280 research outputs found

    A high resolution data conversion and digital processing for high energy physics calorimeter detectors readout

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    L'abstract Ăš presente nell'allegato / the abstract is in the attachmen

    New Reprogrammable and Non-Volatile Radiation-Tolerant FPGA: RT ProASICÂź3

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    The Characterization of a CMOS Radiation Hardened-by-Design Circuit Technique

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    This thesis presents the analysis, implementation and testing of a circuit-level radiation hardened-by-design (RHBD) technique first presented in [1]. Radiation effects heavily influence the cost and design of electronics bound for radiation-rich environments such as in nuclear reactors or space. The circuit-level RHBD technique is presented as a cost-effective way to mitigate total-ionizing dose (TID) radiation in digital complementary metal-oxide-semiconductor (CMOS) transistor circuits. These claims are analyzed and experimentally tested. Devices from a relatively old and a newer semiconductor fabrication process are tested to investigate the impact of device scaling on the RHBD technique’s effectiveness. A rad-tolerant frequency synthesizer that implements this technique is discussed. Challenges in the project included implementing efficient testing procedures at the radiation test facilities. Testing time was limited and in-situ­ test methodologies utilizing LabView programs were used effectively

    High Voltage and Nanoscale CMOS Integrated Circuits for Particle Physics and Quantum Computing

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    A Phase-Locked Loop in High-Temperature Silicon Carbide and General Design Methods for Silicon Carbide Integrated Circuits

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    Silicon carbide (SiC) has long been considered for integrated circuits (ICs). It offers several advantages, including wider temperature range, larger critical electric field, and greater radiation immunity with respect to Silicon (Si). At the same time, it suffers from challenges in fabrication consistency and lower transconductance which the designer must overcome. One of the recent SiC IC processes developed is the Raytheon High-Temperature Silicon Carbide (HTSiC) complementary MOSFET process. This process is one of the first to offer P channel MOSFETs and, as a result, a greater variety of circuits can be built in it. The behavior of SiC MOSFETs has some important differences with Si MOSFETs. Models such as the Shichman-Hodges, EKV, and Short-channel models have been developed over time to address the important behaviors observed in Si MOSFETs, but none of these captures all of the important effects in SiC. In this work, an improved Shichman-Hodges model that incorporates the body-charge effect, mobility reduction, and a nonlinear channel modulation is developed for SiC CMOS IC devices. The importance of considering these effects is demonstrated with a simple design exercise. This dissertation also describes the design and testing of the first-ever phase-locked loop (PLL) in SiC. This PLL is suitable for use as a general circuit building block such as in a clock recovery circuit. The fabricated circuit operates between 600 kHz and 1.5 MHz, and at temperatures up to 300 ℃. Testing results also show that output jitter and locking are negatively impacted at higher temperatures, and an improved design is proposed and analyzed

    Radiation Tolerant Electronics, Volume II

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    Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects

    Study of Radiation Effects on 28nm UTBB FDSOI Technology

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    With the evolution of modern Complementary Metal-Oxide-Semiconductor (CMOS) technology, transistor feature size has been scaled down to nanometers. The scaling has resulted in tremendous advantages to the integrated circuits (ICs), such as higher speed, smaller circuit size, and lower operating voltage. However, it also creates some reliability concerns. In particular, small device dimensions and low operating voltages have caused nanoscale ICs to become highly sensitive to operational disturbances, such as signal coupling, supply and substrate noise, and single event effects (SEEs) caused by ionizing particles, like cosmic neutrons and alpha particles. SEEs found in ICs can introduce transient pulses in circuit nodes or data upsets in storage cells. In well-designed ICs, SEEs appear to be the most troublesome in a space environment or at high altitudes in terrestrial environment. Techniques from the manufacturing process level up to the system design level have been developed to mitigate radiation effects. Among them, silicon-on-insulator (SOI) technologies have proven to be an effective approach to reduce single-event effects in ICs. So far, 28nm ultra-thin body and buried oxide (UTBB) Fully Depleted SOI (FDSOI) by STMicroelectronics is one of the most advanced SOI technologies in commercial applications. Its resilience to radiation effects has not been fully explored and it is of prevalent interest in the radiation effects community. Therefore, two test chips, namely ST1 and AR0, were designed and tested to study SEEs in logic circuits fabricated with this technology. The ST1 test chip was designed to evaluate SET pulse widths in logic gates. Three kinds of the on-chip pulse-width measurement detectors, namely the Vernier detector, the Pulse Capture detector and the Pulse Filter detector, were implemented in the ST1 chip. Moreover, a Circuit for Radiation Effects Self-Test (CREST) chain with combinational logic was designed to study both SET and SEU effects. The ST1 chip was tested using a heavy ion irradiation beam source in Radiation Effects Facility (RADEF), Finland. The experiment results showed that the cross-section of the 28nm UTBB-FDSOI technology is two orders lower than its bulk competitors. Laser tests were also applied to this chip to research the pulse distortion effects and the relationship between SET, SEU and the clock frequency. Total Ionizing Dose experiments were carried out at the University of Saskatchewan and European Space Agency with Co-60 gammacell radiation sources. The test results showed the devices implemented in the 28nm UTBB-FDSOI technology can maintain its functionality up to 1 Mrad(Si). In the AR0 chip, we designed five ARM Cortex-M0 cores with different logic protection levels to investigate the performance of approximate logic protecting methods. There are three custom-designed SRAM blocks in the test chip, which can also be used to measure the SEU rate. From the simulation result, we concluded that the approximate logic methodology can protect the digital logic efficiently. This research comprehensively evaluates the radiation effects in the 28nm UTBB-FDSOI technology, which provides the baseline for later radiation-hardened system designs in this technology

    Performance studies of the CMS strip tracker before installation

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    Post-silicon Validation of Radiation Hardened Microprocessor and SRAM arrays

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    abstract: Digital systems are increasingly pervading in the everyday lives of humans. The security of these systems is a concern due to the sensitive data stored in them. The physically unclonable function (PUF) implemented on hardware provides a way to protect these systems. Static random-access memories (SRAMs) are designed and used as a strong PUF to generate random numbers unique to the manufactured integrated circuit (IC). Digital systems are important to the technological improvements in space exploration. Space exploration requires radiation hardened microprocessors which minimize the functional disruptions in the presence of radiation. The design highly efficient radiation-hardened microprocessor for enabling spacecraft (HERMES) is a radiation-hardened microprocessor with performance comparable to the commercially available designs. These designs are manufactured using a foundry complementary metal-oxide semiconductor (CMOS) 55-nm triple-well process. This thesis presents the post silicon validation results of the HERMES and the PUF mode of SRAM across process corners. Chapter 1 gives an overview of the blocks implemented on the test chip 25. It also talks about the pre-silicon functional verification methodology used for the test chip. Chapter 2 discusses about the post silicon testing setup of test chip 25 and the validation of the setup. Chapter 3 describes the architecture and the test bench of the HERMES along with its testing results. Chapter 4 discusses the test bench and the perl scripts used to test the SRAM along with its testing results. Chapter 5 gives a summary of the post-silicon validation results of the HERMES and the PUF mode of SRAM.Dissertation/ThesisMasters Thesis Electrical Engineering 201

    Fault tolerant design implementation on radiation hardened by design SRAM-Based FPGAs

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    Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Aeronautics and Astronautics, 2013.This electronic version was submitted and approved by the author's academic department as part of an electronic thesis pilot project. The certified thesis is available in the Institute Archives and Special Collections."June 2013." Cataloged from department-submitted PDF version of thesisIncludes bibliographical references (p. 197-204).SRAM-based FPGAs are highly attractive for space applications due to their in-flight reconfigurability, decreased development time and cost, and increased design and testing flexibility. The Xilinx Virtex-5QV is the first commercially available Radiation Hardened By Design (RHBD) SRAM-based FPGA; however, not all of its internal components are hardened against radiation-induced errors. This thesis examines and quantifies the additional considerations and techniques designers should employ with a RHBD SRAM-based FPGA in a space-based processing system to achieve high operational reliability. Additionally, this work presents the application of some of these techniques to the embedded avionics design of the REXIS imaging payload on the OSIRIS-REx asteroid sample return mission.by Frank Hall Schmidt, Jr.S.M
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