Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors.

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach

Manufacturing flexible light-emitting polymer displays with conductive lithographic film technology

We report on a new low-cost manufacturing process for flexible displays that has the potential to rapidly expand the market into areas that have traditionally been outside the scope of such technology. In this paper we consider the feasibility of using offset-lithography to deposit contacts for polymer light-emitting displays. We compare and contrast manufacturing criteria and present a case study detailing our initial results. It is expected that these developments will stimulate further progress in multilayer device fabrication. Cheap, flexible conductive interconnects have the potential to find applications in a wide variety of device structures. For the more challenging exploitation areas in multilayer devices, such as displays, it was found that the properties of conductive lithographic films were not optimal in their current form. Three parameters (conductivity, surface roughness and surface work function) were identified as critical to device fabrication. Calendering and electroless plating were investigated as methods to improve these properties. Both methods aimed to modify the surface roughness and conductivity, with the plating study also modifying the work function

Mid-infrared resonant ablation for selective patterning of thin organic films

The fast growing market of organic electronics, including organic photovoltaics (OPV), stimulates the development of versatile technologies for structuring thin-film materials. Ultraviolet lasers have proven their full potential for patterning single organic layers, but in a multilayer organic device the obtained layer selectivity is limited as all organic layers show high UV absorption. In this paper, we introduce mid-infrared (IR) resonant ablation as an alternative approach, in which a short pulse mid-infrared laser can be wavelength tuned to one of the molecular vibrational transitions of the organic material to be ablated. As a result, the technique is selective in respect of processing a diversity of organics, which usually have different infrared absorption bands. Mid-IR resonant ablation is demonstrated for a variety of organic thin films, employing both nanosecond (15 ns) and picosecond (250 ps) laser pulses tunable between 3 and 4 microns. The nanosecond experimental set-up is based on a commercial laser at 1064 nm pumping a singly resonant Optical Parametric Oscillator (OPO) built around a Periodically-Poled Lithium Niobate (PPLN) crystal with several Quasi-Phase Matching (QPM) periods, delivering more than 0.3 W of mid-IR power, corresponding to 15 mu J pulses. The picosecond laser set-up is based on Optical Parametric Amplification (OPA) in a similar crystal, allowing for a comparison between both pulse length regimes. The wavelength of the mid-infrared laser can be tuned to one of the molecular vibrational transitions of the organic material to be ablated. For that reason, the IR absorption spectra of the organic materials used in a typical OPV device were characterized in the wavelength region that can be reached by the laser setups. Focus was on OPV substrate materials, transparent conductive materials, hole transport materials, and absorber materials. The process has been successfully demonstrated for selective thin film patterning, and the influence of the various laser parameters is discussed

Towards flexible asymmetric MSM structures using Si microwires through contact printing

This paper presents development of flexible metal-semiconductor-metal devices using silicon (Si) microwires. Monocrystalline Si in the shape of microwires are used which are developed through standard photolithography and etching. These microwires are assembled on secondary flexible substrates through a dry transfer printing by using a polydimethylsiloxane stamp. The conductive patterns on Si microwires are printed using a colloidal silver nanoparticles based solution and an organic conductor i.e. poly (3,4-ethylene dioxthiophene) doped with poly (styrene sulfonate). A custom developed spray coating technique is used for conductive patterns on Si microwires. A comparative study of the current–voltage (I–V) responses is carried out in flat and bent orientations as well as the response to the light illumination of the wires is explored. Current variations as high as 17.1 μA are recorded going from flat to bend conditions, while the highest I on/I off ratio i.e. 43.8 is achieved with light illuminations. The abrupt changes in the current response due to light-on/off conditions validates these devices for fast flexible photodetector switches. These devices are also evaluated based on transfer procedure i.e. flip-over and stamp-assisted transfer printing for manipulating Si microwires and their subsequent post-processing. These new developments were made to study the most feasible approach for transfer printing of Si microwires and to harvest their capabilities such as photodetection and several other applications in the shape of metal-semiconductor-metal structures

Spiers Memorial Lecture: Molecular mechanics and molecular electronics

We describe our research into building integrated molecular electronics circuitry for a diverse set of functions, and with a focus on the fundamental scientific issues that surround this project. In particular, we discuss experiments aimed at understanding the function of bistable [2]rotaxane molecular electronic switches by correlating the switching kinetics and ground state thermodynamic properties of those switches in various environments, ranging from the solution phase to a Langmuir monolayer of the switching molecules sandwiched between two electrodes. We discuss various devices, low bit-density memory circuits, and ultra-high density memory circuits that utilize the electrochemical switching characteristics of these molecules in conjunction with novel patterning methods. We also discuss interconnect schemes that are capable of bridging the micrometre to submicrometre length scales of conventional patterning approaches to the near-molecular length scales of the ultra-dense memory circuits. Finally, we discuss some of the challenges associated with fabricated ultra-dense molecular electronic integrated circuits

Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays

Penetrating neural probe arrays are powerful bio-integrated devices for studying basic neuroscience and applied neurophysiology, underlying neurological disorders, and understanding and regulating animal and human behavior. This paper presents a penetrating microprobe array constructed in thin and flexible fashion, which can be seamlessly integrated with the soft curvy substances. The function of the microprobes is enabled by transfer printed ultra-thin Si optoelectronics. As a proof-of-concept device, microprobe array with Si photodetector arrays are demonstrated and their capability of mapping the photo intensity in space are illustrated. The design strategies of utilizing thin polyimide based microprobes and supporting substrate, and employing the heterogeneously integrated thin optoelectronics are keys to accomplish such a device. The experimental and theoretical investigations illustrate the materials, manufacturing, mechanical and optoelectronic aspects of the device. While this paper primarily focuses on the device platform development, the associated materials, manufacturing technologies, and device design strategy are applicable to more complex and multi-functionalities in penetrating probe array-based neural interfaces and can also find potential utilities in a wide range of bio-integrated systems

Excimer laser processing of inkjet-printed and sputter-deposited transparent conducting SnO2:Sb for flexible electronics

The feasibility of low-temperature fabrication of transparent electrode elements from thin films of antimony-doped tin oxide (SnO2:Sb, ATO) has been investigated via inkjet printing, rf magnetron sputtering and post-deposition excimer laser processing. Laser processing of thin films on both glass and plastic substrates was performed using a Lambda Physik 305i excimer laser, with fluences in the range 20–100 mJ cm− 2 reducing sheet resistance from as-deposited values by up to 3 orders of magnitude. This is consistent with TEM analysis of the films that shows a densification of the upper 200 nm of laser-processed regions

A simple and versatile micro contact printing method for generating carbon nanotubes patterns on various substrates

We present an optimized process for generating at low cost, patterns of carbon nanotubes (CNTs) on a large variety of substrates through a simple micro contact printing method. This method meets the requirements for the integration of CNTs into microdevices, for applications in microelectronics (interconnects), flexible electronics (printed conductive electrodes) and biodevices (biosensors and biosystems for regenerative medicine). We have optimized a new method for inking PolyDiMethylSiloxane (PDMS) stamps with CNTs that turned out to improve significantly the quality of the printed features over large surfaces. This inking step is performed by adapting a spray-coating process leading to a dense and homogeneous coating of the stamp with a thin layer of CNTs. The printing step is performed using a solvent mediation, allowing us to pattern this thin layer of CNTs onto various substrates by contact through a thin film of liquid. We demonstrate that this soft and rapid methodology can lead to the realization of CNTs patterns with versatile geometries onto various substrates at the micron scale. Examples of applications for CNTs interconnects and flexible electronics are rapidly shown