiprocessors, ranging from caches to DRAM memories. In the first part of this thesis we have studied traditional cache organizations such as shared or private caches and we have seen that they behave well only for some applications and that an adaptive system would be desirable. State-of-the-art techniques such as Cooperative Caching (CC) take advantage of the benefits of both worlds. This technique, however, requires the usage of a centralized coherence structure and has a high energy consumption. Therefore we propose the Distributed Cooperative Caching (DCC), a mechanism to provide coherence to chip multiprocessors and apply the concept of cooperative caching in a distributed way. Through the usage of distributed directories we obtain a more scalable solution and, in addition, has a more flexible and energy-efficient tag allocation method. We also show that applications make different uses of cache and that an efficient allocation can take advantage of unused resources. We propose Elastic Cooperative Caching (ElasticCC), an adaptive cache organization able to redistribute cache resources dynamically depending on application requirements. One of the most important contributions of this technique is that adaptivity is fully managed by hardware and that all repartitioning mechanisms are based on distributed structures, allowing a better scalability. ElasticCC not only is able to repartition cache sizes to application requirements, but also is able to dynamically adapt to the different execution phases of each thread. Our experimental evaluation also has shown that the cache partitioning provided by ElasticCC is efficient and is almost able to match the off-chip miss rate of a configuration that doubles the cache space. Finally, we focus in the behavior of DRAM memories and memory controllers in chip multiprocessors. Although traditional memory schedulers work well for uniprocessors, we show that new access patterns advocate for a redesign of some parts of DRAM memories. Several organizations exist for multiprocessor DRAM schedulers, however, all of them must trade-off between memory throughput and fairness. We propose Thread Row Buffers, an extended storage area in DRAM memories able to store a data row for each thread. This mechanism enables a fair memory access scheduling without hurting memory throughput. Overall, in this thesis we present new organizations for the memory hierarchy of chip multiprocessors which focus on the scalability and of the proposed structures and adaptivity to application behavior. Results show that the presented techniques provide a better performance and energy-efficiency than existing state-of-the-art solutions

Scale-Out Processors

Global-scale online services, such as Google’s Web search and Facebook’s social networking, run in large-scale datacenters. Due to their massive scale, these services are designed to scale out (or distribute) their respective loads and datasets across thousands of servers in datacenters. The growing demand for online services forced service providers to build networks of datacenters, which require an enormous capital outlay for infrastructure, hardware, and power consumption. Consequently, efficiency has become a major concern in the design and operation of such datacenters, with processor efficiency being of, utmost importance, due to the significant contribution of processors to the overall datacenter performance and cost. Scale-out workloads, which are behind today’s online services, serve independent requests, and have large instruction footprints and little data locality. As such, they benefit from processor designs that feature many cores and a modestly sized Last-Level Cache (LLC), a fast access path to the LLC, and high-bandwidth interfaces to memory. Existing server-class processors with large LLCs and a handful of aggressive out-of-order cores are inefficient in executing scale-out workloads. Moreover, the scaling trajectory for these processors leads to even lower efficiency in future technology nodes. This thesis presents a family of throughput-optimal processors, called Scale-Out Processors, for the efficient execution of scale-out workloads. A unique feature of Scale-Out Processors is that they consist of multiple stand-alone modules, called pods, wherein each module is a server running an operating system and a full software stack. To design a throughput-optimal processor, we developed a methodology based on performance density, defined as throughput per unit area, to quantify how effectively an architecture uses the silicon real estate. The proposed methodology derives a performance-density optimal processor building block (i.e., pod), which tightly couples a number of cores to a small LLC via a fast interconnect. Scale-Out Processors simply consist of multiple pods with no inter-pod connectivity or coherence. Moreover, they deliver the highest throughput in today’s technology and afford near-ideal scalability as process technology advances. We demonstrate that Scale-Out Processors improve datacenters’ efficiency by 4.4x-7.1x over datacenters designed using existing server-class processors

Memory Hierarchy Design for Next Generation Scalable Many-core Platforms

Performance and energy consumption in modern computing platforms is largely dominated by the memory hierarchy. The increasing computational power in the multiprocessors and accelerators, and the emergence of the data-intensive workloads (e.g. large-scale graph traversal and scientific algorithms) requiring fast transfer of large volumes of data, are two main trends which intensify this problem by putting even higher pressure on the memory hierarchy. This increasing gap between computation speed and data transfer speed is commonly referred as the “memory wall” problem. With the emergence of heterogeneous Three Dimensional (3D) Integration based on through-silicon-vias (TSV), this situation has started to recover in the past years. On one hand, it is now possible to improve memory access bandwidth and/or latency by either stacking memories directly on top of processors or through abstracted memory interfaces such as Micron’s Hybrid Memory Cube (HMC). On the other hand, near memory computation has become worthy of revisiting due to the cost-effective integration of logic and memory in 3D stacks. These two directions bring about several interesting opportunities including performance improvement, energy and cost reduction, product miniaturization, and modular design for improved time to market. In this research, we study the effectiveness of the 3D integration technology and the optimization opportunities which it can provide in the different layers of the memory hierarchy in cluster-based many-core platforms ranging from intra-cluster L1 to inter-cluster L2 scratchpad memories (SPMs), as well as the main memory. In addition, by moving a part of the computation to where data resides, in the 3D-stacked memory context, we demonstrate further energy and performance improvement opportunities

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems

Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal management continues to be an active research topic. Most thermal management research takes place using simulations, given the challenges of measuring temperature in real processors. Since core and memory are fabricated on separate packages in most existing processors, with the memory having lower power densities, thermal management research in processors has primarily focused on the cores. Memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology. 2.5D packaging places cores and memory on the same package. 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. Such packagings significantly increase the power density, making processors prone to heating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes an even more pressing problem. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors. To address this issue, we present CoMeT, the first integrated Core and Memory interval Thermal simulation toolchain. CoMeT comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory configurations - off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT adds only a ~5% simulation-time overhead. The source code of CoMeT has been made open for public use under the MIT license.Comment: https://github.com/marg-tools/CoMe

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Hardware Attacks and Mitigation Techniques

Today, electronic devices have been widely deployed in our daily lives, basic infrastructure such as financial and communication systems, and military systems. Over the past decade, there have been a growing number of threats against them, posing great danger on these systems. Hardware-based countermeasures offer a low-performance overhead for building secure systems. In this work, we investigate what hardware-based attacks are possible against modern computers and electronic devices. We then explore several design and verification techniques to enhance hardware security with primary focus on two areas: hardware Trojans and side-channel attacks. Hardware Trojans are malicious modifications to the original integrated circuits (ICs). Due to the trend of outsourcing designs to foundries overseas, the threat of hardware Trojans is increasing. Researchers have proposed numerous detection methods, which either take place at test-time or monitor the IC for unexpected behavior at run-time. Most of these methods require the possession of a Trojan-free IC, which is hard to obtain. In this work, we propose an innovative way to detect Trojans using reverse-engineering. Our method eliminates the need for a Trojan-free IC. In addition, it avoids the costly and error-prone steps in the reverse-engineering process and achieves significantly good detection accuracy. We also notice that in the current literature, very little effort has been made to design-time strategies that help to make test-time or run-time detection of Trojans easier. To address this issue, we develop techniques that can improve the sensitivity of designs to test-time detection approaches. Experiments show that using our method, we could detect a lot more Trojans with very small power/area overhead and no timing violations. Side-channel attack (SCA) is another form of hardware attack in which the adversary measures some side-channel information such as power, temperature, timing, etc. and deduces some critical information about the underlying system. We first investigate countermeasures for timing SCAs on cache. These attacks have been demonstrated to be able to successfully break many widely-used modern ciphers. Existing hardware countermeasures usually have heavy performance overhead. We innovatively apply 3D integration techniques to solve the problem. We investigate the implication of 3D integration on timing SCAs on cache and propose several countermeasures that utilize 3D integration techniques. Experimental results show that our countermeasures increase system security significantly while still achieving some performance gain over a 2D baseline system. We also investigate the security of Oblivious RAM (ORAM), which is a newly proposed hardware primitive to hide memory access patterns. We demonstrate both through simulations and on FPGA board that timing SCAs can break many ORAM protocols. Some general guidelines in secure ORAM implementations are also provided. We hope that our findings will motivate a new line of research in making ORAMs more secure

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems

Processing cores and the accompanying main memory working in tandem enable modern processors. Dissipating heat produced from computation remains a significant problem for processors. Therefore, the thermal management of processors continues to be an active subject of research. Most thermal management research is performed using simulations, given the challenges in measuring temperatures in real processors. Fast yet accurate interval thermal simulation toolchains remain the research tool of choice to study thermal management in processors at the system level. However, the existing toolchains focus on the thermal management of cores in the processors, since they exhibit much higher power densities than memory. The memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology: 2.5D packaging technology places cores and memory on the same package; 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. These new packagings significantly increase the power density of the processors, making them prone to overheating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes even more pressing. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors. To address this issue, we present the first integrated Core and Memory interval Thermal (CoMeT) simulation toolchain. CoMeT comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory (integration) configurations-off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. CoMeT adds only an additional similar to 5% simulation-time overhead compared to an equivalent state-of-the-art core-only toolchain. The source code of CoMeT has been made open for public use under the MIT license

A Modular Platform for Adaptive Heterogeneous Many-Core Architectures

Multi-/many-core heterogeneous architectures are shaping current and upcoming generations of compute-centric platforms which are widely used starting from mobile and wearable devices to high-performance cloud computing servers. Heterogeneous many-core architectures sought to achieve an order of magnitude higher energy efficiency as well as computing performance scaling by replacing homogeneous and power-hungry general-purpose processors with multiple heterogeneous compute units supporting multiple core types and domain-specific accelerators. Drifting from homogeneous architectures to complex heterogeneous systems is heavily adopted by chip designers and the silicon industry for more than a decade. Recent silicon chips are based on a heterogeneous SoC which combines a scalable number of heterogeneous processing units from different types (e.g. CPU, GPU, custom accelerator). This shifting in computing paradigm is associated with several system-level design challenges related to the integration and communication between a highly scalable number of heterogeneous compute units as well as SoC peripherals and storage units. Moreover, the increasing design complexities make the production of heterogeneous SoC chips a monopoly for only big market players due to the increasing development and design costs. Accordingly, recent initiatives towards agile hardware development open-source tools and microarchitecture aim to democratize silicon chip production for academic and commercial usage. Agile hardware development aims to reduce development costs by providing an ecosystem for open-source hardware microarchitectures and hardware design processes. Therefore, heterogeneous many-core development and customization will be relatively less complex and less time-consuming than conventional design process methods. In order to provide a modular and agile many-core development approach, this dissertation proposes a development platform for heterogeneous and self-adaptive many-core architectures consisting of a scalable number of heterogeneous tiles that maintain design regularity features while supporting heterogeneity. The proposed platform hides the integration complexities by supporting modular tile architectures for general-purpose processing cores supporting multi-instruction set architectures (multi-ISAs) and custom hardware accelerators. By leveraging field-programmable-gate-arrays (FPGAs), the self-adaptive feature of the many-core platform can be achieved by using dynamic and partial reconfiguration (DPR) techniques. This dissertation realizes the proposed modular and adaptive heterogeneous many-core platform through three main contributions. The first contribution proposes and realizes a many-core architecture for heterogeneous ISAs. It provides a modular and reusable tilebased architecture for several heterogeneous ISAs based on open-source RISC-V ISA. The modular tile-based architecture features a configurable number of processing cores with different RISC-V ISAs and different memory hierarchies. To increase the level of heterogeneity to support the integration of custom hardware accelerators, a novel hybrid memory/accelerator tile architecture is developed and realized as the second contribution. The hybrid tile is a modular and reusable tile that can be configured at run-time to operate as a scratchpad shared memory between compute tiles or as an accelerator tile hosting a local hardware accelerator logic. The hybrid tile is designed and implemented to be seamlessly integrated into the proposed tile-based platform. The third contribution deals with the self-adaptation features by providing a reconfiguration management approach to internally control the DPR process through processing cores (RISC-V based). The internal reconfiguration process relies on a novel DPR controller targeting FPGA design flow for RISC-V-based SoC to change the types and functionalities of compute tiles at run-time

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Memory Systems and Interconnects for Scale-Out Servers

The information revolution of the last decade has been fueled by the digitization of almost all human activities through a wide range of Internet services. The backbone of this information age are scale-out datacenters that need to collect, store, and process massive amounts of data. These datacenters distribute vast datasets across a large number of servers, typically into memory-resident shards so as to maintain strict quality-of-service guarantees. While data is driving the skyrocketing demands for scale-out servers, processor and memory manufacturers have reached fundamental efficiency limits, no longer able to increase server energy efficiency at a sufficient pace. As a result, energy has emerged as the main obstacle to the scalability of information technology (IT) with huge economic implications. Delivering sustainable IT calls for a paradigm shift in computer system design. As memory has taken a central role in IT infrastructure, memory-centric architectures are required to fully utilize the IT's costly memory investment. In response, processor architects are resorting to manycore architectures to leverage the abundant request-level parallelism found in data-centric applications. Manycore processors fully utilize available memory resources, thereby increasing IT efficiency by almost an order of magnitude. Because manycore server chips execute a large number of concurrent requests, they exhibit high incidence of accesses to the last-level-cache for fetching instructions (due to large instruction footprints), and off-chip memory (due to lack of temporal reuse in on-chip caches) for accessing dataset objects. As a result, on-chip interconnects and the memory system are emerging as major performance and energy-efficiency bottlenecks in servers. This thesis seeks to architect on-chip interconnects and memory systems that are tuned for the requirements of memory-centric scale-out servers. By studying a wide range of data-centric applications, we uncover application phenomena common in data-centric applications, and examine their implications on on-chip network and off-chip memory traffic. Finally, we propose specialized on-chip interconnects and memory systems that leverage common traffic characteristics, thereby improving server throughput and energy efficiency